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TI-LMK1C1104.pdf
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TI-LMK1C1104.pdf
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LMK1C110x 1.8V、2.5V 和 3.3V LVCMOS 时钟缓冲器系列
1 特性
• 高性能 1:2、1:3 或 1:4 LVCMOS 时钟缓冲器
• 输出偏斜极低,< 50ps
• 附加抖动极低,最大值 < 50fs
– V
DD
= 3.3V 时,典型值为 7.5fs
– V
DD
= 2.5V 时,典型值为 10fs
– V
DD
= 1.8V 时,典型值为 19.2fs
• 传播延迟极低,< 3ns
• 同步输出使能
• 电源电压:3.3V、2.5V 或 1.8V
– 在电源电压范围内输入端耐受 3.3V 电压
• f
max
= 250MHz (3.3V)
f
max
= 200MHz(2.5V 和 1.8V)
• 工作温度范围:–40°C 至 125°C
• 采用 8 引脚 TSSOP 封装
• 采用 8 引脚 WSON 封装
2 应用
• 工厂自动化与控制
• 电信设备
• 数据中心和企业计算
• 电网基础设施
• 电机驱动器
• 医疗成像
3 说明
LMK1C110x 是德州仪器 (TI) 的一款模块化、高性能、
低偏斜、通用时钟缓冲器系列器件。
整个系列采用模块化方法设计。提供三个不同的扇出选
项:1:2、1:3、1:4。
该系列所有器件均互相引脚兼容,并与 CDCLVC110x
系列向后兼容,从而易于处理。
该系列所有器件均具有相同的高性能特性,如低附加抖
动、低偏斜和宽工作温度范围。
LMK1C110x 具有同步输出使能控制端 (1G),可在 1G
处于低电平时将输出切换为低电平状态。
LMK1C110x 系列可在 1.8V、2.5V 和 3.3V 电压下工
作,额定工作温度范围为 –40°C 至 125°C。
器件信息
(1)
器件型号 封装
封装尺寸(标称值)
LMK1C1102
TSSOP (8) 3.00mm × 4.40mmLMK1C1103
LMK1C1104
LMK1C1102
WSON (8) 2.00mm x 2.00mm
LMK1C1104
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
。
LVCMOSLVCMOS
LVCMOS
LVCMOS
LVCMOS
CLKIN
1G
Y0
Y1
Y2
Y3
功能方框图
LMK1C1102, LMK1C1103, LMK1C1104
ZHCSKK6C – DECEMBER 2019 – REVISED JUNE 2021
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNAS791
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device Comparison......................................................... 3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings ....................................... 5
7.2 ESD Ratings .............................................................. 5
7.3 Recommended Operating Conditions ........................5
7.4 Thermal Information ...................................................5
7.5 Electrical Characteristics ............................................6
7.6 Timing Requirements .................................................7
7.7 Typical Characteristics................................................ 7
8 Detailed Description......................................................10
8.1 Overview................................................................... 10
8.2 Functional Block Diagram......................................... 10
8.3 Feature Description...................................................10
8.4 Device Functional Modes..........................................10
9 Application and Implementation.................................. 11
9.1 Application Information..............................................11
9.2 Typical Application.................................................... 11
10 Power Supply Recommendations..............................13
11 Layout........................................................................... 14
11.1 Layout Guidelines................................................... 14
11.2 Layout Example...................................................... 14
12 Device and Documentation Support..........................15
12.1 接收文档更新通知................................................... 15
12.2 支持资源..................................................................15
12.3 Trademarks.............................................................15
12.4 Electrostatic Discharge Caution..............................15
12.5 术语表..................................................................... 15
13 Mechanical, Packaging, and Orderable
Information.................................................................... 15
4 Revision History
Changes from Revision B (June 2020) to Revision C (June 2021) Page
• 更改了整个文档中的表、图和交叉参考的文本格式和编号格式...........................................................................1
• 增加了 LMK1C1102/04 DQF (WSON) 封装........................................................................................................1
• Added the Device Comparison table.................................................................................................................. 3
• Added pinout diagrams for the DQF (WSON) package variant of the LMK1C1102 and LMK1C1104................3
• Added information pertaining to the layout of LMK1C1102/04 WSON package variant...................................14
• Removed Related Links section....................................................................................................................... 15
Changes from Revision A (February 2020) to Revision B (June 2020) Page
• 向
说明
部分添加了扇出选项信息........................................................................................................................ 1
• 从第一页中删除 LMK1C1104PW 引脚排列.........................................................................................................1
• Added LMK1C1102 and LMK1C1103 pinout diagrams...................................................................................... 3
Changes from Revision * (December 2019) to Revision A (February 2020) Page
• 向数据表添加了 LMK1C1102 和 LMK1C1103.....................................................................................................1
• Changed the Power Supply Recommendations section...................................................................................13
LMK1C1102, LMK1C1103, LMK1C1104
ZHCSKK6C – DECEMBER 2019 – REVISED JUNE 2021
www.ti.com.cn
2 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: LMK1C1102 LMK1C1103 LMK1C1104
5 Device Comparison
表 5-1. Device Comparison
DEVICE NUMBER OF OUTPUTS PACKAGE
LMK1C1102 2
TSSOP (8), 3.00 mm x 4.40 mmLMK1C1103 3
LMK1C1104 4
LMK1C1106 6 TSSOP (14), 5.00 mm x 4.40 mm
LMK1C1108 8 TSSOP (16), 5.00 mm x 4.40 mm
LMK1C1102 2
WSON (8), 2.00 mm x 2.00 mm
LMK1C1104 4
6 Pin Configuration and Functions
1CLKIN 8 Y1
21G 7 NC
3Y0 6 VDD
4GND 5 NC
Not to scale
图 6-1. LMK1C1102 PW Package 8-Pin TSSOP Top
View
1CLKIN
8
Y1
21G
7
NC
3
Y0
6 VDD
4
GND
5
NC
Not to scale
1. The DQF (WSON) package is equivalent to the DFN
package of other vendors.
图 6-2. LMK1C1102 DQF Package 8-Pin WSON Top
View
1CLKIN 8 Y1
21G 7 NC
3Y0 6 VDD
4GND 5 Y2
Not to scale
图 6-3. LMK1C1103 PW Package 8-Pin TSSOP Top
View
1CLKIN 8 Y1
21G 7 Y3
3Y0 6 VDD
4GND 5 Y2
Not to scale
图 6-4. LMK1C1104 PW Package 8-Pin TSSOP Top
View
1CLKIN
8
Y1
21G
7
Y3
3
Y0
6 VDD
4
GND 5
Y2
Not to scale
1. The DQF (WSON) package is equivalent to the DFN package of other vendors.
图 6-5. LMK1C1104 DQF Package 8-Pin WSON Top View
www.ti.com.cn
LMK1C1102, LMK1C1103, LMK1C1104
ZHCSKK6C – DECEMBER 2019 – REVISED JUNE 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: LMK1C1102 LMK1C1103 LMK1C1104
表 6-1. Pin Functions
PIN
TYPE DESCRIPTION
NAME
LMK1C
1102
LMK1C
1103
LMK1C
1104
LVCMOS CLOCK INPUT
CLKIN 1 1 1 Input
Single-ended clock input with internal 300-kΩ (typical) pulldown
resistor to GND. Typically connected to a single-ended clock input.
CLOCK OUTPUT ENABLE
1G 2 2 2 Input
Global Output Enable with internal 300-kΩ (typical) pulldown resistor to
GND. Typically connected to VDD with external pullup resistor.
HIGH: outputs enabled
LOW: outputs disabled
LVCMOS CLOCK OUTPUT
Y0 3 3 3
Output
LVCMOS output. Typically connected to a receiver. Unused outputs
can be left floating.
Y1 8 8 8
Y2
—
5 5
Y3
— —
7
SUPPLY VOLTAGE
VDD 6 6 6 Power
Power supply terminal. Typically connected to a 3.3-V, 2.5-V, or 1.8-V
supply. The VDD pin is typically connected to an external 0.1-μF
capacitor near the pin.
GROUND
GND 4 4 4 GND Power supply ground.
LMK1C1102, LMK1C1103, LMK1C1104
ZHCSKK6C – DECEMBER 2019 – REVISED JUNE 2021
www.ti.com.cn
4 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: LMK1C1102 LMK1C1103 LMK1C1104
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
DD
Supply voltage
–0.5
3.6
V
V
CLKIN
Input voltage (CLKIN)
V
IN
Input voltage (1G)
V
Yn
Output pins (Yn)
–0.5
V
DD
+ 0.3
I
IN
Input current
–20
20 mA
I
O
Continuous output current
–50
50 mA
T
stg
Storage temperature
–65
150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins
(1)
±9000
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins
(2)
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
DD
Core supply voltage
3.3-V supply 3.135 3.3 3.465
V2.5-V supply 2.375 2.5 2.625
1.8-V supply 1.71 1.8 1.89
T
A
Operating free-air temperature
–40
125 °C
T
J
Operating junction temperature
–40
150 °C
7.4 Thermal Information
THERMAL METRIC
(1)
LMK1C1104
UNITDQF (WSON) PW (TSSOP)
8 PINS 8 PINS
R
qJA
Junction-to-ambient thermal resistance 163 181.9 °C/W
R
qJC(top)
Junction-to-case (top) thermal resistance 105.7 76.6 °C/W
R
qJB
Junction-to-board thermal resistance 84.2 111.6 °C/W
Y
JT
Junction-to-top characterization parameter 16.7 16 °C/W
Y
JB
Junction-to-board characterization parameter 83.9 110.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
www.ti.com.cn
LMK1C1102, LMK1C1103, LMK1C1104
ZHCSKK6C – DECEMBER 2019 – REVISED JUNE 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: LMK1C1102 LMK1C1103 LMK1C1104
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