Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings—JEDEC Specification...........................5
7.3 ESD Ratings—IEC Specification................................ 5
7.4 Recommended Operating Conditions.........................5
7.5 Thermal Information....................................................6
7.6 Electrical Characteristics.............................................6
7.7 Timing Requirements..................................................8
7.8 Typical Characteristics................................................ 9
8 Detailed Description......................................................14
8.1 Overview................................................................... 14
8.2 Functional Block Diagram......................................... 14
8.3 Feature Description...................................................15
8.4 Device Functional Modes..........................................17
9 Application and Implementation.................................. 18
9.1 Application Information............................................. 18
9.2 Typical Application.................................................... 18
10 Power Supply Recommendations..............................23
11 Layout........................................................................... 24
11.1 Layout Guidelines................................................... 24
11.2 Layout Example...................................................... 24
12 Device and Documentation Support..........................25
12.1 Documentation Support.......................................... 25
12.2 接收文档更新通知................................................... 25
12.3 支持资源..................................................................25
12.4 Trademarks.............................................................25
12.5 静电放电警告.......................................................... 25
12.6 术语表..................................................................... 25
13 Mechanical, Packaging, and Orderable
Information.................................................................... 25
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
Changes from Revision B (August 2020) to Revision C (February 2021) Page
• 添加了 A 版本器件.............................................................................................................................................. 1
• Added A version of the device............................................................................................................................ 3
• Added A version of the device to Absolute Maximum Ratings table.................................................................. 5
• Added A version to ESD Ratings—IEC Specification table................................................................................ 5
• Added A version to Recommended Operating Conditions table........................................................................ 5
• Added A version to Electrical Characteristics table............................................................................................ 6
• Added A version of the device to Detailed Description section........................................................................ 16
Changes from Revision A (April 2020) to Revision B (August 2020) Page
• 更新了整个文档中的表格、图和交叉参考的编号格式......................................................................................... 1
• Added I
O
row in Absolute Maximum Ratings table............................................................................................. 5
• Deleted 1.2 A spec from Recommended Operating Conditions table................................................................ 5
• Updated I
VCONN
max current to 400 mA in Recommended Operating Conditions table.................................... 5
• Added table note to Recommended Operating Conditions table........................................................................5
• Updated 图 7-3 caption to 24 V.......................................................................................................................... 9
• Updated 图 7-4 caption to 24 V.......................................................................................................................... 9
• Updated 图 7-17 caption to 24 V........................................................................................................................ 9
• Updated 图 7-18 caption to 24 V........................................................................................................................ 9
• Updated 图 7-17 ................................................................................................................................................ 9
• Updated 图 7-18 ................................................................................................................................................ 9
Changes from Revision * (December 2019) to Revision A (September 2020) Page
• 更新了附带链接的应用 部分................................................................................................................................1
• 将封装类型名称从 WCSP 更改为 DSBGA;全局更改........................................................................................1
TPD4S311, TPD4S311A
ZHCSLP7C – DECEMBER 2019 – REVISED FEBRUARY 2021
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Product Folder Links: TPD4S311 TPD4S311A
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