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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SNVSAX4

LM1086-MIL

ZHCSGG4 –JUNE 2017

LM1086-MIL 1.5A 低低压压降降正正电电压压稳稳压压器器

1 特特性性

• 可提供固定的 1.8V、2.5V、3.3V、5V 版本

• 提供可调节版本

• 电流限制和热保护

• 2% 输出精度

• 输出电流 1.5A

• 线路调节 0.015%（典型值）

• 负载调节 0.1%（典型值）

• 高达 29V 的最大输入电压

• 低至 1.25V 的

最低可调节输出电压

• 与具有 ESR 的陶瓷输出电容器一起工作时保持稳

定

• 温度范围：–40°C 至 +125°C

2 应应用用

• 高效线性稳压器

• 电池充电器

• 开关电源的后置稳压

• 恒定电流调节器

• 微处理器电源

• 音频放大器电源

• 火警控制

3 说说明明

LM1086-MIL 是一款稳压器，在负载电流为 1.5A 时具

有 1.5V 的最大压降。该器件具有与德州仪器 (TI) 行业

标准 LM317 相同的引脚。

需要两个电阻来设置 LM1086-MIL 的可调节输出电压

版本的输出电压。固定输出电压版本集成了调节电阻

器。通常，除非器件距离输入滤波电容器超过 6 英

寸，否则不需要输入电容器。输出电容器可以替换为陶

瓷和适当的 ESR。

LM1086-MIL 电路包括齐纳微调带隙参考、电流限制和

热关断。由于 LM1086-MIL 稳压器是浮动的并且仅检

测输入到输出差分电压，因此，只要不超过最大输入到

输出差分电压，就可以调节几百伏特的电源电压。超过

最大输入到输出差分电压将导致输出短路。通过在调节

引脚和输出端之间连接固定电阻器，LM1086-MIL 也可

用作精密电流调节器。

对于需要更大的输出电流的应用，请参阅 LM1084

（对于 5A 版本）和 LM1085（对于 3A 版本）。

器器件件信信息息

(1)

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

LM1086-MIL

WSON (8) 4.00mm x 4.00mm

DDPAK/TO-263 (3) 10.18mm × 8.41mm

TO-220 (3) 14.986mm × 10.16mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

典典型型应应用用

LM1086-MIL

ZHCSGG4 –JUNE 2017

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用.......................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings ............................................................ 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics........................................... 5

6.6 Typical Characteristics.............................................. 7

7 Detailed Description.............................................. 9

7.1 Overview ................................................................... 9

7.2 Functional Block Diagram ......................................... 9

7.3 Feature Description................................................. 10

7.4 Device Functional Modes........................................ 11

8 Application and Implementation ........................ 13

8.1 Application Information............................................ 13

8.2 Typical Applications ................................................ 13

8.3 Other Applications................................................... 14

9 Power Supply Recommendations...................... 18

10 Layout................................................................... 18

10.1 Layout Guidelines ................................................. 18

10.2 Layout Example .................................................... 18

10.3 Thermal Considerations........................................ 19

11 器器件件和和文文档档支支持持 ..................................................... 21

11.1 文档支持................................................................ 21

11.2 接收文档更新通知 ................................................. 21

11.3 社区资源................................................................ 21

11.4 商标 ....................................................................... 21

11.5 静电放电警告......................................................... 21

11.6 Glossary................................................................ 21

12 机机械械、、封封装装和和可可订订购购信信息息....................................... 21

4 修修订订历历史史记记录录

注：之前版本的页码可能与当前版本有所不同。

日日期期修修订订版版本本注注意意

2017 年 6 月 * 最初发布版本

LM1086-MIL

ZHCSGG4 –JUNE 2017

www.ti.com.cn

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application and Implementation. The

value R

θJA

for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For

improved thermal resistance and power dissipation for the WSON package, refer to AN-1187 Leadless Leadframe Package (LLP)

(4) The maximum power dissipation is a function of T

J(MAX)

, R

θJA

, and T

. The maximum allowable power dissipation at any ambient

temperature is P

= (T

J(MAX)

– T

) / R

θJA

. All numbers apply for packages soldered directly into a PC board. Refer to Thermal

Considerations.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)(2)

MIN MAX UNIT

Maximum input-to-output voltage differential

LM1086-MIL-ADJ 29 V

LM1086-MIL-1.8 27 V

LM1086-MIL-2.5 27 V

LM1086-MIL-3.3 27 V

LM1086-MIL-5 25 V

Power dissipation

(3)

Internally Limited

Junction temperature (T

)

(4)

150 °C

Storage temperature, T

stg

–65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±2000 V

(1) The maximum power dissipation is a function of T

J(MAX)

, R

θJA

, and T

. The maximum allowable power dissipation at any ambient

temperature is P

= (T

J(MAX)

– T

) / R

θJA

. All numbers apply for packages soldered directly into a PC board. Refer to Thermal

Considerations.

6.3 Recommended Operating Conditions

MIN MAX UNIT

JUNCTION TEMPERATURE RANGE (T

)

(1)

C grade

Control section 0 125 °C

Output section 0 150 °C

I grade

Control section −40 125 °C

Output section −40 150 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC

(1)

LM1086-MIL

UNITKTT NDE NGN

3 PINS 3 PINS 8 PINS

θJA

Junction-to-ambient thermal resistance 40.8 23.0 35.9 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 42.3 16.1 24.2 °C/W

θJB

Junction-to-board thermal resistance 23.3 4.5 13.2 °C/W

Junction-to-top characterization parameter 10.2 2.4 0.2 °C/W

Junction-to-board characterization parameter 22.3 2.5 13.3 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance: control

section/output section

1.5/4 1.5/4 2.9 °C/W

LM1086-MIL

www.ti.com.cn

ZHCSGG4 –JUNE 2017

(1) All limits are specified by testing or statistical analysis.

(2) Typical values represent the most likely parametric norm.

(3) I

FULL LOAD

is defined in the current limit curves. The I

FULL LOAD

Curve defines current limit as a function of input-to-output voltage. Note

that 15 W power dissipation for the LM1086-MIL is only achievable over a limited range of input-to-output voltage.

(4) Load and line regulation are measured at constant junction temperature, and are specified up to the maximum power dissipation of 15

W. Power dissipation is determined by the input/output differential and the output current. Ensured maximum power dissipation will not

be available over the full input/output range.

6.5 Electrical Characteristics

Typicals and limits appearing in normal type apply for T

= 25°C unless specified otherwise.

PARAMETER TEST CONDITIONS

= 25°C

over the entire range for

operation (see Recommended

Operating Conditions)

UNIT

MIN TYP MAX MIN

(1)

TYP

(2)

MAX

(1)

REF

Reference

voltage

LM1086-MIL-ADJ, I

OUT

= 10 mA,

− V

OUT

= 3 V, 10 mA ≤ I

OUT

≤

FULL LOAD

, 1.5 V ≤ V

− V

OUT

≤

15 V

(3)

1.238 1.25 1.262 1.225 1.250 1.27 V

OUT

Output

voltage

(3)

LM1086-MIL-1.8, I

OUT

= 0 mA,

= 5 V, 0 ≤ I

OUT

≤ I

FULL LOAD

3.3 V ≤ V

≤ 18 V

1.782 1.8 1.818 1.764 1.8 1.836 V

LM1086-MIL-2.5, I

OUT

= 0 mA,

= 5 V, 0 ≤ I

OUT

≤ I

FULL LOAD

4.0 V ≤ V

≤ 18 V

2.475 2.5 2.525 2.450 2.5 2.55 V

LM1086-MIL-3.3, I

OUT

= 0 mA,

= 5 V, 0 ≤ I

OUT

≤ I

FULL LOAD

4.75 V ≤ V

≤ 18 V

3.267 3.3 3.333 3.235 3.3 3.365 V

LM1086-MIL-5, I

OUT

= 0 mA, V

= 8 V, 0 ≤ I

OUT

≤ I

FULL LOAD

, 6.5 V

≤ V

≤ 20 V

4.950 5 5.05 4.9 5 5.1 V

ΔV

OUT

Line

regulation

(4)

LM1086-MIL-ADJ, I

OUT

=10 mA,

1.5 V ≤ (V

- V

OUT

) ≤ 15 V

0.015% 0.2% 0.035% 0.2%

LM1086-MIL-1.8, I

OUT

= 0 mA,

3.3 V ≤ V

≤ 18 V

0.3 6 0.6 6 mV

LM1086-MIL-2.5, I

OUT

= 0 mA,

4.0 V ≤ V

≤ 18 V

0.3 6 0.6 6 mV

LM1086-MIL-3.3, I

OUT

= 0 mA,

4.5 V ≤ V

≤ 18 V

0.5 10 1 10 mV

LM1086-MIL-5, I

OUT

= 0 mA, 6.5

V ≤ V

≤ 20 V

0.5 10 1 10 mV

剩余22页未读，继续阅读

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