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Input

Mux

3rdOrder

Modulator

REFP REFN

PGA

Burnout

Detect

Burnout

Detect

DVDD

DGND

ADS1146

AVSS

AIN0

AIN1

SCLK

DIN

DRDY

DOUT/DRDY

START

RESET

AVDD

InternalOscillator

Adjustable

Digital

Filter

Serial

Interface

and

Control

CLK

Input

Mux

3rdOrder

Modulator

REFP1 REFN1 VREFOUT VREFCOM

REFP0/

GPIO0

REFN0/

GPIO1

Burnout

Detect

Burnout

Detect

DVDD

DGND

IEXC1AVSS

AIN0/IEXC

AIN1/IEXC

AIN2/IEXC/GPIO2

AIN3/IEXC/GPIO3

AIN4/IEXC/GPIO4

AIN5/IEXC/GPIO5

AIN6/IEXC/GPIO6

AIN7/IEXC/GPIO7

ADS1148 Only

SCLK

DIN

DRDY

DOUT/DRDY

START

RESET

AVDD

IEXC2

InternalOscillator

Voltage

Reference

Serial

Interface

and

Control

BIAS

GPIO

CLK

ADS1148 Only

ADS1147

ADS1148

PGA

System

Monitor

Adjustable

Digital

Filter

Dual

Current

DACs

VREFMux

ADS1148 Only

BIAS

ADS1146

ADS1147

ADS1148

www.ti.com

SBAS453F –JULY 2009–REVISED APRIL 2012

16-Bit Analog-to-Digital Converters for Temperature Sensors

Check for Samples: ADS1146, ADS1147, ADS1148

FEATURES

DESCRIPTION

The ADS1146, ADS1147, and ADS1148 are highly-

• 16 Bits, No Missing Codes

integrated, precision, 16-bit analog-to-digital

• Data Output Rates Up to 2kSPS

converters (ADCs). The ADS1146/7/8 feature an

• Single-Cycle Settling for All Data Rates

onboard, low-noise, programmable gain amplifier

(PGA), a precision delta-sigma ADC with a single-

• Simultaneous 50/60Hz Rejection at 20SPS

cycle settling digital filter, and an internal oscillator.

• 4 Differential/7 Single-Ended Inputs (ADS1148)

The ADS1147 and ADS1148 also provide a built-in

• 2 Differential/3 Single-Ended Inputs (ADS1147)

voltage reference with 10mA output capacity, and two

matched programmable current digital-to-analog

• Matched Current Source DACs

converters (DACs). The ADS1146/7/8 provide a

• Internal Voltage Reference

complete front-end solution for temperature sensor

• Sensor Burnout Detection

applications including thermal couples, thermistors,

and resistance temperature detectors (RTDs).

• 4/8 General-Purpose I/Os (ADS1147/8)

• Internal Temperature Sensor

An input multiplexer supports four differential inputs

for the ADS1148, two for the ADS1147, and one for

• Power Supply and V

REF

Monitoring

the ADS1146. In addition, the multiplexer has a

(ADS1147/8)

sensor burnout detect, voltage bias for

• Self and System Calibration

thermocouples, system monitoring, and general-

• SPI™-Compatible Serial Interface

purpose digital I/Os (ADS1147 and ADS1148). The

onboard, low-noise PGA provides selectable gains of

• Analog Supply Operation:

1 to 128. The delta-sigma modulator and adjustable

+2.7V to +5.25V Unipolar, ±2.5V Bipolar

digital filter settle in only one cycle, for fast channel

• Digital Supply: +2.7V to +5.25V

cycling when using the input multiplexer, and support

• Operating Temperature –40°C to +125°C

data rates up to 2kSPS. For data rates of 20SPS or

less, both 50Hz and 60Hz interference are rejected

by the filter.

APPLICATIONS

• Temperature Measurement

The ADS1146 is offered in a small TSSOP-16

package, the ADS1147 is available in a TSSOP-20

– RTDs, Thermocouples, and Thermistors

package, and the ADS1148 is available in TSSOP-28

• Pressure Measurement

and QFN-32 packages. All three devices operate over

• Industrial Process Control

the extended specified temperature range of –40°C to

+105°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2SPI is a trademark of Motorola, Inc.

3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

ADS1146

ADS1147

ADS1148

SBAS453F –JULY 2009–REVISED APRIL 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION

(1)

DUAL SENSOR

EXCITATION

NUMBER OF VOLTAGE CURRENT PACKAGE-

PRODUCT RESOLUTION INPUTS REFERENCE SOURCES LEAD

1 Differential

ADS1246 24 bits or External NO TSSOP-16

1 Single-Ended

2 Differential

ADS1247 24 bits or Internal or External YES TSSOP-20

3 Single-Ended

4 Differential

ADS1248 24 bits or Internal or External YES TSSOP-28

7 Single-Ended

1 Differential

ADS1146 16 bits or External NO TSSOP-16

1 Single-Ended

2 Differential

ADS1147 16 bits or Internal or External YES TSSOP-20

3 Single-Ended

4 Differential

16 bits or Internal or External YES TSSOP-28

7 Single-Ended

ADS1148

4 Differential

16 bits or Internal or External YES QFN-32

7 Single-Ended

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder on www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

ADS1146, ADS1147, ADS1148 UNIT

AVDD to AVSS –0.3 to +5.5 V

AVSS to DGND –2.8 to +0.3 V

DVDD to DGND –0.3 to +5.5 V

100, momentary mA

Input current

10, continuous mA

Analog input voltage to AVSS AVSS – 0.3 to AVDD + 0.3 V

Digital input voltage to DGND –0.3 to DVDD + 0.3 V

Maximum junction temperature +150 °C

Operating temperature range –40 to +125 °C

Storage temperature range –60 to +150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-

maximum-rated conditions for extended periods may affect device reliability.

(V )(Gain)

AVSS 0.1V+ +

AVDD 0.1V- -

(V )(Gain)

ADS1146

ADS1147

ADS1148

www.ti.com

SBAS453F –JULY 2009–REVISED APRIL 2012

ELECTRICAL CHARACTERISTICS

Minimum/maximum specifications apply from –40°C to +105°C. Typical specifications are at +25°C. All specifications at

AVDD = +5V, DVDD = +3.3V, AVSS = DGND = 0V, V

REF

= +2.048V, and oscillator frequency = 4.096MHz, unless otherwise

noted.

ADS1146, ADS1147, ADS1148

PARAMETER CONDITIONS MIN TYP MAX UNIT

ANALOG INPUTS

Full-scale input voltage

±V

REF

/PGA

(1)

= ADCINP – ADCINN)

Common-mode input range V

Differential input current 100 pA

1, 2, 4, 8, 16, 32,

PGA gain settings

64, 128

Burnout current source 0.5, 2, or 10 μA

Bias voltage (AVDD + AVSS)/2 V

Bias voltage output impedance 400 Ω

SYSTEM PERFORMANCE

Resolution No missing codes 16 Bits

5, 10, 20, 40, 80,

Data rate 160, 320, 640, SPS

1000, 2000

Integral nonlinearity (INL) Differential input, end point fit, PGA = 1 ±0.5 ±1 LSB

Offset error After calibration 1 LSB

PGA = 1 100 nV/°C

Offset drift

PGA = 128 15 nV/°C

Gain error Excluding V

REF

errors ±0.5 %

PGA = 1, excludes V

REF

drift 1 ppm/°C

Gain drift

PGA = 128, excludes V

REF

drift –3.5 ppm/°C

ADC conversion time Single-cycle settling See Table 12

Noise See Table 1 and Table 2

Normal-mode rejection See Table 5

At dc, PGA = 1 90 dB

Common-mode rejection

At dc, PGA = 32 100 dB

Power-supply rejection AVDD, DVDD at dc 100 dB

VOLTAGE REFERENCE INPUT

Voltage reference input (AVDD –

0.5 V

REF

= V

REFP

– V

REFN

) AVSS) – 1

Negative reference input (REFN) AVSS – 0.1 REFP – 0.5 V

Positive reference input (REFP) REFN + 0.5 AVDD + 0.1 V

Reference input current 30 nA

ON-CHIP VOLTAGE REFERENCE

Output voltage 2.038 2.048 2.058 V

Output current

(2)

±10 mA

Load regulation 50 μV/mA

Drift

(3)

= –40°C to +105°C 20 50 ppm/°C

Startup time See Table 6 μs

(1) For V

REF

> 2.7V, the analog input differential voltage should not exceed 2.7V/PGA

(2) Do not exceed this loading on the internal voltage reference.

(3) Specified by the combination of design and final production test.

ADS1146

ADS1147

ADS1148

SBAS453F –JULY 2009–REVISED APRIL 2012

www.ti.com

ELECTRICAL CHARACTERISTICS (continued)

Minimum/maximum specifications apply from –40°C to +105°C. Typical specifications are at +25°C. All specifications at

AVDD = +5V, DVDD = +3.3V, AVSS = DGND = 0V, V

REF

= +2.048V, and oscillator frequency = 4.096MHz, unless otherwise

noted.

ADS1146, ADS1147, ADS1148

PARAMETER CONDITIONS MIN TYP MAX UNIT

CURRENT SOURCES (IDACS)

50, 100, 250,

Output current 500, 750, 1000, μA

1500

Voltage compliance All currents AVDD – 0.7 V

Initial error All currents, each IDAC –6 ±1.0 6 % of FS

Initial mismatch All currents, between IDACs ±0.03 % of FS

Temperature drift Each IDAC 200 ppm/°C

Temperature drift matching Between IDACs 10 ppm/°C

SYSTEM MONITORS

Voltage T

= +25°C 118 mV

Temperature

sensor reading

Drift 405 μV/°C

GENERAL-PURPOSE INPUT/OUTPUT (GPIO)

0.7AVDD AVDD V

AVSS 0.3AVDD V

Logic levels

= 1mA 0.8AVDD V

= 1mA AVSS 0.2 AVDD V

DIGITAL INPUT/OUTPUT (other than GPIO)

0.7DVDD DVDD V

DGND 0.3DVDD V

Logic levels

= 1mA 0.8DVDD V

= 1mA DGND 0.2 DVDD V

Input leakage DGND < V

DIGITAL IN

< DVDD ±10 μA

Frequency 1 4.5 MHz

Clock input

(CLK)

Duty cycle 25 75 %

Internal oscillator frequency 3.89 4.096 4.3 MHz

POWER SUPPLY

DVDD 2.7 5.25 V

AVSS –2.5 0 V

AVDD AVSS + 2.7 AVSS + 5.25 V

Normal mode, DVDD = 5V,

230 μA

data rate = 20SPS, internal oscillator

DVDD current Normal mode, DVDD = 3.3V,

210 μA

data rate = 20SPS, internal oscillator

Sleep mode 0.2 µA

Converting, AVDD = 5V,

225 µA

data rate = 20SPS, external reference

Converting, AVDD = 3.3V,

212 µA

data rate = 20SPS, external reference

AVDD current

Sleep mode 0.1 µA

Additional current with internal reference

180 μA

enabled

AVDD = DVDD = 5V, data rate = 20SPS,

2.3 mW

external reference, internal oscillator

Power dissipation

AVDD = DVDD = 3.3V, data rate = 20SPS,

1.4 mW

external reference, internal oscillator

TEMPERATURE RANGE

Specified –40 +105 °C

Operating –40 +125 °C

Storage –60 +150 °C

ADS1146

ADS1147

ADS1148

www.ti.com

SBAS453F –JULY 2009–REVISED APRIL 2012

THERMAL INFORMATION

ADS1146,

ADS1147,

ADS1148

THERMAL METRIC

(1)

UNITS

Junction-to-ambient thermal resistance

(2)

79.5

JC(top)

Junction-to-case(top) thermal resistance

(3)

31.8

Junction-to-board thermal resistance

(4)

40.9

°C/W

Junction-to-top characterization parameter

(5)

3.0

Junction-to-board characterization parameter

(6)

41.1

JC(bottom)

Junction-to-case(bottom) thermal resistance

(7)

n/a

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5) The junction-to-top characterization parameter, ψ

, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining θ

, using a procedure described in JESD51-2a (sections 6 and 7).

(6) The junction-to-board characterization parameter, ψ

, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining θ

, using a procedure described in JESD51-2a (sections 6 and 7).

(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Product Folder Link(s): ADS1146 ADS1147 ADS1148

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