Table of Contents
1 Ordering information............................................................5
2 Overview............................................................................. 5
2.1 System features.........................................................6
2.1.1 Arm Cortex-M0+ core.................................. 6
2.1.2 NVIC............................................................ 7
2.1.3 AWIC........................................................... 7
2.1.4 Memory........................................................8
2.1.5 Reset and boot............................................ 8
2.1.6 Clock options............................................... 11
2.1.7 Security........................................................13
2.1.8 Power management.....................................14
2.1.9 LLWU...........................................................16
2.1.10 Debug controller.......................................... 18
2.2 Peripheral features.....................................................18
2.2.1 16-bit SAR ADC...........................................18
2.2.2 Crossbar Switch Lite (AXBS-Lite)................18
2.2.3 Bit Manipulation Engine2 (BME2)................19
2.2.4 Cryptographic Acceleration Unit (CAU)....... 19
2.2.5 Comparator (CMP)...................................... 19
2.2.6 12-bit DAC................................................... 20
2.2.7 Direct Memory Access Multiplexer
(DMAMUX).................................................. 20
2.2.8 EMVSIM.......................................................20
2.2.9 Flexible I/O (FlexIO).....................................20
2.2.10 General-Purpose Input/Output (GPIO)........ 21
2.2.11 Low Power Inter-Integrated Circuit (LPI2C).21
2.2.12 The Low Power Periodic Interrupt Timer
(LPIT)...........................................................21
2.2.13 Low Power Serial Peripheral Interface
(LPSPI)........................................................ 22
2.2.14 Low-Power Timer (LPTMR).........................22
2.2.15 Low Power Universal Asynchronous
Receiver/Transmitter (LPUART)..................22
2.2.16 Peripheral Clock Control (PCC)...................23
2.2.17 Real Time Clock (RTC)................................23
2.2.18 Timer/PWM Module (TPM)..........................23
2.2.19 Touch Sensing Input (TSI)...........................23
2.2.20 Universal Serial Bus (USB) FS....................24
2.2.21 Voltage Reference (VREF)..........................24
2.2.22 Watchdog (WDOG)......................................25
3 Memory Map....................................................................... 25
4 Pinouts and Packaging....................................................... 27
4.1 Signal Multiplexing and Pin Assignments.................. 27
4.2 K32 L2A Pinouts........................................................ 31
5 Dimensions..........................................................................33
5.1 Obtaining package dimensions..................................33
6 Ratings................................................................................ 34
6.1 Thermal handling ratings........................................... 34
6.2 Moisture handling ratings...........................................34
6.3 ESD handling ratings................................................. 34
6.4 Voltage and current operating ratings........................35
7 General............................................................................... 35
7.1 AC electrical characteristics.......................................35
7.2 Nonswitching electrical specifications........................36
7.2.1 Voltage and current operating
requirements................................................36
7.2.2 LVD, HVD, and POR operating
requirements................................................37
7.2.3 Voltage and current operating behaviors.....38
7.2.4 Power mode transition operating behaviors 39
7.2.5 Power consumption operating behaviors.....40
7.2.6 EMC radiated emissions operating
behaviors..................................................... 48
7.2.7 Designing with radiated emissions in mind..49
7.2.8 Capacitance attributes.................................49
7.3 Switching specifications.............................................49
7.3.1 Device clock specifications..........................49
7.3.2 General switching specifications..................50
7.4 Thermal specifications............................................... 52
7.4.1 Thermal operating requirements..................52
7.4.2 Thermal attributes........................................52
8 Peripheral operating requirements and behaviors.............. 53
8.1 Core modules.............................................................53
8.1.1 SWD electricals .......................................... 53
8.2 System modules........................................................ 54
8.3 Clock modules........................................................... 54
8.3.1 System Clock Generation (SCG)
specifications............................................... 54
8.3.2 Oscillator electrical specifications................57
8.4 Memories and memory interfaces..............................59
8.4.1 Flash electrical specifications...................... 59
8.5 Security and integrity modules...................................61
8.6 Analog........................................................................61
8.6.1 ADC electrical specifications....................... 61
8.6.2 Voltage reference electrical specifications...66
8.6.3 CMP and 6-bit DAC electrical
specifications............................................... 67
8.6.4 12-bit DAC electrical characteristics............69
8.7 Timers........................................................................72
8.8 Communication interfaces......................................... 72
8.8.1 EMV SIM specifications...............................72
8.8.2 USB electrical specifications........................77
8.8.3 USB VREG electrical specifications............ 78
8.8.4 LPSPI switching specifications.................... 78
8.8.5 LPI2C...........................................................83
8.8.6 LPUART.......................................................83
8.9 Human-machine interfaces (HMI)..............................84
8.9.1 TSI electrical specifications......................... 84
9 Design considerations.........................................................84
9.1 Hardware design considerations................................84
K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 2, 01/2020
3
NXP Semiconductors