1、滤波电容要尽量与芯片电源近,振荡器也是,在振荡器前端放电阻2、改变电路板大小在Design的Board Shape里3、放置元件,过孔,焊盘,覆铜,放文本等都可用快捷键P+L4、画完后要规定禁止布线层即KeepOut-Layer层,P+L布线5、覆铜(place polygon pour)之前要修改安全间距design rules(clearance 16mil左右)注意一般用Hatched,并且NET网络连接到地GND,选择pour all same net projects,还要去除死铜(remove dead copper)补充:多层覆铜要注意电源层和地层,因为FPGA里面的走线只有6mil,所以覆铜的时候要把rule->clearance设置为6mil再覆铜,在其他层覆铜的时候最好rule->clearance弄大一点16mil左右,再把规则改回去,这时候Track 8mil,Grid 24mil6、在顶层和底层覆铜时要注意Track 12mil,Grid 24mil7、地线和电源线一般要很粗60-80mil,正常最小线宽10mil,FPGA一般6mil8、排线操作用S+L