AEC - Q100 - REV-H
September 11, 2014
Component Technical Committee
Automotive Electronics Council
Appendix 2: Q100 Certification of Design, Construction and Qualification
Supplier Name: Date:
The following information is required to identify a device that has met the requirements of AEC-Q100. Submission of the
required data in the format shown below is optional. All entries must be completed; if a particular item does not
apply, enter "Not Applicable". This template can be downloaded from the AEC website at http://www.aecouncil.com.
This template is available as a stand-alone document.
2. Supplier’s Part Number/Data Sheet:
4. Wafer/Die Fab Location & Process ID:
a. Facility name/plant #:
b. Street address:
c. Country:
5. Wafer Probe Location:
a. Facility name/plant #:
b. Street address:
c. Country:
6. Assembly Location & Process ID:
a. Facility name/plant #:
b. Street address:
c. Country:
7. Final Quality Control A (Test) Location:
a. Facility name/plant #:
b. Street address:
c. Country:
8. Wafer/Die:
a. Wafer size:
b. Die family:
c. Die mask set revision & name:
d. Die photo:
See attached Not available
9. Wafer/Die Technology Description:
a. Wafer/Die process technology:
b. Die channel length:
c. Die gate length:
d. Die supplier process ID (Mask #):
e. Number of transistors or gates:
f. Number of mask steps:
10. Die Dimensions:
a. Die width:
b. Die length:
c. Die thickness (finished):
11. Die Metallization:
a. Die metallization material(s):
b. Number of layers:
c. Thickness (per layer):
d. % of alloys (if present):