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根据给定文件"L74A_64Gb_128Gb_256Gb_512Gb_AsyncSync_NAND.pdf"的信息，我们可以详细地解析与NAND闪存技术相关的多个关键知识点。 ### 1. NAND Flash Memory器件规格文档中列出了多种NAND Flash Memory型号，包括： - MT29F64G08CBAAA - MT29F128G08C[E/F]AAA - MT29F256G08C[J/K/M]AAA - MT29F512G08CUAAA - MT29F64G08CBCAB - MT29F128G08CECAB - MT29F256G08C[K/M]CAB - MT29F512G08CUCAB 这些型号涵盖了从64Gb到512Gb的不同存储容量，体现了NAND Flash Memory在容量上的多样性，满足不同应用场景的需求。 ### 2. Open NAND Flash Interface (ONFI) 2.2标准所有列出的NAND Flash Memory都遵循ONFI 2.2标准，这是一个由ONFI组织制定的开放标准，旨在确保不同制造商生产的NAND Flash设备之间具有互操作性。这使得NAND Flash Memory可以被更广泛的应用于各种系统架构中，增强了产品的通用性和兼容性。 ### 3. 多级单元（MLC）技术文档中提到的NAND Flash Memory采用了多级单元技术，这是一种将多个比特存储在一个单元中的技术，相较于单级单元（SLC），MLC可以在相同的物理空间内存储更多的数据，从而提高存储密度，降低每比特成本，但同时牺牲了一定的读写速度和耐用性。 ### 4. 组织结构每个NAND Flash Memory芯片都有具体的组织结构，例如页面大小、区块大小和平面大小等。页面是读写的基本单位，区块由多个页面组成，而平面则是由多个区块构成的逻辑存储区域。具体参数如下： - 页面大小：8640字节（8192 + 448字节） - 区块大小：256页（2048K + 112K字节） - 平面大小：2个平面×2048个区块/平面 - 设备大小：64Gb - 512Gb不等，区块数量从4096到32786不等 ### 5. 同步和异步I/O性能 NAND Flash Memory支持同步和异步两种模式的数据传输。同步模式下，时钟速率可达10ns（DDR），每引脚的读写吞吐量为200MT/s；而在异步模式下，tRC/tWC最小值为20ns。这表明了设备在不同场景下的灵活性和高效性。 ### 6. 阵列性能阵列性能包括读取页面时间、编程页面时间和擦除区块时间。其中，读取页面时间为50µs，编程页面时间为1300µs，擦除区块时间为3ms。这些指标直接关系到NAND Flash Memory的操作响应速度和效率。 ### 7. 工作电压范围工作电压范围对于确保NAND Flash Memory正常运行至关重要。文档指出VCC的工作电压范围为2.7至3.6V，而VCCQ的电压范围则分为两个区间：1.7至1.95V和2.7至3.6V。 ### 8. 命令集和高级命令集 NAND Flash Memory支持ONFI NAND Flash协议的命令集，同时也提供了多种高级命令，如程序缓存、读取缓存（顺序和随机）、一次性可编程（OTP）模式、多平面命令、多逻辑单元（LUN）操作等。这些命令集的丰富性极大地扩展了NAND Flash Memory的功能性和应用范围。 ### 9. 质量和可靠性 NAND Flash Memory在质量和可靠性方面也有严格的标准，如数据保留期至少为10年，耐久性达到5000次编程/擦除周期，工作温度范围从商业级的0°C至+70°C到工业级的-40°C至+85°C，确保了设备在各种环境下的稳定运行。 ### 10. 封装类型 NAND Flash Memory有三种主要封装类型：52-pad LGA、48-pin TSOP和100-ball BGA，不同的封装类型适用于不同的应用需求和设计考量。 NAND Flash Memory作为一种重要的非易失性存储技术，在数据存储领域扮演着核心角色。其在容量、接口标准、组织结构、I/O性能、阵列性能、工作电压、命令集、质量和可靠性等方面的特性，共同决定了NAND Flash Memory在现代信息技术中的广泛应用和未来发展潜力。

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NAND Flash Memory

MT29F64G08CBAAA, MT29F128G08C[E/F]AAA,

MT29F256G08C[J/K/M]AAA, MT29F512G08CUAAA,

MT29F64G08CBCAB, MT29F128G08CECAB, MT29F256G08C[K/M]CAB,

MT29F512G08CUCAB

Features

•

Open NAND Flash Interface (ONFI) 2.2-compliant

•

Multiple-level cell (MLC) technology

•

Organization

–

Page size x8: 8640 bytes (8192 + 448 bytes)

–

Block size: 256 pages (2048K + 112K bytes)

–

Plane size: 2 planes x 2048 blocks per plane

–

Device size: 64Gb: 4096 blocks;

128Gb: 8192 blocks;

256Gb: 16,384 blocks;

512Gb: 32,786 blocks

•

Synchronous I/O performance

–

Up to synchronous timing mode 5

–

Clock rate: 10ns (DDR)

–

Read/write throughput per pin: 200 MT/s

•

Asynchronous I/O performance

–

Up to asynchronous timing mode 5

–

RC/

WC: 20ns (MIN)

•

Array performance

–

Read page: 50µs (MAX)

–

Program page: 1300µs (TYP)

–

Erase block: 3ms (TYP)

•

Operating Voltage Range

–

: 2.7–3.6V

–

CCQ

: 1.7–1.95V, 2.7–3.6V

•

Command set: ONFI NAND Flash Protocol

•

Advanced Command Set

–

Program cache

–

Read cache sequential

–

Read cache random

–

One-time programmable (OTP) mode

–

Multi-plane commands

–

Multi-LUN operations

–

Read unique ID

–

Copyback

•

First block (block address 00h) is valid when ship-

ped from factory. For minimum required ECC, see

Error Management (page 109).

•

RESET (FFh) required as first command after power-

•

Operation status byte provides software method for

detecting

–

Operation completion

–

Pass/fail condition

–

Write-protect status

•

Data strobe (DQS) signals provide a hardware meth-

od for synchronizing data DQ in the synchronous

interface

•

Copyback operations supported within the plane

from which data is read

•

Quality and reliability

–

Data retention: 10 years

–

Endurance: 5000 PROGRAM/ERASE cycles

•

Operating temperature:

–

Commercial: 0°C to +70°C

–

Industrial (IT): –40ºC to +85ºC

•

Package

–

52-pad LGA

–

48-pin TSOP

–

100-ball BGA

Note:

1. The ONFI 2.2 specification is available at

www.onfi.org.

Micron Confidential and Proprietary

Advance

‡

64Gb, 128Gb, 256Gb, 512Gb Asynchronous/Synchronous NAND

Features

PDF: 09005aef83d2277a

Rev. B 2/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by

Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications.

Draft: 2/4/10

Contents

General Description ......................................................................................................................................... 9

Asynchronous and Synchronous Signal Descriptions ......................................................................................... 9

Signal Assignments ......................................................................................................................................... 11

Package Dimensions ...................................................................................................................................... 14

Architecture ................................................................................................................................................... 19

Device and Array Organization ....................................................................................................................... 20

Bus Operation – Asynchronous Interface ........................................................................................................ 28

Asynchronous Enable/Standby ................................................................................................................... 28

Asynchronous Bus Idle ............................................................................................................................... 28

Asynchronous Commands .......................................................................................................................... 29

Asynchronous Addresses ............................................................................................................................ 30

Asynchronous Data Input ........................................................................................................................... 31

Asynchronous Data Output ........................................................................................................................ 32

Write Protect .............................................................................................................................................. 33

Ready/Busy# .............................................................................................................................................. 33

Bus Operation – Synchronous Interface ........................................................................................................... 38

Synchronous Enable/Standby ..................................................................................................................... 39

Synchronous Bus Idle/Driving .................................................................................................................... 39

Synchronous Commands ........................................................................................................................... 40

Synchronous Addresses .............................................................................................................................. 41

Synchronous DDR Data Input ..................................................................................................................... 42

Synchronous DDR Data Output .................................................................................................................. 43

Write Protect .............................................................................................................................................. 45

Ready/Busy# .............................................................................................................................................. 45

Device Initialization ....................................................................................................................................... 46

Activating Interfaces ....................................................................................................................................... 47

Activating the Asynchronous Interface ........................................................................................................ 47

Activating the Synchronous Interface .......................................................................................................... 47

Command Definitions .................................................................................................................................... 49

Reset Operations ............................................................................................................................................ 51

RESET (FFh) ............................................................................................................................................... 51

SYNCHRONOUS RESET (FCh) .................................................................................................................... 52

RESET LUN (FAh) ....................................................................................................................................... 53

Identification Operations ................................................................................................................................ 54

READ ID (90h) ............................................................................................................................................ 54

READ ID Parameter Tables ............................................................................................................................. 55

Configuration Operations ............................................................................................................................... 56

SET FEATURES (EFh) ................................................................................................................................. 56

GET FEATURES (EEh) ................................................................................................................................. 57

READ PARAMETER PAGE (ECh) ...................................................................................................................... 61

Parameter Page Data Structure Tables ............................................................................................................. 62

READ UNIQUE ID (EDh) ................................................................................................................................ 72

Status Operations ........................................................................................................................................... 73

READ STATUS (70h) ................................................................................................................................... 74

READ STATUS ENHANCED (78h) ............................................................................................................... 75

Column Address Operations ........................................................................................................................... 76

CHANGE READ COLUMN (05h-E0h) .......................................................................................................... 76

CHANGE READ COLUMN ENHANCED (06h-E0h) ....................................................................................... 77

CHANGE WRITE COLUMN (85h) ................................................................................................................ 78

CHANGE ROW ADDRESS (85h) ................................................................................................................... 79

Micron Confidential and Proprietary

Advance

64Gb, 128Gb, 256Gb, 512Gb Asynchronous/Synchronous NAND

PDF: 09005aef83d2277a

Rev. B 2/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Draft: 2/4/10

Read Operations ............................................................................................................................................. 81

READ MODE (00h) ..................................................................................................................................... 83

READ PAGE (00h-30h) ................................................................................................................................ 84

READ PAGE CACHE SEQUENTIAL (31h) ..................................................................................................... 85

READ PAGE CACHE RANDOM (00h-31h) .................................................................................................... 86

READ PAGE CACHE LAST (3Fh) .................................................................................................................. 88

READ PAGE MULTI-PLANE (00h-32h) ........................................................................................................ 89

Program Operations ....................................................................................................................................... 91

PROGRAM PAGE (80h-10h) ........................................................................................................................ 91

PROGRAM PAGE CACHE (80h-15h) ............................................................................................................ 93

PROGRAM PAGE MULTI-PLANE 80h-11h ................................................................................................... 95

Erase Operations ............................................................................................................................................ 97

ERASE BLOCK (60h-D0h) ............................................................................................................................ 97

ERASE BLOCK MULTI-PLANE (60h-D1h) .................................................................................................... 98

Copyback Operations ..................................................................................................................................... 99

COPYBACK READ (00h-35h) ...................................................................................................................... 100

COPYBACK PROGRAM (85h–10h) .............................................................................................................. 101

COPYBACK READ MULTI-PLANE (00h-32h) .............................................................................................. 101

COPYBACK PROGRAM MULTI-PLANE (85h-11h) ....................................................................................... 102

One-Time Programmable (OTP) Operations ................................................................................................... 103

PROGRAM OTP PAGE (80h-10h) ................................................................................................................ 104

PROTECT OTP AREA (80h-10h) .................................................................................................................. 105

READ OTP PAGE (00h-30h) ........................................................................................................................ 106

Multi-Plane Operations ................................................................................................................................. 107

Multi-Plane Addressing ............................................................................................................................. 107

Interleaved Die (Multi-LUN) Operations ........................................................................................................ 108

Error Management ........................................................................................................................................ 109

Output Drive Impedance ............................................................................................................................... 110

AC Overshoot/Undershoot Specifications ...................................................................................................... 113

Synchronous Input Slew Rate ........................................................................................................................ 114

Output Slew Rate ........................................................................................................................................... 115

Electrical Specifications ................................................................................................................................. 116

Electrical Specifications – DC Characteristics and Operating Conditions (Asynchronous) ................................. 118

Electrical Specifications – DC Characteristics and Operating Conditions (Synchronous) .................................. 119

Electrical Specifications – DC Characteristics and Operating Conditions (V

CCQ

) ............................................... 119

Electrical Specifications – AC Characteristics and Operating Conditions (Asynchronous) ................................. 120

Electrical Specifications – AC Characteristics and Operating Conditions (Synchronous) ................................... 122

Electrical Specifications – Array Characteristics .............................................................................................. 125

Asynchronous Interface Timing Diagrams ...................................................................................................... 126

Synchronous Interface Timing Diagrams ........................................................................................................ 137

Revision History ............................................................................................................................................ 159

Rev. B – 2/10 ............................................................................................................................................. 159

Rev. A – 11/09 ............................................................................................................................................ 159

Micron Confidential and Proprietary

Advance

64Gb, 128Gb, 256Gb, 512Gb Asynchronous/Synchronous NAND

PDF: 09005aef83d2277a

Rev. B 2/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Draft: 2/4/10

List of Tables

Table 1: Asynchronous and Synchronous Signal Definitions ............................................................................. 9

Table 2: Array Addressing for Logical Unit (LUN) ............................................................................................ 27

Table 3: Asynchronous Interface Mode Selection ........................................................................................... 28

Table 4: Synchronous Interface Mode Selection ............................................................................................. 38

Table 5: Command Set .................................................................................................................................. 49

Table 6: Read ID Parameters for Address 00h ................................................................................................. 55

Table 7: Read ID Parameters for Address 20h .................................................................................................. 55

Table 8: Feature Address Definitions .............................................................................................................. 56

Table 9: Feature Address 01h: Timing Mode ................................................................................................... 58

Table 10: Feature Addresses 10h and 80h: Programmable Output Drive Strength ............................................. 58

Table 11: Feature Addresses 81h: Programmable R/B# Pull-Down Strength ..................................................... 59

Table 12: Feature Addresses 90h: Array Operation Mode ................................................................................. 59

Table 13: Parameter Page Data Structure ....................................................................................................... 62

Table 14: Status Register Definition ............................................................................................................... 73

Table 15: OTP Area Details ........................................................................................................................... 104

Table 16: Error Management Details ............................................................................................................. 109

Table 17: Output Drive Strength Test Conditions (V

CCQ

= 1.7–1.95V) .............................................................. 110

Table 18: Output Drive Strength Impedance Values (V

CCQ

= 1.7–1.95V) .......................................................... 110

Table 19: Output Drive Strength Conditions (V

CCQ

= 2.7–3.6V) ....................................................................... 111

Table 20: Output Drive Strength Impedance Values (V

CCQ

= 2.7–3.6V) ............................................................ 111

Table 21: Pull-Up and Pull-Down Output Impedance Mismatch .................................................................... 112

Table 22: Overshoot/Undershoot Parameters ................................................................................................ 113

Table 23: Test Conditions for Input Slew Rate ................................................................................................ 114

Table 24: Input Slew Rate (V

CCQ

= 1.7–1.95V) ................................................................................................. 114

Table 25: Test Conditions for Output Slew Rate ............................................................................................. 115

Table 26: Output Slew Rate (V

CCQ

= 1.7–1.95V) .............................................................................................. 115

Table 27: Output Slew Rate (V

CCQ

= 2.7–3.6V) ................................................................................................ 115

Table 28: Absolute Maximum Ratings by Device ............................................................................................ 116

Table 29: Recommended Operating Conditions ............................................................................................ 116

Table 30: Valid Blocks per LUN ..................................................................................................................... 116

Table 31: Capacitance: 100-Ball BGA Package ................................................................................................ 117

Table 32: Capacitance: 48-Pin TSOP Package ................................................................................................ 117

Table 33: Capacitance: 52-Pad LGA Package .................................................................................................. 117

Table 34: Test Conditions ............................................................................................................................. 118

Table 35: DC Characteristics and Operating Conditions (Asynchronous Interface) .......................................... 118

Table 36: DC Characteristics and Operating Conditions (Synchronous Interface) ........................................... 119

Table 37: DC Characteristics and Operating Conditions (3.3V V

CCQ

) ............................................................... 119

Table 38: DC Characteristics and Operating Conditions (1.8V V

CCQ

) ............................................................... 120

Table 39: AC Characteristics: Asynchronous Command, Address, and Data .................................................... 120

Table 40: AC Characteristics: Synchronous Command, Address, and Data ...................................................... 122

Table 41: Array Characteristics ..................................................................................................................... 125

Micron Confidential and Proprietary

Advance

64Gb, 128Gb, 256Gb, 512Gb Asynchronous/Synchronous NAND

PDF: 09005aef83d2277a

Rev. B 2/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Draft: 2/4/10