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IEC TS 61000-5-9-2009.pdf
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IEC/TS 61000-5-9
Edition 1.0 2009-07
TECHNICAL
SPECIFICATION
Electromagnetic compatibility (EMC) –
Part 5-9: Installation and mitigation guidelines – System-level susceptibility
assessments for HEMP and HPEM
IEC/TS 61000-5-9:2009(E)
BASIC EMC PUBLICATION
®
Copyright International Electrotechnical Commission
--`````,,,```,,,`,,`,,```,``,-`-`,,`,,`,`,,`---
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2009 IEC, Geneva, Switzerland
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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Copyright International Electrotechnical Commission
--`````,,,```,,,`,,`,,```,``,-`-`,,`,,`,`,,`---
IEC/TS 61000-5-9
Edition 1.0 2009-07
TECHNICAL
SPECIFICATION
Electromagnetic compatibility (EMC) –
Part 5-9: Installation and mitigation guidelines – System-level susceptibility
assessments for HEMP and HPEM
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
XB
ICS 33.100.20
PRICE CODE
ISBN 2-8318-1051-0
BASIC EMC PUBLICATION
® Registered trademark of the International Electrotechnical Commission
®
Copyright International Electrotechnical Commission
--`````,,,```,,,`,,`,,```,``,-`-`,,`,,`,`,,`---
– 2 – TS 61000-5-9 © IEC:2009(E)
CONTENTS
FOREWORD...........................................................................................................................5
INTRODUCTION.....................................................................................................................7
1 Scope...............................................................................................................................8
2 Normative references .......................................................................................................8
3 Terms and definitions .......................................................................................................9
4 General ..........................................................................................................................11
4.1 Introduction ...........................................................................................................11
4.2 Systems and subsystems ......................................................................................12
5 Interaction mechanisms and protection methods ............................................................13
5.1 General .................................................................................................................13
5.2 Front-door coupling ...............................................................................................13
5.3 Back-door coupling................................................................................................13
5.4 Protection methods ...............................................................................................14
6 Description of overall assessment methodology .............................................................14
6.1 Methodology..........................................................................................................14
6.2 Subsystems and equipment characterization phase...............................................16
6.3 System analysis phase..........................................................................................17
6.4 System test phase.................................................................................................17
6.4.1 General .....................................................................................................17
6.4.2 Low-level tests ..........................................................................................18
6.4.3 High-level testing.......................................................................................18
6.5 Susceptibility assessment phase ...........................................................................20
6.6 The use of reverberation chambers to characterise immunity ................................20
Annex A (informative) Classification of effect .......................................................................24
Annex B (informative) Good measurement practice..............................................................27
Annex C (informative) Computational electromagnetics .......................................................30
Annex D (informative) System level assessment – HEMP ....................................................33
Annex E (informative) System level assessment – HPEM ....................................................35
Annex F (informative) Limitations.........................................................................................39
Annex G (informative) Detailed description of low-level techniques......................................42
Annex H (informative) Detailed description of high-level test techniques ..............................54
Annex I (informative) Data processing and analysis .............................................................61
Bibliography..........................................................................................................................66
Figure 1 – Example system architecture ...............................................................................
12
Figure 2 – Example of radiated HPEM at high frequencies [3]...............................................14
Figure 3 – Methodology flowchart .........................................................................................15
Figure 4 – Reverberation chamber results: all effects............................................................21
Figure 5 – Reverberation chamber results: susceptibilities....................................................22
Figure 6 – Frequency spectrum of several HPEM sources ....................................................23
Figure A.1 – Classification of effect.......................................................................................24
Figure B.1 – Effect of adding ferrites to connecting cable: swept frequency example ............27
Copyright International Electrotechnical Commission
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TS 61000-5-9 © IEC:2009(E) – 3 –
Figure B.2 – Effect of adding ferrite to connecting cable: reverberation chamber
example................................................................................................................................
28
Figure B.3 – Effect of adding ferrite to connecting cable: transient example (time
domain) ................................................................................................................................
28
Figure B.4 – Effect of adding ferrite to connecting cable: transient example (frequency
domain) ................................................................................................................................
29
Figure E.1 – Steps taken in the system assessment .............................................................36
Figure E.2 – Maximum free-space separation distances........................................................38
Figure E.3 – Critical regions for permanent damage..............................................................38
Figure G.1 – Electromagnetic interaction sequence diagram for a facility illuminated by
an external antenna ..............................................................................................................
43
Figure G.2 – Illustration of the difference of a directed, narrow-beam antenna exciting
the facility with a spot beam, along with a plane wave providing illumination to the
entire facility .........................................................................................................................
45
Figure G.3 – Measurement equipment and configuration for measuring transient
responses in a buried facility, as reported by [G-6] ...............................................................
47
Figure G.4 – Example of a measured transient cable current (a) and the resulting
spectral magnitude, as computed by a Fourier transform (b) .................................................
48
Figure G.5 – Plots of the analytical pulser output open circuit voltage waveform (a)
and spectral magnitude (b), which are used as reference for computing the transfer
function T
sc
..........................................................................................................................
48
Figure G.6 – The radiated E-field from the IRA at a distance of 6 meters for the
analytical pulser excitation (a) and the resulting spectral magnitude (b)................................
49
Figure G.7 – The spectral magnitude of the computed transfer function T
sc
(a) and the
corresponding transient transfer function (b).........................................................................
49
Figure G.8 – The spectral magnitude of the computed transfer function T
ec
(a) and the
corresponding transient transfer function (b).........................................................................
50
Figure G.9 – LLCW reference field measurement..................................................................51
Figure G.10 – LLCW induced current measurement ..............................................................51
Figure G.11 – Typical magnitude-only transfer function.........................................................52
Figure H.1 – Microwave injection testing of a low noise amplifier, LNA [H-2]. LNA at
the tip of the arrow................................................................................................................
54
Figure H.2 – Aircraft testing at the Swedish Microwave Test Facility, MTF [H-3] ...................55
Figure H.3 – Measured shielding effectiveness of an equipment compared to the MTF
test frequencies (dashed bars) [3].........................................................................................
56
Figure H.4 – Reverberation chamber ....................................................................................58
Figure I.1 – Prediction of induced current using magnitude-only transfer functions [I-1] ........61
Figure I.2 – IEC 61000-2-9 HEMP Waveform ........................................................................62
Figure I.3 – Convolution process...........................................................................................62
Figure I.4 – Predicted induced current ..................................................................................63
Figure I.5 – Comparison of transfer function predictions with simulator measurements ........64
Figure I.6 – Extrapolation of measured transients .................................................................65
Copyright International Electrotechnical Commission
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