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MIL-STD-883E_NOTICE-4.025811.pdf
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MIL-STD-883E_NOTICE-4.025811.pdf
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1
This document and process INCH-POUND
conversion measures necessary to
comply with this revision shall
be completed by May 31, 2001
MIL-STD-883E
NOTICE 4
18 December 2000
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
MICROCIRCUITS
TO ALL HOLDERS OF MIL-STD-883E:
1. THE FOLLOWING TEST METHODS OF MIL-STD-883E HAVE BEEN REVISED AND SUPERSEDE THE TEST
METHODS LISTED:
NEW METHOD DATE SUPERSEDED METHOD DATE
1018.3 18 December 2000 1018.3 4 November 1980
2015.13 18 December 2000 2015.12 24 August 1998
2019.6 18 December 2000 2019.5 29 May 1987
5008.9 18 December 2000 5008.8 1 June 1993
2. THE FOLLOWING PAGES OF MIL-STD-883E HAVE BEEN REVISED AND SUPERSEDE THE PAGES
LISTED:
METHOD NEW PAGE DATE SUPERSEDED PAGE DATE
--- iii 31 December 1996 iii REPRINTED WITHOUT CHANGE
--- iv 18 December 2000 iv 5 November 1999
--- v 5 November 1999 v REPRINTED WITHOUT CHANGE
--- vi 31 December 1996 vi REPRINTED WITHOUT CHANGE
2003.7 7 15 November 1991 7 REPRINTED WITHOUT CHANGE
8 18 December 2000 8 15 November 1991
2010.10 39 27 July 1990 39 REPRINTED WITHOUT CHANGE
40 18 December 2000 40 27 July 1990
2011.7 1 18 December 2000 1 22 March 1989
2 22 March 1989 2 REPRINTED WITHOUT CHANGE
2032.1 59 1 June 1993 59 REPRINTED WITHOUT CHANGE
60 18 December 2000 60 1 June 1993
5004.10 5 19 August 1994 5 REPRINTED WITHOUT CHANGE
6 18 December 2000 6 19 August 1994
AMSC N/A FSC 5962
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
Notice of Change
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MIL-STD-883E
NOTICE 4
2
3. RETAIN THIS NOTICE AND INSERT BEFORE TABLE OF CONTENTS.
4. Holders of MIL-STD-883E will verify that page changes, additions, and corrections indicated above have been
entered. This notice page will be retained as a check sheet. This issuance, together with appended pages, is a
separate publication. Each notice is to be retained by stocking points until the military standard is completely
revised or canceled.
NOTE: The margins of this notice are marked with asterisks to indicate where changes (additions, modifications,
corrections, deletions) from the previous notice were made. This was done as a convenience only and the
Government assumes no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are
cautioned to evaluate the requirements of this document based on the entire content irrespective of the marginal
notations and relationship to the last previous notice.
CONCLUDING MATERIAL
Custodians: Preparing activity:
Army - CR DLA - CC
Navy - EC
Air Force - 11
NASA-NA
DLA - CC
Review activities (Project 5962-1883)
Army - AR, MI, SM
Navy - OS, SH, TD, AS, CG, MC
Air Force - 19, 99
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MIL-STD-883E
NOTICE 4
iii
CONTENTS
PARAGRAPH Page
1. SCOPE...................................................................................................................................... 1
1.1 Purpose ................................................................................................................................... 1
1.2 Intended use of or reference to MIL-STD-883............................................................................ 1
2. APPLICABLE DOCUMENTS ..................................................................................................... 3
2.1 General.................................................................................................................................... 3
2.2 Government documents ........................................................................................................... 3
2.3 Non-Government publications................................................................................................... 4
2.4 Order of precedence ................................................................................................................ 5
3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS ................................................................... 6
3.1 Abbreviations, symbols, and definitions..................................................................................... 6
4. GENERAL REQUIREMENTS .................................................................................................... 8
4.1 Numbering system ................................................................................................................... 8
4.2 Test results.............................................................................................................................. 9
4.3 Test sample disposition ............................................................................................................ 9
4.4 Orientation ............................................................................................................................... 9
4.5 Test conditions......................................................................................................................... 12
4.6 General precautions ................................................................................................................. 14
5. DETAIL REQUIREMENTS......................................................................................................... 15
6. NOTES...................................................................................................................................... 16
FIGURES
FIGURE
1. Orientation of noncylindrical microelectronic devices to
direction of applied force............................................................................................................. 10
2. Orientation of cylindrical microelectronic device to
direction of applied force............................................................................................................. 11
REPRINTED WITHOUT CHANGE
Downloaded from http://www.everyspec.com
MIL-STD-883E
NOTICE 4
iv
TEST METHODS
METHOD NO. ENVIRONMENTAL TESTS
1001 Barometric pressure, reduced (altitude operation)
1002 Immersion
1003 Insulation resistance
1004.7 Moisture resistance
1005.8 Steady state life
1006 Intermittent life
1007 Agree life
1008.2 Stabilization bake
1009.8 Salt atmosphere (corrosion)
1010.7 Temperature Cycling
1011.9 Thermal shock
1012.1 Thermal characteristics
1013 Dew point
1014.10 Seal
1015.9 Burn-in test
1016 Life/reliability characterization tests
1017.2 Neutron irradiation
* 1018.3 Internal water-vapor content
1019.5 Ionizing radiation (total dose) test procedure
1020.1 Dose rate induced latchup test procedure
1021.2 Dose rate upset testing of digital microcircuits
1022 Mosfet threshold voltage
1023.2 Dose rate response of linear microcircuits
1030.1 Preseal burn-in
1031 Thin film corrosion test
1032.1 Package induced soft error test procedure (due to alpha particles)
1033 Endurance life test
1034 Die penetrant test (for plastic devices)
MECHANICAL TESTS
2001.2 Constant acceleration
2002.4 Mechanical shock
2003.7 Solderability
2004.5 Lead integrity
2005.2 Vibration fatigue
2006.1 Vibration noise
2007.3 Vibration, variable frequency
2008.1 Visual and mechanical
2009.9 External visual
2010.10 Internal visual (monolithic)
2011.7 Bond strength (destructive bond pull test)
2012.7 Radiography
2013.1 Internal visual inspection for DPA
2014 Internal visual and mechanical
* 2015.13 Resistance to solvents
2016 Physical dimensions
2017.7 Internal visual (hybrid)
2018.3 Scanning electron microscope (SEM) inspection of metallization
* 2019.6 Die shear strength
2020.7 Particle impact noise detection test
Supersedes page iv of Notice 3 of MIL-STD-883E
Downloaded from http://www.everyspec.com
MIL-STD-883E
NOTICE 4
v
TEST METHODS
METHOD NO. MECHANICAL TESTS
2021.3 Glassivation layer integrity
2022.2 Wetting balance solderability
2023.5 Nondestructive bond pull
2024.2 Lid torque for glass-frit-sealed packages
2025.4 Adhesion of lead finish
2026 Random vibration
2027.2 Substrate attach strength
2028.4 Pin grid package destructive lead pull test
2029 Ceramic chip carrier bond strength
2030 Ultrasonic inspection of die attach
2031.1 Flip chip pull-off test
2032.1 Visual inspection of passive elements
2035 Ultrasonic inspection of TAB bonds
ELECTRICAL TESTS (DIGITAL)
3001.1 Drive source, dynamic
3002.1 Load conditions
3003.1 Delay measurements
3004.1 Transition time measurements
3005.1 Power supply current
3006.1 High level output voltage
3007.1 Low level output voltage
3008.1 Breakdown voltage, input or output
3009.1 Input current, low level
3010.1 Input current, high level
3011.1 Output short circuit current
3012.1 Terminal capacitance
3013.1 Noise margin measurements for digital microelectronic devices
3014 Functional testing
3015.7 Electrostatic discharge sensitivity classification
3016 Activation time verification
3017 Microelectronics package digital signal transmission
3018 Crosstalk measurements for digital microelectronic device packages
3019.1 Ground and power supply impedance measurements for digital microelectronics device packages
3020 High impedance (off-state) low-level output leakage current
3021 High impedance (off-state) high-level output leakage current
3022 Input clamp voltage
3023.1 Static latch-up measurements for digital CMOS microelectronic devices
3024 Simultaneous switching noise measurements for digital microelectronic devices
ELECTRICAL TESTS (LINEAR)
4001.1 Input offset voltage and current and bias current
4002.1 Phase margin and slew rate measurements
4003.1 Common mode input voltage range
Common mode rejection ratio
Supply voltage rejection ratio
4004.1 Open loop performance
4005.1 Output performance
4006.1 Power gain and noise figure
4007 Automatic gain control range
REPRINTED WITHOUT CHANGE
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