DP83867IR
,
DP83867CR
www.ti.com
SNLS484C –FEBRUARY 2015–REVISED NOVEMBER 2015
5 Revision History
Changes from Revision B (August 2015) to Revision C Page
• Changed the title to add DP83867IRRGZ/CRRGZ in the datasheet. ................................................................................... 1
• Added part numbers .............................................................................................................................................................. 1
• Changed latency bullet point in Featuresfor better description of the Low Latency Feature. ................................................ 1
• Changed Power consumption number in Features section.................................................................................................... 1
• Added Radiated Emissions performance to Features............................................................................................................ 1
• Added MDI Termination Resistor in Features ........................................................................................................................ 1
• Added Programmable MAC Interface Impedance in ............................................................................................................. 1
• Added 'RJ45 Mirror Mode' to Features................................................................................................................................... 1
• Added compatibility to Features ............................................................................................................................................. 1
• Added MAC interface information in Description.................................................................................................................... 1
• Added Package information for the new devices in Device Information table ....................................................................... 1
• Added ESD information about new RGZ devices in ESD Ratings ........................................................................................ 2
• Added thermal information for RGZ Devices in Thermal Information .................................................................................... 2
• Added ESD information about new RGZ devices in ESD Ratings ........................................................................................ 3
• Added thermal information for RGZ Devices in Thermal Information .................................................................................... 3
• Added Device Comparison Table........................................................................................................................................... 6
• Changed table to add information about new RGZ devices................................................................................................... 8
• Added information about pull-up pull-down resistors in Table Note of Pin Functions table .................................................. 8
• Changed bypass capacitor information for power pins in ................................................................................................... 11
• Added Unused Pins section ................................................................................................................................................ 11
• Added Absolute Maximum Ratings table.............................................................................................................................. 12
• Added ESD information about new RGZ devices in ESD Ratings ...................................................................................... 12
• Added VDD1P0 information in Recommended Operating Conditions ................................................................................. 12
• Added temperature information about RGZ devices in Recommended Operating Conditions ........................................... 12
• Added thermal information for RGZ Devices in Thermal Information .................................................................................. 13
• Added PMD output voltage data for new RGZ devices in Electrical Characteristics .......................................................... 13
• Added RGMII TX and RX Latency values in RGMII Timing
(4)
.............................................................................................. 18
• Added FBD for new RGZ devices in Functional Block Diagram .......................................................................................... 27
• Added "Magic Packet should be byte aligned" in Magic Packet Structure section. ............................................................. 28
• Changed "Auto-MDIX is independent of Auto-Negotiation" to "For 10/100, Auto-MDIX is independent of Auto-
Negotiation" in Auto-MDIX Resolution.................................................................................................................................. 38
• Added Loopback Availability table........................................................................................................................................ 39
• Changed description for Analog Loopback........................................................................................................................... 39
• Added description for External Loopback............................................................................................................................. 40
• Changed "improperly-terminated cables with ±1m accuracy" to "improperly-terminated cables, and crossed pairs
wires with ±1m accuracy" in TDR......................................................................................................................................... 41
• Added "0.5ms in 1000M mode" in Fast Link Drop section................................................................................................... 42
• Deleted mention of FLD_CFG and FLD_THR_CFG from Fast Link Drop .......................................................................... 42
• Changed Mirror Mode Configuration table. .......................................................................................................................... 44
• Added Added internal resistor to the diagram in Strap Circuit ............................................................................................ 45
• Added Target voltage range in Strap Resistor Ratios table................................................................................................. 45
• Added strapping information for RGZ devices in Table 5 ................................................................................................... 46
• Changed incorrect pin number for LED_1 and LED_0 in 4-Level Strap Pins table ............................................................. 47
• Added RGMII TX and RX Skew Strap information to Table 5 ............................................................................................. 47
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