PICMG Adoption Ballot Draft Only
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
iv PICMG 3.0 R3.0 AdvancedTCA Base Specification RC 1.1 February 19, 2008
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
Contents
2.3.1.6 RTM Covers........................................................................................2-43
2.3.1.7 RTM Face Plate ..................................................................................2-44
2.3.1.8 RTM Face Plate LEDs ........................................................................2-50
2.3.1.9 RTM Face Plate labels........................................................................2-53
2.3.1.10 RTM airflow requirements and direction .............................................2-54
2.3.1.11 Zone 3 airflow seal..............................................................................2-54
2.3.1.12 RTM Zone 3 keying.............................................................................2-57
2.3.2 Zone 3 Cable Bulkhead ......................................................................................2-58
2.3.3 RTM connection to Zone 3 midplane..................................................................2-60
2.4 Zone 1, 2, and 3 connectors ............................................................................................2-63
2.4.1 Zone 1 Connector ...............................................................................................2-64
2.4.1.1 Description ..........................................................................................2-64
2.4.1.2 -48 VDC power circuit definitions........................................................2-68
2.4.1.3 Metallic Test Bus circuits ....................................................................2-68
2.4.1.4 Ringing Generator Bus circuit .............................................................2-70
2.4.1.5 Hardware platform management circuit definitions.............................2-71
2.4.2 Zone 2 Connectors .............................................................................................2-72
2.4.2.1 General description of Zone 2 Connectors .........................................2-73
2.4.2.2 Pin numbering.....................................................................................2-73
2.4.2.3 Sequential mating ...............................................................................2-74
2.4.3 Zone 3 Connectors .............................................................................................2-74
2.4.3.1 General description.............................................................................2-74
2.4.3.2 Zone 3 Connector envelope................................................................2-75
2.4.3.3 Insertion force .....................................................................................2-77
2.4.3.4 Alignment allowances/gatherability.....................................................2-77
2.4.4 Front Board and RTM alignment/keying .............................................................2-78
2.4.4.1 Alignment overview.............................................................................2-78
2.4.4.2 Keying overview..................................................................................2-78
2.4.4.3 Zone 1 and Zone 2 keying/alignment..................................................2-80
2.4.4.4 RTM alignment....................................................................................2-84
2.4.4.5 Zone 3 alignment and keying..............................................................2-87
2.5 Backplanes ......................................................................................................................2-92
2.5.1 Description..........................................................................................................2-93
2.5.2 Connector locations ............................................................................................2-94
2.6 Subrack............................................................................................................................2-96
2.6.1 Subrack features.................................................................................................2-97
2.6.2 Backplane support bar......................................................................................2-104
2.6.3 Subrack interface requirements for Front Boards.............................................2-106
2.6.4 Guide Rail requirements ...................................................................................2-109
2.6.4.1 Front Board and RTM Guide Rail requirements ...............................2-109
2.6.4.2 Logical Slot identification ..................................................................2-112
2.6.4.3 ESD Clip position in the Guide Rails.................................................2-113
2.6.5 Face Plate Alignment and Safety Ground Pin ..................................................2-114
2.6.6 Retention screw receptacle ..............................................................................2-115
2.6.7 Subrack EMC Gasketing requirements ............................................................2-115
2.6.8 Subrack load carrying capability .......................................................................2-117
2.6.9 Subrack integrity tests ......................................................................................2-118
2.6.9.1 Subrack shock and vibration performance........................................2-118
2.6.9.2 Earthquake performance ..................................................................2-118
2.6.9.3 Flammability......................................................................................2-118
2.6.9.4 Shelf climatic test ..............................................................................2-118
2.6.9.5 Shelf atmosphere test .......................................................................2-119
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