iv PICMG 3.0 R2.0 AdvancedTCA Base Specification ECN-002 May 26, 2006
Contents
2.3.1.1 RTM PCB thickness............................................................................2-27
2.3.1.2 RTM pitch and offset...........................................................................2-27
2.3.1.3 RTM PCB bow, warp, component height, and stiffening ....................2-28
2.3.1.4 RTM ESD discharge strip ...................................................................2-28
2.3.1.5 RTM Face Plate and covers ...............................................................2-29
2.3.1.6 RTM Face Plate alignment/GND features ..........................................2-31
2.3.1.7 RTM retention screws .........................................................................2-31
2.3.1.8 RTM filler panels .................................................................................2-32
2.3.1.9 RTM airflow requirements and direction .............................................2-32
2.3.1.10 Zone 3 airflow seal..............................................................................2-32
2.3.1.11 RTM airflow seal .................................................................................2-34
2.3.1.12 RTM Zone 3 keying.............................................................................2-34
2.3.2 Zone 3 cable bulkhead .......................................................................................2-35
2.3.3 RTM connection to Zone 3 midplane..................................................................2-35
2.4 Zone 1, 2, and 3 connectors ............................................................................................2-37
2.4.1 Zone 1 connector................................................................................................2-37
2.4.1.1 Description ..........................................................................................2-37
2.4.1.2 -48 VDC power circuit definitions........................................................2-40
2.4.1.3 Metallic test bus circuits ......................................................................2-41
2.4.1.4 Ringing generator bus circuit ..............................................................2-42
2.4.1.5 Hardware platform management circuit definitions.............................2-43
2.4.2 Zone 2 connectors ..............................................................................................2-43
2.4.2.1 General description of Zone 2 connectors ..........................................2-43
2.4.2.2 Pin numbering.....................................................................................2-44
2.4.2.3 Sequential mating ...............................................................................2-44
2.4.3 Zone 3 connectors ..............................................................................................2-44
2.4.3.1 General description.............................................................................2-45
2.4.3.2 Zone 3 connector envelope ................................................................2-45
2.4.3.3 Insertion force .....................................................................................2-47
2.4.3.4 Alignment allowances/gatherability.....................................................2-47
2.4.4 Front Board and RTM alignment/keying .............................................................2-47
2.4.4.1 Alignment overview.............................................................................2-47
2.4.4.2 Keying overview..................................................................................2-47
2.4.4.3 Zone 1 and Zone 2 keying/alignment..................................................2-49
2.4.4.4 RTM alignment....................................................................................2-51
2.4.4.5 Zone 3 alignment and keying..............................................................2-54
2.5 Backplanes ......................................................................................................................2-57
2.5.1 Description..........................................................................................................2-58
2.5.2 Connector locations ............................................................................................2-59
2.6 Subrack............................................................................................................................2-60
2.6.1 Subrack features.................................................................................................2-61
2.6.2 Backplane support bar........................................................................................2-68
2.6.3 Subrack interface requirements for Front Boards...............................................2-71
2.6.4 Subrack EMC gasketing requirements ...............................................................2-72
2.6.5 Guide Rail requirements .....................................................................................2-72
2.6.5.1 Front Board and RTM Guide Rail requirements .................................2-72
2.6.5.2 Logical Slot identification ....................................................................2-74
2.6.5.3 ESD clip position in the Guide Rails ...................................................2-74
2.6.6 Face Plate alignment and safety ground pin ......................................................2-76
2.6.7 Retention screw receptacle ................................................................................2-76
2.6.8 Subrack load carrying capability .........................................................................2-76
2.6.9 Subrack integrity tests ........................................................................................2-76
