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1.2 Purpose and Scope
This document provides a description, specifications, and design related information on the MPU-9250
MotionTracking device. The device is housed in a small 3x3x1mm QFN package.
Specifications are subject to change without notice. Final specifications will be updated based upon
characterization of production silicon. For references to register map and descriptions of individual registers,
please refer to the MPU-9250 Register Map and Register Descriptions document.
1.3 Product Overview
MPU-9250 is a multi-chip module (MCM) consisting of two dies integrated into a single QFN package. One die
houses the 3-Axis gyroscope and the 3-Axis accelerometer. The other die houses the AK8963 3-Axis
magnetometer from Asahi Kasei Microdevices Corporation. Hence, the MPU-9250 is a 9-axis MotionTracking
device that combines a 3-axis gyroscope, 3-axis accelerometer, 3-axis magnetometer and a Digital Motion
Processor™ (DMP) all in a small 3x3x1mm package available as a pin-compatible upgrade from the MPU-
6515. With its dedicated I
2
C sensor bus, the MPU-9250 directly provides complete 9-axis MotionFusion™
output. The MPU-9250 MotionTracking device, with its 9-axis integration, on-chip MotionFusion™, and run-
time calibration firmware, enables manufacturers to eliminate the costly and complex selection, qualification,
and system level integration of discrete devices, guaranteeing optimal motion performance for consumers.
MPU-9250 is also designed to interface with multiple non-inertial digital sensors, such as pressure sensors,
on its auxiliary I
2
C port.
MPU-9250 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs, three
16-bit ADCs for digitizing the accelerometer outputs, and three 16-bit ADCs for digitizing the magnetometer
outputs. For precision tracking of both fast and slow motions, the parts feature a user-programmable
gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps), a user-programmable accelerometer
full-scale range of ±2g, ±4g, ±8g, and ±16g, and a magnetometer full-scale range of ±4800µT.
Other industry-leading features include programmable digital filters, a precision clock with 1% drift from -40°C
to 85°C, an embedded temperature sensor, and programmable interrupts. The device features I
2
C and SPI
serial interfaces, a VDD operating range of 2.4V to 3.6V, and a separate digital IO supply, VDDIO from 1.71V
to VDD.
Communication with all registers of the device is performed using either I
2
C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package
size down to a footprint and thickness of 3x3x1mm, to provide a very small yet high performance low cost
package. The device provides high robustness by supporting 10,000g shock reliability.
1.4 Applications
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
