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DA14531_datasheet_2v0.pdf
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The DA14531 is an ultra-low power SoC integrating a 2.4 GHz transceiver and an ARM® CortexM0+TM microcontroller with 48 kB of RAM and 32 kB of One-Time Programmable (OTP) memory. It can be used as a standalone application processor or as a data pump in hosted systems.
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DA14531
Ultra Low Power Bluetooth 5.1 SoC
Datasheet
Revision 2.0
13-Oct-2019
CFR0011-120-00
1 of 355
© 2019 Dialog Semiconductor
General Description
The DA14531 is an ultra-low power SoC integrating a 2.4 GHz transceiver and an ARM® Cortex-
M0+
TM
microcontroller with a RAM of 48 kB and a One-Time Programmable (OTP) memory of 32 kB.
It can be used as a standalone application processor or as a data pump in hosted systems.
The radio transceiver, the baseband processor, and the qualified Bluetooth® low energy stack is fully
compliant with the Bluetooth® Low Energy 5.1 standard.
The DA14531 has dedicated hardware for the Link Layer implementation of BLE and interface
controllers for enhanced connectivity capabilities.
The BLE firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute
Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All
profiles published by the Bluetooth® SIG as well as custom profiles are supported.
The device is suitable for disposables, wireless sensor nodes, beacons, proximity tags and trackers,
smart HID devices (stylus, keyboards, mice, and trackpads), toys, and medical and industrial
applications.
Key Features
■ Compatible with Bluetooth V5.1, ETSI EN 300
328 and EN 300 440 Class 2 (Europe), FCC
CFR47 Part 15 (US) and ARIB STD-T66
(Japan)
■ Supports up to three BLE connections
■ Typical cold boot to radio active 35 ms
■ Processing power
□ 16 MHz 32-bit ARM® Cortex-M0+ with
SWD interface
□ Dedicated Link Layer Processor
□ AES-128 Encryption Processor
□ Software-based certified True Random
Number Generator (TRNG)
■ Memories
□ 32 kB One-Time-Programmable (OTP)
□ 48 kB Retainable System RAM
□ 144 kB ROM
■ Power management
□ Integrated Buck/Boost DCDC converter
□ Buck: 1.8 V ≤ V
BAT_HIGH
≤ 3.3 V if OTP read
needed
□ Buck: 1.1 V ≤ V
BAT_HIGH
≤ 3.3 V if RAM
retained
□ Boost: 1.1 V ≤ V
BAT_LOW
≤ 1.65 V
□ Clock-less hibernation mode: Buck 270
nA, Boost 240 nA
□ 10-bit ADC for battery voltage monitoring
□ Built-in temperature sensor for die
temperature monitoring
■ Digital controlled oscillators
□ 32 MHz crystal and 32 MHz RC oscillator
□ 32 kHz crystal and 32/512 kHz RC
oscillator
■ 15 kHz RCX as 32 kHz crystal replacement
■ Programmable Reset Circuitry
■ 2× General purpose Timers with capture and
PWM capabilities
■ Digital interfaces
□ GPIOs: 6 (WLCSP17), 12 (FCGQFN24)
□ 2× UARTs (one with flow control)
□ SPI Master/Slave up to 32 MHz (Master)
□ I2C bus at 100 kHz and 400 kHz
□ 3-axis capable Quadrature Decoder
□ Keyboard controller
■ Analog interfaces
□ 4-channel 10-bit ADC
■ Radio transceiver
□ Fully integrated 2.4 GHz CMOS
transceiver
□ Single wire antenna
□ TX: 3.5 mA, RX: 2.2 mA (system currents
with DC-DC, V
BAT_HIGH
=3 V and 0 dBm)
□ Programmable transmit output power from
-19.5 dBm to +2.5 dBm
□ -94 dBm receiver sensitivity
■ Packages:
□ WLCSP 17 balls, 1.7 × 2.05, 0.5 mm pitch
□ FCGQFN 24 pins, 2.2 × 3, 0.4 mm pitch
DA14531
Ultra Low Power Bluetooth 5.1 SoC
Datasheet
Revision 2.0
13-Oct-2019
CFR0011-120-00
2 of 355
© 2019 Dialog Semiconductor
Applications
■ Medical applications
■ Disposables
■ Beacons
■ Proximity tags and trackers
■ Wireless sensor nodes
□ Fitness trackers
□ Consumer health
■ Smartwatches
■ Human interface devices (HID)
□ Stylus pens
□ Keyboards
□ Mouse devices
□ Trackpads
■ Toys
■ Industrial appliances
Key Benefits
■ Lowest power consumption
■ Smallest system size
■ Lowest system cost
System Diagram
Figure 1: System Diagram
DA14531
Ultra Low Power Bluetooth 5.1 SoC
Datasheet
Revision 2.0
13-Oct-2019
CFR0011-120-00
3 of 355
© 2019 Dialog Semiconductor
Contents
General Description ............................................................................................................................ 1
Key Features ........................................................................................................................................ 1
Applications ......................................................................................................................................... 2
Key Benefits ......................................................................................................................................... 2
System Diagram .................................................................................................................................. 2
Contents ............................................................................................................................................... 3
Figures .................................................................................................................................................. 8
Tables ................................................................................................................................................. 10
1 Block Diagram ............................................................................................................................. 19
2 Pinout ........................................................................................................................................... 20
2.1 DA14531 WLCSP17 Ball Assignment and Description ...................................................... 20
2.2 DA14531 FCGQFN24 Pinout .............................................................................................. 24
3 Specifications .............................................................................................................................. 29
3.1 Absolute Maximum Ratings ................................................................................................ 30
3.2 Recommended Operating Conditions ................................................................................. 31
3.3 DC Characteristics .............................................................................................................. 31
3.4 Timing Characteristics ......................................................................................................... 33
3.5 RCX Oscillator ..................................................................................................................... 33
3.6 XTAL32MHz Oscillator ........................................................................................................ 34
3.7 XTAL32kHz Oscillator ......................................................................................................... 35
3.8 RC32MHz Oscillator ............................................................................................................ 35
3.9 DC-DC Converter ................................................................................................................ 35
3.10 LDO_LOW Characteristics .................................................................................................. 37
3.11 Digital I/O Characteristics.................................................................................................... 38
3.12 Power On Reset .................................................................................................................. 39
3.13 GP ADC .............................................................................................................................. 39
3.14 Temperature Sensor ........................................................................................................... 40
3.15 Radio ................................................................................................................................... 41
4 System Overview ......................................................................................................................... 45
4.1 Internal Blocks ..................................................................................................................... 45
4.2 Power Management Unit..................................................................................................... 46
4.2.1 Introduction .......................................................................................................... 46
4.2.2 Architecture .......................................................................................................... 46
4.2.2.1 Digital Power Domains .................................................................... 48
4.2.2.2 Power Modes ................................................................................... 50
4.2.3 Programming ....................................................................................................... 53
4.2.3.1 Buck Configuration .......................................................................... 53
4.2.3.2 Boost Configuration ......................................................................... 54
4.2.3.3 Bypass Configuration....................................................................... 55
4.3 HW FSM (Power-up, Wake-up, and Go-to-Sleep) .............................................................. 55
4.3.1 Power-up/Wake-up in Buck Configuration........................................................... 56
4.3.2 Power-up/Wake-up in Boost Configuration ......................................................... 57
4.3.3 Go-to-Sleep and Refresh Bandgap ..................................................................... 58
DA14531
Ultra Low Power Bluetooth 5.1 SoC
Datasheet
Revision 2.0
13-Oct-2019
CFR0011-120-00
4 of 355
© 2019 Dialog Semiconductor
4.4 OTP Memory Layout ........................................................................................................... 59
4.4.1 OTP Header ......................................................................................................... 59
4.4.2 Configuration Script ............................................................................................. 61
4.5 BootROM Sequence ........................................................................................................... 62
5 Reset ............................................................................................................................................. 66
5.1 Introduction ......................................................................................................................... 66
5.2 Architecture ......................................................................................................................... 66
5.2.1 POR, HW, and SW Reset .................................................................................... 66
5.2.2 POR Functionality ................................................................................................ 68
5.2.2.1 POR Timer Clock ............................................................................. 68
5.2.2.2 RST Pad .......................................................................................... 68
5.2.2.3 POR from GPIO ............................................................................... 68
5.2.3 POR Timing Diagram ........................................................................................... 68
5.2.4 POR Considerations ............................................................................................ 69
5.3 Programming ....................................................................................................................... 69
6 ARM Cortex-M0+ .......................................................................................................................... 70
6.1 Introduction ......................................................................................................................... 70
6.2 Architecture ......................................................................................................................... 71
6.2.1 Interrupts .............................................................................................................. 71
6.2.2 System Timer (systick) ........................................................................................ 73
6.2.3 Wake-Up Interrupt Controller ............................................................................... 73
6.3 Programming ....................................................................................................................... 73
7 AMBA Bus .................................................................................................................................... 74
7.1 Introduction ......................................................................................................................... 74
7.2 Architecture ......................................................................................................................... 74
7.3 Programming ....................................................................................................................... 75
8 Memory Map................................................................................................................................. 76
9 Memory Controller ...................................................................................................................... 78
9.1 Introduction ......................................................................................................................... 78
9.2 Architecture ......................................................................................................................... 78
9.2.1 Arbitration ............................................................................................................ 78
10 Clock Generation ......................................................................................................................... 80
10.1 Clock Tree ........................................................................................................................... 80
10.1.1 General Clock Constraints ................................................................................... 82
10.2 Crystal Oscillators ............................................................................................................... 82
10.2.1 Frequency Control (32 MHz Crystal) ................................................................... 82
10.2.2 Automated Trimming and Settling Notification .................................................... 83
10.3 RC Oscillators ..................................................................................................................... 84
10.3.1 Frequency Calibration .......................................................................................... 85
11 OTP Controller ............................................................................................................................. 86
11.1 Introduction ......................................................................................................................... 86
11.2 Architecture ......................................................................................................................... 86
11.2.1 OTP Accessing Considerations ........................................................................... 88
11.3 Programming ....................................................................................................................... 88
12 DMA Controller ............................................................................................................................ 89
12.1 Introduction ......................................................................................................................... 89
DA14531
Ultra Low Power Bluetooth 5.1 SoC
Datasheet
Revision 2.0
13-Oct-2019
CFR0011-120-00
5 of 355
© 2019 Dialog Semiconductor
12.2 Architecture ......................................................................................................................... 89
12.2.1 DMA Peripherals .................................................................................................. 89
12.2.2 Input/Output Multiplexer....................................................................................... 90
12.2.3 DMA Channel Operation...................................................................................... 90
12.2.4 DMA Arbitration ................................................................................................... 91
12.2.5 Freezing DMA Channels...................................................................................... 92
12.3 Programming ....................................................................................................................... 92
12.3.1 Memory to Memory Transfers.............................................................................. 92
12.3.2 Peripheral to Memory Transfers .......................................................................... 92
13 I2C Interface ................................................................................................................................. 94
13.1 Introduction ......................................................................................................................... 94
13.2 Architecture ......................................................................................................................... 94
13.2.1 I2C Bus Terms ..................................................................................................... 95
13.2.1.1 Bus Transfer Terms ......................................................................... 96
13.2.2 I2C Behavior ........................................................................................................ 96
13.2.2.1 START and STOP Generation ........................................................ 96
13.2.2.2 Combined Formats .......................................................................... 97
13.2.3 I2C Protocols ....................................................................................................... 97
13.2.3.1 START and STOP Conditions ......................................................... 97
13.2.3.2 Addressing Slave Protocol .............................................................. 97
13.2.3.3 Transmitting and Receiving Protocols ............................................. 99
13.2.4 Multiple Master Arbitration ................................................................................. 100
13.2.5 Clock Synchronization ....................................................................................... 101
13.3 Programming ..................................................................................................................... 102
14 UART ........................................................................................................................................... 103
14.1 Introduction ....................................................................................................................... 103
14.2 Architecture ....................................................................................................................... 104
14.2.1 UART (RS232) Serial Protocol .......................................................................... 104
14.2.2 Clock Support .................................................................................................... 105
14.2.3 Interrupts ............................................................................................................ 105
14.2.4 Programmable THRE Interrupt .......................................................................... 106
14.2.5 Shadow Registers .............................................................................................. 108
14.2.6 Direct Test Mode ............................................................................................... 108
14.3 Programming UART Controllers ....................................................................................... 108
15 SPI Interface ............................................................................................................................... 110
15.1 Introduction ....................................................................................................................... 110
15.2 Architecture ....................................................................................................................... 111
15.2.1 SPI Timing ......................................................................................................... 111
15.2.2 Master Mode ...................................................................................................... 112
15.2.2.1 Configuration ................................................................................. 112
15.2.2.2 Read and Write .............................................................................. 112
15.2.3 Slave Mode ........................................................................................................ 113
15.2.3.1 Configuration ................................................................................. 113
15.2.3.2 Read and Write .............................................................................. 113
16 Quadrature Decoder .................................................................................................................. 114
16.1 Introduction ....................................................................................................................... 114
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