W25Q64JVSSIQ产品规格书pdf资源-CSDN文库

103 浏览量 2024-03-28 15:42:15 上传评论收藏 2.14MB PDF 举报

资源推荐

资源详情

资源评论

W25Q64JV

Publication Release Date: March 27, 2018

Revision J

3V 64M-BIT

SERIAL FLASH MEMORY WITH

DUAL, QUAD SPI

W25Q64JV

Publication Release Date: March 27, 2018

- 1 - Revision J

Table of Contents

1. GENERAL DESCRIPTIONS .................................................................................................................. 4

2. FEATURES ............................................................................................................................................ 4

3. PACKAGE TYPES AND PIN CONFIGURATIONS ............................................................................... 5

3.1 Pin Configuration SOIC 208-mil ................................................................................................ 5

3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm .................................................. 5

3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm ............................... 5

3.4 Pin Configuration SOIC 300-mil ................................................................................................ 6

3.5 Pin Description SOIC 300-mil .................................................................................................... 6

3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ...................................................... 7

3.7 Ball Description TFBGA 5x5 or 8x6-mm ................................................................................... 7

3.8 Ball Configuration WLCSP ........................................................................................................ 8

3.9 Ball Description WLCSP12 ........................................................................................................ 8

4. PIN DESCRIPTIONS ............................................................................................................................. 9

4.1 Chip Select (/CS) ....................................................................................................................... 9

4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ......................................... 9

4.3 Write Protect (/WP) .................................................................................................................... 9

4.4 HOLD (/HOLD) .......................................................................................................................... 9

4.5 Serial Clock (CLK) ..................................................................................................................... 9

4.6 Reset (/RESET)

(1)

...................................................................................................................... 9

5. BLOCK DIAGRAM ............................................................................................................................... 10

6. FUNCTIONAL DESCRIPTIONS .......................................................................................................... 11

6.1 Standard SPI Instructions ........................................................................................................ 11

6.2 Dual SPI Instructions ............................................................................................................... 11

6.3 Quad SPI Instructions.............................................................................................................. 11

6.4 Software Reset & Hardware /RESET pin ................................................................................ 11

6.5 Write Protection ....................................................................................................................... 12

Write Protect Features ............................................................................................................... 12

7. STATUS AND CONFIGURATION REGISTERS ................................................................................. 13

7.1 Status Registers ...................................................................................................................... 13

Erase/Write In Progress (BUSY) – Status Only ...................................................................... 13

Write Enable Latch (WEL) – Status Only ................................................................................ 13

Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable ...................................... 13

Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable ............................................. 14

Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable ............................................. 14

Complement Protect (CMP) – Volatile/Non-Volatile Writable ................................................. 14

Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable ..................................... 15

Erase/Program Suspend Status (SUS) – Status Only ............................................................ 16

Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable ................ 16

Quad Enable (QE) – Volatile/Non-Volatile Writable ................................................................ 16

Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ............................................. 17

Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable ................................. 17

W25Q64JV

Publication Release Date: March 27, 2018

- 2 - Revision J

Reserved Bits – Non Functional ............................................................................................. 17

Status Register Memory Protection (WPS = 0, CMP = 0) .......................................................... 18

Status Register Memory Protection (WPS = 0, CMP = 1) .......................................................... 19

Individual Block Memory Protection (WPS=1) ......................................................................... 20

8. INSTRUCTIONS .................................................................................................................................. 21

8.1 Device ID and Instruction Set Tables ...................................................................................... 21

Manufacturer and Device Identification ...................................................................................... 21

Instruction Set Table 1 (Standard SPI Instructions)

(1)

................................................................ 22

Instruction Set Table 2 (Dual/Quad SPI Instructions)

(1)

.............................................................. 23

8.2 Instruction Descriptions ........................................................................................................... 24

Write Enable (06h) ..................................................................................................................... 24

Write Enable for Volatile Status Register (50h) .......................................................................... 24

Write Disable (04h) .................................................................................................................... 25

Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .................... 25

Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .................... 26

Read Data (03h) ........................................................................................................................ 28

Fast Read (0Bh) ........................................................................................................................ 29

Fast Read Dual Output (3Bh) .................................................................................................... 30

Fast Read Quad Output (6Bh) ................................................................................................... 31

Fast Read Dual I/O (BBh) ........................................................................................................ 32

Fast Read Quad I/O (EBh) ....................................................................................................... 33

Set Burst with Wrap (77h) ........................................................................................................ 34

Page Program (02h) ................................................................................................................ 35

Quad Input Page Program (32h) .............................................................................................. 36

8.3 Sector Erase (20h) .................................................................................................................. 37

32KB Block Erase (52h) ............................................................................................................. 38

64KB Block Erase (D8h) ............................................................................................................ 39

Chip Erase (C7h / 60h) .............................................................................................................. 40

Erase / Program Suspend (75h) ................................................................................................ 41

Erase / Program Resume (7Ah) ................................................................................................. 42

Power-down (B9h) ..................................................................................................................... 43

Release Power-down / Device ID (ABh) .................................................................................... 44

Read Manufacturer / Device ID (90h) ........................................................................................ 45

Read Manufacturer / Device ID Dual I/O (92h) .......................................................................... 46

Read Manufacturer / Device ID Quad I/O (94h) ....................................................................... 47

Read Unique ID Number (4Bh) ................................................................................................ 48

Read JEDEC ID (9Fh) ............................................................................................................. 49

Read SFDP Register (5Ah) ...................................................................................................... 50

Erase Security Registers (44h) ................................................................................................ 51

Program Security Registers (42h) ............................................................................................ 52

Read Security Registers (48h) ................................................................................................. 53

Individual Block/Sector Lock (36h) ........................................................................................... 54

Individual Block/Sector Unlock (39h) ....................................................................................... 55

Read Block/Sector Lock (3Dh) ................................................................................................. 56

Global Block/Sector Lock (7Eh) ............................................................................................... 57

W25Q64JV

Publication Release Date: March 27, 2018

- 3 - Revision J

Global Block/Sector Unlock (98h) ............................................................................................ 57

Enable Reset (66h) and Reset Device (99h) ........................................................................... 58

9. ELECTRICAL CHARACTERISTICS.................................................................................................... 59

9.1 Absolute Maximum Ratings

(1)

............................................................................................... 59

9.2 Operating Ranges ................................................................................................................... 59

9.3 Power-Up Power-Down Timing and Requirements ................................................................ 60

9.4 DC Electrical Characteristics- .................................................................................................. 61

9.5 AC Measurement Conditions .................................................................................................. 62

9.6 AC Electrical Characteristics

(6)

................................................................................................ 63

9.7 Serial Output Timing ................................................................................................................ 65

9.8 Serial Input Timing ................................................................................................................... 65

9.9 /WP Timing .............................................................................................................................. 65

10. PACKAGE SPECIFICATIONS ............................................................................................................ 66

10.1 8-Pin SOIC 208-mil (Package Code SS) ................................................................................. 66

10.2 8-Pad WSON 6x5-mm (Package Code ZP) ............................................................................ 67

10.3 8-Pad WSON 8x6mm (Package Code ZE) ............................................................................. 68

10.4 8-Pad XSON 4x4x0.45-mm (Package Code XG) ................................................................... 69

10.5 16-Pin SOIC 300-mil (Package Code SF) ............................................................................... 70

10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5 Ball Array) ................................................. 71

10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array).................................................. 72

10.9 12-Ball WLCSP (Package Code BY) ....................................................................................... 73

11. ORDERING INFORMATION ............................................................................................................... 74

11.1 Valid Part Numbers and Top Side Marking ............................................................................. 75

12. REVISION JISTORY............................................................................................................................ 77

W25Q64JV

Publication Release Date: March 27, 2018

- 4 - Revision J

1. GENERAL DESCRIPTIONS

The W25Q64JV (64M-bit) Serial Flash memory provides a storage solution for systems with limited space,

pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.

They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing

voice, text and data. The device operates on 2.7V to 3.6V power supply with current consumption as low as

1µA for power-down. All devices are offered in space-saving packages.

The W25Q64JV array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can

be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB

block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64JV has 2,048

erasable sectors and 128 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in

applications that require data and parameter storage. (See Figure 2.)

The W25Q64JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip

Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q64JV of up to 133MHz

are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x

4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard

Asynchronous 8 and 16-bit Parallel Flash memories.

Additionally, the device supports JEDEC standard manufacturer and device ID, and a 64-bit Unique Serial

Number and three 256-bytes Security Registers.

2. FEATURES

 New Family of SpiFlash Memories

– W25Q64JV: 64M-bit / 8M-byte

– Standard SPI: CLK, /CS, DI, DO

– Dual SPI: CLK, /CS, IO

, IO

– Quad SPI: CLK, /CS, IO

, IO

– Software & Hardware Reset

(1)

 Highest Performance Serial Flash

– 133MHz Single, Dual/Quad SPI clocks

– 266/532MHz equivalent Dual/Quad SPI

– Min. 100K Program-Erase cycles per sector

– More than 20-year data retention

 Low Power, Wide Temperature Range

– Single 2.7 to 3.6V supply

– <1µA Power-down (typ.)

– -40°C to +85°C operating range

– -40°C to +105°C operating range

 Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4K/32K/64K-Byte)

– Program 1 to 256 byte per programmable page

– Erase/Program Suspend & Resume

 Advanced Security Features

– Software and Hardware Write-Protect

– Special OTP protection

– Top/Bottom, Complement array protection

– Individual Block/Sector array protection

– 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Bytes Security Registers

– Volatile & Non-volatile Status Register Bits

 Space Efficient Packaging

– 8-pin SOIC 208-mil

– 8-pad WSON 6x5-mm/8x6-mm

– 16-pin SOIC 300-mil

– 8-pad XSON 4x4-mm

– 24-ball TFBGA 8x6-mm (6x4 ball array)

– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)

– 12-ball WLCSP

– Contact Winbond for KGD and other options

Note: 1. Hardware /RESET pin is only available on TFBGA or SOIC16 packages

剩余77页未读，继续阅读

评论收藏

内容反馈

宏源世纪-niki

粉丝: 440
资源: 87

W25Q64JVSSIQ 产品规格书pdf

最新资源

W25Q64JVSSIQ 产品规格书pdf

W25Q32JVSSIQ 产品规格书pdf

W25Q32JVSSIQ-cn.pdf

STM32开发（八）STM32F103 SPI 通信（W25Q64JVSSIQ ）代码

W25Q16JVSSIQ 产品规格书pdf

W25Q64中文数据手册.pdf

MAX31865ATP+ADS7961SDBT+W25Q64JVSSIQ芯片AD原理图+PCB封装库.rar

W25Q64FWSSIQ 产品规格书pdf

W25Q64JVXGIQ 产品规格书pdf

W25Q64中文手册.pdf

W25Q64芯片数据手册PDF

W25Q64规格书手册.rar

教程 14、stm32单片机之W25Q64存储器的读写

源码 14、stm32单片机之W25Q64存储器的读写.zip

w25q64 SPI实验.rar_W25Q64_dma读取25q64_spi

STM32 W25Q64驱动程序 W25Q128驱动程序 W25Q32驱动程序

W25Q64_128书签中文版.pdf

W25Q32JVUUIQ 产品规格书pdf

W25Q256JVEIQ 产品规格书pdf

epson L4158 L4168 废墨收集垫清零软件

店铺图片抓手，一款完全免费的下载店铺商品图片的工具

免费版WPS2019

基于遗传算法的simulink/PID参数整定(s函数）

餐饮餐厅饭店小票模板1

小狐狸CHATGPT智能问答AI创作系统v1.6.4 PHP源码

全国最全水系shp 矢量

bartender2022标签条码编辑软件

Axure-后台业务管理系统原型模板

元宇宙.pptx 什么是元宇宙

CRMEB多商户JAVA版 B2B2C商家入驻平台系统

最新资源