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W25Q32JV

Publication Release Date: March 27, 2018

-Revision G

3V 32M-BIT

SERIAL FLASH MEMORY WITH

DUAL, QUAD SPI

For Industrial & Industrial Plus Grade

W25Q32JV

- 1 -

Table of Contents

1. GENERAL DESCRIPTIONS ............................................................................................................. 4

2. FEATURES ....................................................................................................................................... 4

3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5

3.1 Pin Configuration SOIC 150/208-mil & VSOP 208-mil ......................................................... 5

3.2 Pad Configuration WSON 6x5-mm/ 8X6-mm, XSON 4x4-mm ............................................ 5

3.3 Pin Description SOIC 150/208-mil, VSOP 208-mil, WSON 6x5-mm/8x6-mm, XSON 4x4-

mm 5

3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6

3.5 Pin Description SOIC 300-mil ............................................................................................... 6

3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 7

3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 7

3.8 Pin Configuration PDIP 300-mil ............................................................................................ 8

3.9 Pin Description PDIP 300-mil ............................................................................................... 8

4. PIN DESCRIPTIONS ........................................................................................................................ 9

4.1 Chip Select (/CS) .................................................................................................................. 9

4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9

4.3 Write Protect (/WP) ............................................................................................................... 9

4.4 HOLD (/HOLD) ..................................................................................................................... 9

4.5 Serial Clock (CLK) ................................................................................................................ 9

4.6 Reset (/RESET)

(1)

................................................................................................................. 9

5. BLOCK DIAGRAM .......................................................................................................................... 10

6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11

6.1 Standard SPI Instructions ................................................................................................... 11

6.2 Dual SPI Instructions .......................................................................................................... 11

6.3 Quad SPI Instructions......................................................................................................... 11

6.4 Software Reset & Hardware /RESET pin ........................................................................... 11

6.5 Write Protection .................................................................................................................. 12

Write Protect Features .......................................................................................................... 12

7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 13

7.1 Status Registers ................................................................................................................. 13

Erase/Write In Progress (BUSY) – Status Only ................................................................. 13

Write Enable Latch (WEL) – Status Only ........................................................................... 13

Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable ................................. 13

Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable ........................................ 14

Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable ........................................ 14

Complement Protect (CMP) – Volatile/Non-Volatile Writable ............................................ 14

Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable ................................ 15

Erase/Program Suspend Status (SUS) – Status Only ....................................................... 16

Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable ........... 16

Quad Enable (QE) – Volatile/Non-Volatile Writable ........................................................... 16

Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ........................................ 17

W25Q32JV

Publication Release Date: March 27, 2018

- 2 - Revision G

Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable ............................ 17

Reserved Bits – Non Functional ........................................................................................ 17

Status Register Memory Protection (WPS = 0, CMP = 0) ..................................................... 18

Status Register Memory Protection (WPS = 0, CMP = 1) ..................................................... 19

Individual Block Memory Protection (WPS=1) .................................................................... 20

8. INSTRUCTIONS ............................................................................................................................. 21

8.1 Device ID and Instruction Set Tables ................................................................................. 21

Manufacturer and Device Identification ................................................................................. 21

Instruction Set Table 1 (Standard SPI Instructions)

(1)

........................................................... 22

Instruction Set Table 2 (Dual/Quad SPI Instructions)

(1)

......................................................... 23

8.2 Instruction Descriptions ...................................................................................................... 24

Write Enable (06h) ................................................................................................................ 24

Write Enable for Volatile Status Register (50h) ..................................................................... 24

Write Disable (04h) ............................................................................................................... 25

Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) ............... 25

Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) ............... 26

Read Data (03h) ................................................................................................................... 28

Fast Read (0Bh) ................................................................................................................... 29

Fast Read Dual Output (3Bh) ............................................................................................... 30

Fast Read Quad Output (6Bh) .............................................................................................. 31

Fast Read Dual I/O (BBh) ................................................................................................... 32

Fast Read Quad I/O (EBh) .................................................................................................. 33

Set Burst with Wrap (77h) ................................................................................................... 34

Page Program (02h) ........................................................................................................... 35

Quad Input Page Program (32h) ......................................................................................... 36

Sector Erase (20h) .............................................................................................................. 37

32KB Block Erase (52h) ...................................................................................................... 38

64KB Block Erase (D8h) ..................................................................................................... 39

Chip Erase (C7h / 60h) ....................................................................................................... 40

Erase / Program Suspend (75h) ......................................................................................... 41

Erase / Program Resume (7Ah) .......................................................................................... 42

Power-down (B9h) .............................................................................................................. 43

Release Power-down / Device ID (ABh) ............................................................................. 44

Read Manufacturer / Device ID (90h) ................................................................................. 45

Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 46

Read Manufacturer / Device ID Quad I/O (94h) .................................................................. 47

Read Unique ID Number (4Bh) ........................................................................................... 48

Read JEDEC ID (9Fh) ........................................................................................................ 49

Read SFDP Register (5Ah) ................................................................................................. 50

Erase Security Registers (44h) ........................................................................................... 51

Program Security Registers (42h) ....................................................................................... 52

Read Security Registers (48h) ............................................................................................ 53

Individual Block/Sector Lock (36h) ...................................................................................... 54

Individual Block/Sector Unlock (39h) .................................................................................. 55

Read Block/Sector Lock (3Dh) ............................................................................................ 56

W25Q32JV

- 3 -

Global Block/Sector Lock (7Eh) .......................................................................................... 57

Global Block/Sector Unlock (98h) ....................................................................................... 57

Enable Reset (66h) and Reset Device (99h) ...................................................................... 58

9. ELECTRICAL CHARACTERISTICS............................................................................................... 59

9.1 Absolute Maximum Ratings

(1)

.......................................................................................... 59

9.2 Operating Ranges .............................................................................................................. 59

9.3 Power-Up Power-Down Timing and Requirements ........................................................... 60

9.4 DC Electrical Characteristics- ............................................................................................. 61

9.5 AC Measurement Conditions ............................................................................................. 62

9.6 AC Electrical Characteristics

(6)

........................................................................................... 63

9.7 Serial Output Timing ........................................................................................................... 65

9.8 Serial Input Timing .............................................................................................................. 65

9.9 /WP Timing ......................................................................................................................... 65

10. PACKAGE SPECIFICATIONS ....................................................................................................... 66

10.1 8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 66

10.2 8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 67

10.3 8-Pin VSOP 208-mil (Package Code ST)........................................................................... 68

10.4 8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 69

10.5 8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 70

10.6 Pad XSON 4x4x0.45-mm (Package Code XG) .................................................................. 71

10.7 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 72

10.8 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 73

10.10 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5 Ball Array) .......................................... 74

10.11 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ........................................... 75

11. ORDERING INFORMATION .......................................................................................................... 76

11.1 Valid Part Numbers and Top Side Marking ........................................................................ 77

12. REVISION HISTORY ...................................................................................................................... 79

W25Q32JV

Publication Release Date: March 27, 2018

- 4 - Revision G

1. GENERAL DESCRIPTIONS

The W25Q32JV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space,

pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.

They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing

voice, text and data. The device operates on 2.7V to 3.6V power supply with current consumption as low

as 1µA for power-down.

The W25Q32JV array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes

can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128

(32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32JV has

1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater

flexibility in applications that require data and parameter storage. (See Figure 2.)

The W25Q32JV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad

output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2, and

I/O3. SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 266MHz

(133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad

I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash

memories.

Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-

bit Unique Serial Number and three 256-bytes Security Registers.

2. FEATURES

 New Family of SpiFlash Memories

– W25Q32JV: 32M-bit / 4M-byte

– Standard SPI: CLK, /CS, DI, DO

– Dual SPI: CLK, /CS, IO

, IO

– Quad SPI: CLK, /CS, IO

, IO

– Software & Hardware Reset

(1)

 Highest Performance Serial Flash

– 133MHz Single, Dual/Quad SPI clocks

– 266/532MHz equivalent Dual/Quad SPI

– 66MB/S continuous data transfer rate

– Min. 100K Program-Erase cycles per sector

– More than 20-year data retention

 Efficient “Continuous Read”

– Continuous Read with 8/16/32/64-Byte Wrap

– As few as 8 clocks to address memory

– Allows true XIP (execute in place) operation

– Outperforms X16 Parallel Flash

 Low Power, Wide Temperature Range

– Single 2.7V to 3.6V supply

– <1µA Power-down (typ.)

– -40°C to +85°C operating range

– -40°C to +105°C operating range

 Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4K/32K/64K-Byte)

– Program 1 to 256 byte per programmable page

– Erase/Program Suspend & Resume

 Advanced Security Features

– Software and Hardware Write-Protect

– Special OTP protection

(2)

– Top/Bottom, Complement array protection

– Individual Block/Sector array protection

– 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Bytes Security Registers

– Volatile & Non-volatile Status Register Bits

 Space Efficient Packaging

– 8-pin SOIC/VSOP 150/208-mil

– 16-pin SOIC 300-mil

– 8-pin PDIP 300-mil

– 8-pad WSON 6x5-mm/8x6-mm

– 8-pad XSON 4x4-mm

– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)

– Contact Winbond for KGD and other options

Note: 1. Hardware /RESET pin is only available on SOIC-16 & TFBGA packages

2. Please contact Winbond for details.

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