MC55/56 Hardware Interface Description
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MC55/56_hd_v03.03 Page 2 of 106 09.09.2005
Document Name:
MC55/56 Hardware Interface Description
Version:
03.03
Date:
September 09, 2005
DocId:
MC55/56_hd_v03.03
Status:
Confidential / Released
General Notes
Product is deemed accepted by Recipient and is provided without interface to Recipient’s products.
The documentation and/or Product are provided for testing, evaluation, integration and information
purposes. The documentation and/or Product are provided on an “as is” basis only and may contain
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disclaims all warranties, including without limitation any implied warranties of merchantability,
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risk arising out of the use or performance of the Product and documentation remains with Recipient.
This Product is not intended for use in life support appliances, devices or systems where a
malfunction of the product can reasonably be expected to result in personal injury. Applications
incorporating the described product must be designed to be in accordance with the technical
specifications provided in these guidelines. Failure to comply with any of the required procedures can
result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding
the use of mobile technical systems, including GSM products, which also apply to cellular phones
must be followed. Siemens or its suppliers shall, regardless of any legal theory upon which the claim
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the German Product Liability Act, in case of intent, gross negligence, injury of life, body or health, or
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proof to the detriment of the Recipient. Subject to change without notice at any time. The interpretation
of this general note shall be governed and construed according to German law without reference to
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Copyright
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are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design.
Copyright © Siemens AG 2005
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Contents
0 Document history..........................................................................................................7
1 Introduction.................................................................................................................10
1.1 Related documents..............................................................................................10
1.2 Terms and abbreviations .....................................................................................11
1.3 Type approval ......................................................................................................14
1.4 Safety precautions ...............................................................................................16
2 Product concept..........................................................................................................18
2.1 MC55/56 key features at a glance .......................................................................19
2.2 Circuit concept .....................................................................................................22
3 Application Interface...................................................................................................23
3.1 Operating modes .................................................................................................24
3.2 Power supply .......................................................................................................26
3.2.1 Power supply pins on the board-to-board connector .............................26
3.2.2 Minimizing power losses........................................................................27
3.2.3 Monitoring power supply........................................................................27
3.3 Power up / down scenarios..................................................................................28
3.3.1 Turn on MC55/56 ...................................................................................28
3.3.1.1 Turn on MC55/56 using the ignition line /IGT (Power on)......................29
3.3.1.2 Timing of the ignition process ................................................................30
3.3.1.3 Turn on MC55/56 using the POWER signal ..........................................31
3.3.1.4 Turn on MC55/56 using the RTC (Alarm mode) ....................................31
3.3.2 Turn off MC55/56 ...................................................................................33
3.3.2.1 Turn off MC55/56 using AT command ...................................................33
3.3.2.2 Emergency shutdown using /EMERGOFF pin.......................................34
3.3.3 Automatic shutdown...............................................................................35
3.3.3.1 Temperature dependent shutdown ........................................................35
3.3.3.2 Temperature control during emergency call ..........................................36
3.3.3.3 Undervoltage shutdown if battery NTC is present .................................36
3.3.3.4 Undervoltage shutdown if no battery NTC is present ............................37
3.3.3.5 Overvoltage shutdown ...........................................................................37
3.4 Automatic GPRS Multislot Class change.............................................................38
3.5 Charging control ..................................................................................................39
3.5.1 Battery pack characteristics...................................................................40
3.5.2 Implemented charging technique...........................................................42
3.5.3 Operating modes during charging..........................................................43
3.5.4 Charger requirements ............................................................................44
3.6 Power saving .......................................................................................................45
3.6.1 No power saving (AT+CFUN=1) ............................................................45
3.6.2 NON-CYCLIC SLEEP mode (AT+CFUN=0)..........................................45
3.6.3 CYCLIC SLEEP mode (AT+CFUN=5, 6, 7, 8) .......................................46
3.6.4 CYCLIC SLEEP mode AT+CFUN=9 .....................................................46
3.6.5 Timing of the /CTS signal in CYCLIC SLEEP modes ............................46
3.6.6 Wake up MC55/56 from SLEEP mode ..................................................48
3.6.6.1 Wake-up via /RTS0 and RTS1 (if AT+CFUN=0 or AT+CFUN=9)..........49
3.7 Summary of state transitions (except SLEEP mode)...........................................50
3.8 RTC backup.........................................................................................................51
3.9 Serial interfaces ...................................................................................................52
3.9.1 Features supported on first and second serial interface........................53
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3.10 Audio interfaces ...................................................................................................55
3.10.1 Microphone circuit..................................................................................56
3.10.2 Speech processing ................................................................................57
3.10.3 DAI timing ..............................................................................................57
3.11 SIM interface........................................................................................................59
3.11.1 Requirements for using the CCIN pin ....................................................60
3.11.2 Design considerations for SIM card holder............................................61
3.12 Control signals .....................................................................................................62
3.12.1 Inputs .....................................................................................................62
3.12.2 Outputs ..................................................................................................63
3.12.2.1 Synchronization signal...........................................................................63
3.12.2.2 Using the SYNC pin to control a status LED..........................................64
3.12.2.3 Behavior of the /RING0 line (ASC0 interface only)................................66
4 Antenna interface........................................................................................................67
4.1 Antenna installation .............................................................................................67
4.1.1 Antenna pad...........................................................................................69
4.1.1.1 Suitable cable types...............................................................................69
4.1.2 Hirose antenna connector......................................................................70
5 Electrical, reliability and radio characteristics.........................................................74
5.1 Absolute maximum ratings ..................................................................................74
5.2 Operating temperatures.......................................................................................74
5.3 Storage Conditions ..............................................................................................75
5.4 Reliability Characteristics.....................................................................................76
5.5 Electrical specifications of the application interface.............................................77
5.6 Power supply ratings ...........................................................................................82
5.6.1 Current consumption during transmit burst............................................83
5.7 Electrical characteristics of the voiceband part....................................................88
5.7.1 Setting audio parameters by AT commands..........................................88
5.7.2 Audio programming model.....................................................................89
5.7.3 Characteristics of audio modes..............................................................90
5.7.4 Voiceband receive path .........................................................................91
5.7.5 Voiceband transmit path ........................................................................92
5.8 Air interface..........................................................................................................93
5.9 Electrostatic discharge.........................................................................................94
6 Mechanics....................................................................................................................95
6.1 Mechanical dimensions of MC55/56....................................................................95
6.2 Mounting MC55/56 onto the application platform ................................................97
6.3 Board-to-board connector....................................................................................98
6.3.1 Mechanical dimensions of the Hirose DF12 connector..........................99
6.3.2 Adapter cabling......................................................................................99
7 Reference Approval ..................................................................................................100
7.1 Reference Equipment for Type Approval...........................................................100
7.2 Compliance with FCC Rules and Regulations (MC55 only) ..............................101
7.3 Compliance with FCC Rules and Regulations (MC56 only) ..............................102
8 Design example.........................................................................................................103
9 List of parts and accessories...................................................................................105
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Figures
Figure 1: MC55/56 block diagram .......................................................................................... 22
Figure 2: Power supply limits during transmit burst................................................................ 27
Figure 3: Power-on by ignition signal ..................................................................................... 29
Figure 4: Timing of power-on process if VDDLP is not used.................................................. 30
Figure 5: Timing of power-on process if VDDLP is fed from external source......................... 31
Figure 6: Deactivating GSM engine by /EMERGOFF signal.................................................. 34
Figure 7: Schematic of approved charging transistor, trickle charging and ESD protection ..39
Figure 8: Battery pack circuit diagram....................................................................................40
Figure 9: Charging process .................................................................................................... 42
Figure 10: Timing of /CTS signal (example for a 2.12 s paging cycle)................................... 47
Figure 11: Beginning of power saving if CFUN=5 or 7........................................................... 47
Figure 12: RTC supply from capacitor.................................................................................... 51
Figure 13: RTC supply from rechargeable battery .................................................................51
Figure 14: RTC supply from non-chargeable battery .............................................................51
Figure 15: Serial interfaces ....................................................................................................52
Figure 16: Audio block diagram.............................................................................................. 55
Figure 17: Schematic of microphone inputs ........................................................................... 56
Figure 18: DAI timing on transmit path................................................................................... 58
Figure 19: DAI timing on receive path .................................................................................... 58
Figure 20: SIM card holder of DSB45 Support Box................................................................61
Figure 21: Pin numbers of Molex SIM card holder on DSB45 Support Box........................... 61
Figure 22: SYNC signal during transmit burst ........................................................................ 63
Figure 23: LED Circuit (Example)...........................................................................................65
Figure 24: Incoming voice call................................................................................................66
Figure 25: URC transmission ................................................................................................. 66
Figure 26: U.FL-R-SMT connector ......................................................................................... 67
Figure 27: Antenna pad and GND plane ................................................................................ 67
Figure 28: Never use antenna connector and antenna pad at the same time ....................... 68
Figure 29: Restricted area around antenna pad..................................................................... 68
Figure 30: Mechanical dimensions of U.FL-R-SMT connector...............................................70
Figure 31: U.FL-R-SMT connector with U.FL-LP-040 plug ....................................................71
Figure 32: U.FL-R-SMT connector with U.FL-LP-066 plug ....................................................71
Figure 33: Specifications of U.FL-LP-(V)-040(01) plug .......................................................... 72
Figure 34: Pin assignment (top view on MC55/56) ................................................................ 77
Figure 35: Typical current consumption vs. PCL in EGSM 900 network................................ 83
Figure 36: Typical current consumption vs. PCL in GSM 1800 network ................................ 84
Figure 37: Typical current consumption PCL in GSM 1900 network...................................... 84
Figure 38: Peak current consumption during transmit burst vs. PCL in EGSM 900 network . 85
Figure 39: Peak current consumption during transmit burst vs. PCL in GSM 1800 network .85
Figure 40: Peak current consumption during transmit burst PCL in GSM 1900 network ....... 86
Figure 41: Typical current consumption vs. return loss.......................................................... 87
Figure 42: Audio programming model ....................................................................................89
Figure 43: MC55/56 – top view ..............................................................................................95
Figure 44: MC55/56 bottom view ........................................................................................... 95
Figure 45: Mechanical dimensions of MC55/56 ..................................................................... 96
Figure 46: Hirose DF12C receptacle on MC55/56 .................................................................98
Figure 47: Header Hirose DF12 series................................................................................... 98
Figure 48: Mechanical dimensions of Hirose DF12 connector............................................... 99
Figure 49: Reference equipment for approval...................................................................... 100
Figure 50: Schematic diagram of MC55/56 sample application ...........................................104
