Section number Title Page
5.10 Serial Downloader Boot................................................................................................................................................181
5.11 SD/MMC manufacture mode........................................................................................................................................183
Chapter 6
Debug Architecture
6.1 Chip debug architecture................................................................................................................................................ 185
6.2 Functional description...................................................................................................................................................186
6.3 JTAG topology..............................................................................................................................................................189
Chapter 7
Fusemap
7.1 Overview.......................................................................................................................................................................193
7.2 Fusemap........................................................................................................................................................................195
Chapter 8
Clocking
8.1 Introduction...................................................................................................................................................................203
8.2 Clocks........................................................................................................................................................................... 204
8.3 Main Clock Gating Control.......................................................................................................................................... 204
8.4 Low Power Clock Gating Control................................................................................................................................ 205
8.5 Clocking Guide.............................................................................................................................................................207
8.6 A35 Subsystem............................................................................................................................................................. 211
8.7 Audio DMA (ADMA) Subsystem................................................................................................................................213
8.8 CM4 Subsystem............................................................................................................................................................323
8.9 Connectivity Subsystem............................................................................................................................................... 338
8.10 DB Subsystem...............................................................................................................................................................373
8.11 Display, Imaging, and Camera Subsystems Clocking..................................................................................................391
8.12 DRAM Subsystem........................................................................................................................................................ 493
8.13 GPU Subsystem............................................................................................................................................................ 506
8.14 High Speed I/O (HSIO) Subsystem.............................................................................................................................. 508
8.15 Low Speed I/o (LSIO) Subsystem................................................................................................................................ 521
8.16 System Controller Unit (SCU)......................................................................................................................................630
8.17 VPU Subsystem............................................................................................................................................................ 649
i.MX 8DualX/8DualXPlus/8QuadXPlus Applications Processor Reference Manual, Rev. 0, 05/2020
4 NXP Semiconductors