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超微X11SPD-F主板用户手册
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USER’S MANUAL
Revision 1.0
X11SPD-F
The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class B digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision: 1.0
Release Date: July 16, 2019
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2019 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.
!
3
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians, and knowledgeable end users.
It provides information for the installation and use of the X11SPD-F motherboard.
About This Motherboard
The Super X11SPD-F motherboard supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx and
82xx/62xx/52xx/42xx/32xx series (Socket P0-LGA 3647). The X11SPD-F provides maximum
performance and is designed for 3U 8-node Micro Cloud servers with up to 2NVMe/SAS3/
SATA3 per node. Built with the Intel PCH C621, this motherboard supports 4-DIMM DDR4
ECC 3DS LRDIMM with speeds of up to 2933MHz and a capacity of up to 512GB. It features
a PCI-e 3.0 x 8 (MicroLP), one PCI-e 3.0 x 16, and a two M.2 2280 NVMe/SATA connectors
onboard. The X11SPD-F is optimized for high-performance computing, supporting many
onboard features that address the needs of next generation server applications. Please note
that this motherboard is intended to be installed and serviced by professional technicians
only. For processor/memory updates, please refer to our website at http://www.supermicro.
com/products/.
Manual Organization
Chapter 1 describes the features, specications and performance of the motherboard, and
provides detailed information on the C621 chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when installing the
processor, memory modules, and other hardware components into the system.
If you encounter any problems, see Chapter 3, which describes troubleshooting procedures
for video, memory, and system setup stored in the CMOS.
Chapter 4 includes an introduction to the BIOS, and provides detailed information on running
the CMOS Setup utility.
Appendix A provides UEFI BIOS Error Beep Codes.
Appendix B lists software program installation instructions.
Appendix C lists standardized warning statements in various languages.
Appendix D provides UEFI BIOS Recovery instructions.
4
Super X11SPD-F User's Manual
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website: www.supermicro.com.tw
5
Table of Contents
Chapter 1 Introduction
1.1 Checklist ...............................................................................................................................8
Quick Reference Table ...................................................................................................... 11
Motherboard Features .......................................................................................................12
1.2 Processor and Chipset Overview .......................................................................................15
1.3 Special Features ................................................................................................................16
Recovery from AC Power Loss .........................................................................................16
1.4 System Health Monitoring ..................................................................................................16
Onboard Voltage Monitors ................................................................................................16
Fan Status Monitor with Firmware Control .......................................................................16
Environmental Temperature Control .................................................................................16
System Resource Alert......................................................................................................17
1.5 ACPI Features ....................................................................................................................17
1.6 Power Supply .....................................................................................................................17
1.7 Super I/O ............................................................................................................................17
1.8 Advanced Power Management ..........................................................................................18
Intel
®
Intelligent Power Node Manager (IPNM).................................................................18
Management Engine (ME) ................................................................................................18
Chapter 2 Installation
2.1 Static-Sensitive Devices .....................................................................................................19
Precautions .......................................................................................................................19
Unpacking .........................................................................................................................19
2.2 Processor and Heatsink Installation ...................................................................................20
The Intel Xeon 81xx/61xx/51xx/41xx/31xx and the 82xx/62xx/52xx/42xx/32xx Series
Processors ........................................................................................................................20
Overview of the Processor Carrier Assembly ...................................................................21
Overview of the CPU Socket ............................................................................................21
Overview of the Processor Heatsink Module ....................................................................22
Creating the Non-F Model Processor Carrier Assembly...................................................23
Assembling the Processor Heatsink Module ....................................................................24
Preparing the CPU Socket for Installation ........................................................................25
Installing the Processor Heatsink Module .........................................................................26
Removing the Processor Heatsink Module .......................................................................27
Table of Contents
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