没有合适的资源?快使用搜索试试~ 我知道了~
CPCI 规范3.0
5星 · 超过95%的资源 需积分: 50 154 下载量 111 浏览量
2019-03-08
14:32:21
上传
评论 2
收藏 8.98MB PDF 举报
温馨提示
试读
471页
详细描述了CPCI V3.0的电气和结构规范,其中对连接器和板卡、背板、面板、导槽进行了详细定义,电气部分对具体管脚、时钟阻抗等都详细定义,非常全面。
资源详情
资源评论
资源推荐
AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
® Copyright 2003-2004, PCI Industrial Computer Manufacturers Group.
The attention of adopters is directed to the possibility that compliance with or adoption of PICMG
®
specifications may require use of an invention
covered by patent rights. PICMG
®
shall not be responsible for identifying patents for which a license may be required by any PICMG
®
specification or
for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG
®
specifications are prospective
and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.
NOTICE:
The information contained in this document is subject to change without notice. The material in this document details a PICMG
®
specification in
accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this
specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG
®
MAKES NO WARRANTY OF ANY KIND,
EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP,
IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.
In no event shall PICMG
®
be liable for errors contained herein or for indirect, incidental, special, consequential, reliance or cover damages, including
loss of profits, revenue, data or use, incurred by any user or any third party.
Compliance with this specification does not absolve manufacturers of AdvancedTCA™ equipment from the requirements of safety and regulatory
agencies (UL, CSA, FCC, IEC, etc.).
The PICMG
®
and CompactPCI
®
names and the PICMG
®
, CompactPCI
®
, and AdvancedTCA
®
logos are registered trademarks and ATCA is a
trademark of the PCI Industrial Computer Manufacturers Group.
All other brand or product names may be trademarks or registered trademarks of their respective holders.
AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004 i
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
Contents
Contents
1 Introduction and objectives ...............................................................................1-1
1.1 Objective ....................................................................................................1-2
1.1.1 Relationship to PICMG® 2.0 family of specifications ....................1-2
1.1.2 Statement of compliance ...............................................................1-3
1.2 Reference documents ................................................................................1-4
1.2.1 Reference specifications ...............................................................1-4
1.2.2 Contact information for reference organizations............................1-6
1.2.3 Environment and regulatory documents........................................1-6
1.3 Contributors................................................................................................1-7
1.4 Special word usage ....................................................................................1-7
1.5 Name and logo usage ................................................................................1-8
1.5.1 Logo use........................................................................................1-8
1.5.2 Trademark policy ...........................................................................1-8
1.6 Signal naming conventions ........................................................................1-9
1.7 Intellectual property ....................................................................................1-9
1.8 Special terms and acronyms ......................................................................1-9
1.9 Dimensions...............................................................................................1-18
2Mechanical...........................................................................................................2-1
2.1 Mechanical overview ..................................................................................2-1
2.1.1 Tolerances.....................................................................................2-4
2.1.2 Standard orientation ......................................................................2-4
2.1.3 Horizontal orientation ....................................................................2-4
2.1.4 Drawing symbols ...........................................................................2-4
2.1.5 Keepout Zones ..............................................................................2-5
2.2 Front Board assembly ................................................................................2-5
2.2.1 Front Board PCB dimensions ........................................................2-5
2.2.2 Front Board PCB thickness ...........................................................2-9
2.2.3 Front Board Pitch and offset..........................................................2-9
2.2.4 Component height .......................................................................2-10
2.2.4.1 Front Board warpage...................................................2-11
2.2.4.2 Front Board stiffening ..................................................2-11
2.2.5 ESD discharge strip.....................................................................2-11
2.2.6 Front Board covers ......................................................................2-13
2.2.7 Front Board Face Plate ...............................................................2-14
2.2.7.1 Front Board Face Plate Handles .................................2-17
2.2.7.2 Front Board Face Plate alignment and safety ground
pin................................................................................2-19
2.2.7.3 Front Board Face Plate retention screws ....................2-20
2.2.7.4 Front Board filler panels ..............................................2-20
2.2.8 LEDs............................................................................................2-20
2.2.8.1 General status LEDs ...................................................2-21
2.2.8.2 Application specific LEDs ............................................2-22
2.2.9 Face Plate labels.........................................................................2-23
2.2.9.1 AdvancedTCA® logo label ..........................................2-23
2.2.9.2 Barcode label...............................................................2-23
2.2.10 Test dimensions ..........................................................................2-23
ii AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
Contents
2.3 RTM assembly .........................................................................................2-25
2.3.1 RTM direct mate to Front Board..................................................2-25
2.3.1.1 RTM PCB thickness ....................................................2-27
2.3.1.2 RTM Pitch and offset ...................................................2-27
2.3.1.3 RTM PCB bow, warp, component height, and
stiffening ......................................................................2-27
2.3.1.4 RTM ESD discharge strip ............................................2-28
2.3.1.5 RTM Face Plate and Covers .......................................2-29
2.3.1.6 RTM Face Plate alignment/GND features ...................2-31
2.3.1.7 RTM retention screws..................................................2-31
2.3.1.8 RTM filler panels..........................................................2-32
2.3.1.9 RTM airflow requirements and direction......................2-32
2.3.1.10 Zone 3 airflow seal ......................................................2-32
2.3.1.11 RTM Zone 3 keying .....................................................2-34
2.3.2 Zone 3 cable bulkhead ................................................................2-34
2.3.3 RTM connection to Zone 3 midplane ..........................................2-35
2.4 Zone 1, 2, and 3 connectors.....................................................................2-37
2.4.1 Zone 1 connector ........................................................................2-37
2.4.1.1 Description...................................................................2-37
2.4.1.2 -48 VDC power circuit definitions ................................2-40
2.4.1.3 Metallic Test Bus circuits .............................................2-41
2.4.1.4 Ringing Generator Bus circuit......................................2-42
2.4.1.5 Shelf management circuit definitions...........................2-43
2.4.2 Zone 2 connectors.......................................................................2-43
2.4.2.1 General description of Zone 2 connectors...................2-44
2.4.2.2 Pin numbering .............................................................2-44
2.4.2.3 Sequential mating........................................................2-44
2.4.3 Zone 3 connectors.......................................................................2-44
2.4.3.1 General description .....................................................2-45
2.4.3.2 Zone 3 connector envelope .........................................2-45
2.4.3.3 Insertion force..............................................................2-47
2.4.3.4 Alignment allowances/gatherability .............................2-47
2.4.4 Front Board and RTM alignment/keying......................................2-47
2.4.4.1 Alignment overview .....................................................2-47
2.4.4.2 Keying overview ..........................................................2-47
2.4.4.3 Zone 1 and Zone 2 keying/alignment ..........................2-49
2.4.4.4 RTM alignment ............................................................2-51
2.4.4.5 Zone 3 alignment and keying ......................................2-54
2.5 Backplanes...............................................................................................2-57
2.5.1 Description ..................................................................................2-58
2.5.2 Connector locations.....................................................................2-59
2.6 Subrack ....................................................................................................2-61
2.6.1 Subrack features .........................................................................2-61
2.6.2 Backplane support bar ................................................................2-67
2.6.3 Subrack interface requirements for Front Boards .......................2-69
2.6.4 Subrack EMC gasketing requirements........................................2-70
2.6.5 Guide Rail requirements..............................................................2-70
2.6.5.1 Front Board and RTM Guide Rail requirements ..........2-70
2.6.5.2 Logical Slot identification .............................................2-72
2.6.5.3 ESD clip position in the Guide Rails ............................2-72
2.6.6 Face Plate alignment and safety ground pin ...............................2-74
2.6.7 Retention screw receptacle .........................................................2-74
AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004 iii
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
Contents
2.6.8 Subrack load carrying capability..................................................2-74
2.6.9 Subrack integrity tests .................................................................2-75
2.6.9.1 Subrack shock and vibration performance ..................2-75
2.6.9.2 Earthquake performance .............................................2-75
2.6.9.3 Flammability ................................................................2-75
2.6.9.4 Shelf climatic test.........................................................2-75
2.6.9.5 Shelf atmosphere test..................................................2-75
2.6.9.6 Insertion cycles............................................................2-75
2.6.10 Physical Slot numbering ..............................................................2-76
2.7 Shelf .........................................................................................................2-76
2.7.1 Shelf types...................................................................................2-76
2.7.2 Shelf width and Shelf height........................................................2-76
2.7.3 Shelf depth ..................................................................................2-76
2.7.4 Air filter provision .........................................................................2-76
2.7.5 ESD wrist strap interface.............................................................2-77
2.7.6 Telco inputs and alarm outputs ...................................................2-78
2.7.6.1 Telco alarm information ...............................................2-78
2.7.6.2 Telco alarm signaling I/O connector example .............2-78
2.7.6.3 Telco alarm electrical specifications ............................2-78
2.7.6.4 Shelf alarm LEDs.........................................................2-79
2.7.7 Cable management .....................................................................2-79
2.7.8 Power entry .................................................................................2-82
2.7.8.1 Power entry space allocation.......................................2-82
2.7.8.2 Position........................................................................2-82
2.7.8.3 Safety ..........................................................................2-82
2.7.8.4 Method.........................................................................2-83
2.7.8.5 Switching .....................................................................2-83
2.7.8.6 Fusing..........................................................................2-83
2.7.8.7 Monitoring....................................................................2-83
2.7.8.8 Power filtering ..............................................................2-83
2.7.9 Shelf mounting hole pattern and location ....................................2-83
2.8 Frame and Subrack references (informative) ...........................................2-84
3 Shelf management ..............................................................................................3-1
3.1 Overview ....................................................................................................3-1
3.1.1 Shelf management architecture ....................................................3-2
3.1.2 Overall relationship with IPMI specification ...................................3-6
3.1.3 Internet Protocol-based services ...................................................3-7
3.1.4 Multi-Tenant architectures .............................................................3-7
3.1.4.1 Multi-Tenant usage model origin ...................................3-7
3.1.4.2 Areas of impact..............................................................3-8
3.1.5 Command and record definition conventions ................................3-8
3.1.5.1 IPMI command definition conventions...........................3-8
3.1.5.2 Type/Length Bytes.......................................................3-10
3.1.5.3 Handling Reserved bits and fields ...............................3-12
3.1.6 IPMI specification clarifications....................................................3-12
3.1.6.1 “Send Message” response format ...............................3-12
3.1.6.2 Calculating MD2 and MD5 checksums........................3-12
3.2 IPM Controller ..........................................................................................3-12
3.2.1 Payload Interface ........................................................................3-13
3.2.2 IPMI event support ......................................................................3-13
3.2.2.1 Guidelines and requirements for FRU sensor events..3-14
iv AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
Contents
3.2.3 Addressing ..................................................................................3-14
3.2.3.1 Hardware Address.......................................................3-14
3.2.3.2 Intelligent Platform Management Bus address............3-15
3.2.3.3 Physical Address .........................................................3-17
3.2.3.4 Shelf addressing..........................................................3-24
3.2.4 Managed FRU operational state management ...........................3-26
3.2.4.1 FRU states and transitions ..........................................3-27
3.2.4.2 FRU Hot Swap commands ..........................................3-33
3.2.4.3 FRU Hot Swap Sensor ................................................3-36
3.2.4.4 Communication Lost....................................................3-41
3.2.4.5 FRU Payload Control...................................................3-44
3.2.4.6 IPM Controller resets...................................................3-45
3.2.5 Front Board Face Plate indicators...............................................3-47
3.2.5.1 BLUE LED ...................................................................3-47
3.2.5.2 LED 1 (mandatory) ......................................................3-48
3.2.5.3 LED 2 (optional)...........................................................3-48
3.2.5.4 LED 3 (optional)...........................................................3-49
3.2.5.5 Application specific LEDs (optional) ............................3-49
3.2.5.6 FRU LED Control commands ......................................3-49
3.3 Shelf Manager ..........................................................................................3-58
3.3.1 Overall Shelf Manager functional requirements ..........................3-60
3.3.1.1 Basic IPMI requirements .............................................3-60
3.3.1.2 Internet Protocol addressing of the Shelf Manager .....3-61
3.3.1.3 IPMI-oriented System Manager communications........3-63
3.3.1.4 AdvancedTCA® extensions to IPMI’s BMC
requirements................................................................3-64
3.3.2 Shelf Manager initialization .........................................................3-66
3.4 Sensor Data Records ...............................................................................3-67
3.4.1 IPM Controller SDR requirements...............................................3-68
3.4.2 Shelf Manager SDR requirements ..............................................3-70
3.4.3 Entities.........................................................................................3-71
3.4.3.1 PICMG Entity IDs ........................................................3-72
3.4.3.2 System and device relative Entities.............................3-72
3.4.3.3 Entity requirements......................................................3-73
3.4.3.4 Example Entities and sensors .....................................3-74
3.5 System Event Logs ..................................................................................3-78
3.6 FRU Information .......................................................................................3-78
3.6.1 FRU Information definitions.........................................................3-78
3.6.2 FRU Information access commands ...........................................3-79
3.6.3 IPM Controller FRU Information ..................................................3-80
3.6.4 Shelf FRU Information.................................................................3-80
3.6.4.1 Locating the Shelf FRU device(s)................................3-81
3.6.4.2 Determining validity of Shelf FRU contents .................3-81
3.6.4.3 Behavior if valid Shelf FRU Device not found or
inaccessible .................................................................3-82
3.6.4.4 Accessing Shelf FRU Information................................3-83
3.6.4.5 Updating Shelf FRU Information..................................3-83
3.7 Electronic Keying......................................................................................3-84
3.7.1 E-Keying process ........................................................................3-84
3.7.2 Point-to-Point E-Keying ...............................................................3-85
3.7.2.1 Point-to-Point Link connectivity ...................................3-85
3.7.2.2 Backplane Point-to-Point Connectivity information......3-86
剩余470页未读,继续阅读
coolroger
- 粉丝: 2
- 资源: 14
上传资源 快速赚钱
- 我的内容管理 展开
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
最新资源
- pta题库答案c语言之排序4统计工龄.zip
- pta题库答案c语言之树结构7堆中的路径.zip
- pta题库答案c语言之树结构3TreeTraversalsAgain.zip
- pta题库答案c语言之树结构2ListLeaves.zip
- pta题库答案c语言之树结构1树的同构.zip
- 基于C++实现民航飞行与地图简易管理系统可执行程序+说明+详细注释.zip
- pta题库答案c语言之复杂度1最大子列和问题.zip
- 三维装箱问题(Three-Dimensional Bin Packing Problem,3D-BPP)是一个经典的组合优化问题
- 以下是一些关于Linux线程同步的基本概念和方法.txt
- 以下是一个简化的示例,它使用pygame库来模拟烟花动画的框架.txt
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功
评论1