3.5.6 66MHz 热插拔........................................................................................................................................18
3.6 系统和适配板接地............................................................................................................................................18
3.6.1 适配器前面板接地需求.........................................................................................................................18
3.6.2 背板接地需求.........................................................................................................................................19
3.7 CPCI 缓冲器模型..............................................................................................................................................19
4 机械需求.......................................................................................................................................................................19
4.1 适配板需求........................................................................................................................................................19
4.1.1 3U 板卡...................................................................................................................................................19
4.1.2 6U 板卡...................................................................................................................................................19
4.1.3 后面板 I/O 板卡......................................................................................................................................20
4.1.4 ESD 静电导出条....................................................................................................................................20
4.1.5 ESD 接线柱............................................................................................................................................21
4.1.6 剖视图.....................................................................................................................................................21
4.1.7 构件略图和翘曲(Component outline and warpage)........................................................................21
4.1.8 焊料侧盖.................................................................................................................................................21
4.1.9 前面板.....................................................................................................................................................30
4.1.10 系统槽识别...........................................................................................................................................30
4.2 后面板 I/O 适配器需求.....................................................................................................................................30
4.2.1 机械部件.................................................................................................................................................31
4.2.2 电源.........................................................................................................................................................34
4.2.3 后面板按键.............................................................................................................................................34
4.3 背板需求............................................................................................................................................................34
4.3.1 连接器位置.............................................................................................................................................34
4.3.2 槽间距.....................................................................................................................................................35
4.3.3 插槽标号.................................................................................................................................................35
4.3.4 总线段.....................................................................................................................................................35
4.3.5 背板尺寸.................................................................................................................................................35
5 连接器实现...................................................................................................................................................................38
5.1 概述....................................................................................................................................................................38
5.1.1 连接器位置.............................................................................................................................................38
5.1.2 构架类型.................................................................................................................................................39
5.1.3 连接器末端长.........................................................................................................................................39
5.1.4 背板/板卡可选数量................................................................................................................................39
5.2 J1(32 位 PCI 信号)........................................................................................................................................39
5.3 J2 连接器............................................................................................................................................................39
5.3.1 外围槽 64 位 PCI....................................................................................................................................40
5.3.2 外围槽后面 I/O.......................................................................................................................................40
5.3.3 系统槽 64 位 PCI....................................................................................................................................40
5.3.4 系统槽后面 I/O.......................................................................................................................................40
5.4 预留的通信引脚................................................................................................................................................40
5.5 预留的非通信引脚............................................................................................................................................40
5.6 电源引脚............................................................................................................................................................40
5.7 5V/3.3V PCI 按键..............................................................................................................................................41
5.8 引脚分配............................................................................................................................................................41
CPCI 手册的修订史........................................................................................................................................................46
附录..................................................................................................................................................................................46