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ETSI TS 102 671
V11.0.0 (2018-08)
Smart Cards;
Machine to Machine UICC;
Physical and logical characteristics
(Release 11)
TECHNICAL SPECIFICATION
ETSI
ETSI TS 102 671 V11.0.0 (2018
-
08)
2
Release 11
Reference
RTS/SCP-T090071vb00
Keywords
M2M, MFF
ETSI
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Copyright Notification
No part may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying
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The content of the PDF version shall not be modified without the written authorization of ETSI.
The copyright and the foregoing restriction extend to reproduction in all media.
© ETSI 2018.
All rights reserved.
DECT
TM
, PLUGTESTS
TM
, UMTS
TM
and the ETSI logo are trademarks of ETSI registered for the benefit of its Members.
3GPP
TM
and LTE
TM
are trademarks of ETSI registered for the benefit of its Members and
of the 3GPP Organizational Partners.
oneM2M logo is protected for the benefit of its Members.
GSM
®
and the GSM logo are trademarks registered and owned by the GSM Association.
ETSI
ETSI TS 102 671 V1
1.0.0 (2018
-
08)
3
Release 11
Contents
Intellectual Property Rights ................................................................................................................................ 5
Foreword ............................................................................................................................................................. 5
Modal verbs terminology .................................................................................................................................... 5
1 Scope ........................................................................................................................................................ 6
2 References ................................................................................................................................................ 6
2.1 Normative references ......................................................................................................................................... 6
2.2 Informative references ........................................................................................................................................ 7
3 Definitions and abbreviations ................................................................................................................... 7
3.1 Definitions .......................................................................................................................................................... 7
3.2 Abbreviations ..................................................................................................................................................... 7
4 Overview .................................................................................................................................................. 8
5 Definition of Environmental Classes........................................................................................................ 8
5.1 Environmental condition classification system .................................................................................................. 8
5.2 Operational and Storage Temperature (TX) ....................................................................................................... 8
5.2.0 Overview ...................................................................................................................................................... 8
5.2.1 Temperature (TS) -25 °C to +85 °C .............................................................................................................. 9
5.2.2 Temperature (TA) -40 °C to +85 °C ............................................................................................................. 9
5.2.3 Temperature (TB) -40 °C to +105 °C ........................................................................................................... 9
5.2.4 Temperature (TC) -40 °C to +125 °C ........................................................................................................... 9
5.3 Moisture/Reflow conditions (MX) ..................................................................................................................... 9
5.3.0 Overview ...................................................................................................................................................... 9
5.3.1 Moisture/Reflow conditions (MA) ............................................................................................................... 9
5.4 Humidity (HX) ................................................................................................................................................... 9
5.4.0 Overview ...................................................................................................................................................... 9
5.4.1 Humidity (class HA) - High humidity .......................................................................................................... 9
5.5 Corrosion (CX) ................................................................................................................................................. 10
5.5.0 Overview .................................................................................................................................................... 10
5.5.1 Corrosion (CA to CD) - Salt atmosphere .................................................................................................... 10
5.6 Vibration (VX) ................................................................................................................................................. 10
5.6.0 Overview .................................................................................................................................................... 10
5.6.1 Vibration (VA) - Automotive vibration ...................................................................................................... 10
5.7 Void .................................................................................................................................................................. 10
5.8 Shock (SX) ....................................................................................................................................................... 10
5.8.0 Overview .................................................................................................................................................... 10
5.8.1 Shock (SA) - Automotive shock ................................................................................................................. 10
5.9 Data Retention Time (RX) ............................................................................................................................... 10
5.9.0 Overview .................................................................................................................................................... 10
5.9.1 Data Retention Time (RA) - 10 years ......................................................................................................... 11
5.9.2 Data Retention Time (RB) - 12 years ......................................................................................................... 11
5.9.3 Data Retention Time (RC) - 15 years ......................................................................................................... 11
5.10 Minimum Updates (UX) .................................................................................................................................. 11
5.10.0 Overview .................................................................................................................................................... 11
5.10.1 Minimum Updates (UA) - 100 000 ............................................................................................................. 11
5.10.2 Minimum Updates (UB) - 500 000 ............................................................................................................. 11
5.10.3 Minimum Updates (UC) - 1 000 000 .......................................................................................................... 11
6 M2M UICC - Physical Characteristics ................................................................................................... 11
6.0 Basic requirements ........................................................................................................................................... 11
6.1 General M2M UICC physical characteristics ................................................................................................... 11
6.1.0 Introduction................................................................................................................................................. 11
6.1.1 Contacts ...................................................................................................................................................... 12
6.2 Specific MFF physical characteristics .............................................................................................................. 12
6.2.0 Introduction................................................................................................................................................. 12
6.2.1 MFF1 .......................................................................................................................................................... 12
ETSI
ETSI TS 102 671 V11.0.0 (2018
-
08)
4
Release 11
6.2.1.0 Dimensions............................................................................................................................................ 12
6.2.1.1 Orientation mark for the bottom of the package ................................................................................... 13
6.2.1.2 Orientation mark for top of package ..................................................................................................... 14
6.2.2 MFF2 .......................................................................................................................................................... 14
6.2.2.1 Dimensions............................................................................................................................................ 14
6.2.2.1 Orientation mark for the bottom of the package ................................................................................... 15
6.2.2.2 Orientation mark for top of package ..................................................................................................... 15
7 Electrical and Logical specifications of the MFF UICC - Terminal interface ....................................... 15
7.0 Requirements .................................................................................................................................................... 15
7.1 Voltage Class support ....................................................................................................................................... 15
8 Device Pairing Mechanism .................................................................................................................... 15
8.0 Introduction ...................................................................................................................................................... 15
8.1 Secure Channel Pairing .................................................................................................................................... 15
8.2 CAT application pairing ................................................................................................................................... 16
Annex A (informative): PCB layout for the MFF ................................................................................ 17
Annex B (informative): Change history ............................................................................................... 19
History .............................................................................................................................................................. 20
剩余19页未读,继续阅读
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