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ETSI TS 102 671

V12.0.1 (2018-07)

Smart Cards;

Machine to Machine UICC;

Physical and logical characteristics

(Release 12)

TECHNICAL SPECIFICATION

ETSI

ETSI TS 102 671 V12.0.1 (2018

07)

Release 12

Reference

RTS/SCP-T090071vc01

Keywords

M2M, MFF

ETSI

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Important notice

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DECT

, PLUGTESTS

, UMTS

and the ETSI logo are trademarks of ETSI registered for the benefit of its Members.

3GPP

and LTE

are trademarks of ETSI registered for the benefit of its Members and

of the 3GPP Organizational Partners.

oneM2M logo is protected for the benefit of its Members.

GSM

and the GSM logo are trademarks registered and owned by the GSM Association.

ETSI

ETSI TS 102 671 V12.0.1 (2

018

07)

Release 12

Contents

Intellectual Property Rights ................................................................................................................................ 5

Foreword ............................................................................................................................................................. 5

Modal verbs terminology .................................................................................................................................... 5

1 Scope ........................................................................................................................................................ 6

2 References ................................................................................................................................................ 6

2.1 Normative references ......................................................................................................................................... 6

2.2 Informative references ........................................................................................................................................ 7

3 Definitions and abbreviations ................................................................................................................... 7

3.1 Definitions .......................................................................................................................................................... 7

3.2 Abbreviations ..................................................................................................................................................... 7

4 Overview .................................................................................................................................................. 8

5 Definition of Environmental Classes........................................................................................................ 8

5.1 Environmental condition classification system .................................................................................................. 8

5.1.0 Environmental property indicators ............................................................................................................... 8

5.1.1 Storage of environmental properties ............................................................................................................. 8

5.1.2 EF

ENV-CLASSES

................................................................................................................................................ 9

5.2 Operational and Storage Temperature (TX) ....................................................................................................... 9

5.2.0 Overview ...................................................................................................................................................... 9

5.2.1 Temperature (TS) -25 °C to +85 °C .............................................................................................................. 9

5.2.2 Temperature (TA) -40 °C to +85 °C ............................................................................................................. 9

5.2.3 Temperature (TB) -40 °C to +105 °C ........................................................................................................... 9

5.2.4 Temperature (TC) -40 °C to +125 °C ........................................................................................................... 9

5.3 Moisture/Reflow conditions (MX) ................................................................................................................... 10

5.3.0 Overview .................................................................................................................................................... 10

5.3.1 Moisture/Reflow conditions (MA) ............................................................................................................. 10

5.4 Humidity (HX) ................................................................................................................................................. 10

5.4.0 Overview .................................................................................................................................................... 10

5.4.1 Humidity (class HA) - High humidity ........................................................................................................ 10

5.5 Corrosion (CX) ................................................................................................................................................. 10

5.5.0 Overview .................................................................................................................................................... 10

5.5.1 Corrosion (CA to CD) - Salt atmosphere .................................................................................................... 10

5.6 Vibration (VX) ................................................................................................................................................. 11

5.6.0 Overview .................................................................................................................................................... 11

5.6.1 Vibration (VA) - Automotive vibration ...................................................................................................... 11

5.7 Void .................................................................................................................................................................. 11

5.8 Shock (SX) ....................................................................................................................................................... 11

5.8.0 Overview .................................................................................................................................................... 11

5.8.1 Shock (SA) - Automotive shock ................................................................................................................. 11

5.9 Data Retention Time (RX) ............................................................................................................................... 11

5.9.0 Overview .................................................................................................................................................... 11

5.9.1 Data Retention Time (RA) - 10 years ......................................................................................................... 11

5.9.2 Data Retention Time (RB) - 12 years ......................................................................................................... 11

5.9.3 Data Retention Time (RC) - 15 years ......................................................................................................... 11

5.10 Minimum Updates (UX) .................................................................................................................................. 12

5.10.0 Overview .................................................................................................................................................... 12

5.10.1 Minimum Updates (UA) - 100 000 ............................................................................................................. 12

5.10.2 Minimum Updates (UB) - 500 000 ............................................................................................................. 12

5.10.3 Minimum Updates (UC) - 1 000 000 .......................................................................................................... 12

6 M2M UICC - Physical Characteristics ................................................................................................... 12

6.0 Basic requirements ........................................................................................................................................... 12

6.1 General M2M UICC physical characteristics ................................................................................................... 12

6.1.0 Introduction................................................................................................................................................. 12

6.1.1 Contacts ...................................................................................................................................................... 12

ETSI

ETSI TS 102 671 V12.0.1 (2018

07)

Release 12

6.2 Specific MFF physical characteristics .............................................................................................................. 12

6.2.0 Introduction................................................................................................................................................. 12

6.2.1 MFF1 .......................................................................................................................................................... 13

6.2.1.0 Dimensions............................................................................................................................................ 13

6.2.1.1 Orientation mark for the bottom of the package ................................................................................... 14

6.2.1.2 Orientation mark for top of package ..................................................................................................... 14

6.2.2 MFF2 .......................................................................................................................................................... 15

6.2.2.1 Dimensions............................................................................................................................................ 15

6.2.2.2 Orientation mark for the bottom of the package ................................................................................... 16

6.2.2.3 Orientation mark for top of package ..................................................................................................... 16

7 Electrical and Logical specifications of the MFF UICC - Terminal interface ....................................... 16

7.0 Requirements .................................................................................................................................................... 16

7.1 Voltage Class support ....................................................................................................................................... 16

8 Device Pairing Mechanism .................................................................................................................... 16

8.0 Introduction ...................................................................................................................................................... 16

8.1 Secure Channel Pairing .................................................................................................................................... 16

8.2 CAT application pairing ................................................................................................................................... 17

Annex A (informative): PCB layout for the MFF ................................................................................ 18

Annex B (informative): Change history ............................................................................................... 20

History .............................................................................................................................................................. 21

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