没有合适的资源?快使用搜索试试~ 我知道了~
温馨提示
试读
49页
BK7256是高度集成的Wi-Fi+BLE combo音视频芯片,该芯片集成音视频外设及接口,720P,内置flash,dsp,8Mpsram驱大屏,双核320M,低功耗保活,音频code,回声消除及降噪等。单芯片解决方案,对比传统方案可以省去外挂的Wi-Fi,蓝牙模组,flash及音频code,极具成本优势
资源推荐
资源详情
资源评论
Contents
© 2022 Beken Corporation 2 DS-BK7256-E01 V0.1
Contents
Contents ................................................................................................................................................................................ 2
1. Features ......................................................................................................................................................................... 5
2. Overview ........................................................................................................................................................................ 9
3. Pin Description ............................................................................................................................................................ 10
4. Functional Description ................................................................................................................................................ 18
4.1 Modes of Operation .................................................................................................................................................................... 18
4.2 Wi-Fi/Bluetooth Transceiver ...................................................................................................................................................... 18
4.3 Bluetooth and WLAN Coexistence ........................................................................................................................................... 18
4.4 Clock Management .................................................................................................................................................................... 18
4.5 Reset ............................................................................................................................................................................................ 20
4.6 Power Management ................................................................................................................................................................... 21
4.7 GPIO ............................................................................................................................................................................................ 21
4.8 SPI ................................................................................................................................................................................................ 21
4.9 QSPI ............................................................................................................................................................................................. 21
4.10 UART ........................................................................................................................................................................................... 21
4.11 SD/SDIO ...................................................................................................................................................................................... 22
4.12 I2C ................................................................................................................................................................................................ 22
4.13 USB .............................................................................................................................................................................................. 22
4.14 CAN .............................................................................................................................................................................................. 22
4.15 GDMA .......................................................................................................................................................................................... 23
4.16 DMA2D ........................................................................................................................................................................................ 23
4.17 LCD .............................................................................................................................................................................................. 24
4.18 JPEG ............................................................................................................................................................................................ 25
4.19 Camera Interface ........................................................................................................................................................................ 25
4.20 PWM ............................................................................................................................................................................................ 25
4.20.1 Timer Mode ........................................................................................................................................................................ 26
Contents
© 2022 Beken Corporation 3 DS-BK7256-E01 V0.1
4.20.2 PWM Mode ........................................................................................................................................................................ 26
4.20.3 Capture Mode .................................................................................................................................................................... 27
4.21 I2S ................................................................................................................................................................................................ 27
4.22 Audio Peripherals ....................................................................................................................................................................... 27
4.22.1 Four-Band Digital Equalizer .............................................................................................................................................. 28
4.22.2 Audio ADC and DAC ......................................................................................................................................................... 28
4.22.3 Microphone Input Amplifier ............................................................................................................................................... 28
4.22.4 Audio Amplifier ................................................................................................................................................................... 28
4.23 General Purpose SAR ADC...................................................................................................................................................... 28
4.24 Timers .......................................................................................................................................................................................... 29
4.25 IrDA .............................................................................................................................................................................................. 29
4.26 Temperature Sensor .................................................................................................................................................................. 29
4.27 Touch Sensor .............................................................................................................................................................................. 30
4.28 Security ........................................................................................................................................................................................ 30
4.28.1 General Description ........................................................................................................................................................... 30
4.28.2 Secure Element ................................................................................................................................................................. 30
4.28.3 Flash Security ..................................................................................................................................................................... 30
4.28.4 Secure Boot ........................................................................................................................................................................ 31
4.28.5 Security Lifecycle ............................................................................................................................................................... 31
5. Electrical Characteristics ............................................................................................................................................ 32
5.1 Absolute Maximum Ratings ...................................................................................................................................................... 32
5.2 Recommended Operating Conditions ..................................................................................................................................... 32
5.3 Buck ............................................................................................................................................................................................. 33
5.4 System LDO ................................................................................................................................................................................ 33
5.5 Digital LDO .................................................................................................................................................................................. 33
5.6 Crystal and Reference Clock .................................................................................................................................................... 33
5.7 Current Consumption ................................................................................................................................................................. 34
5.8 WLAN RF Characteristics - Receiver ....................................................................................................................................... 35
5.9 WLAN RF Characteristics - Transmitter .................................................................................................................................. 37
5.10 Bluetooth LE RF Characteristics - Receiver ............................................................................................................................ 38
Contents
© 2022 Beken Corporation 4 DS-BK7256-E01 V0.1
5.11 Bluetooth LE RF Characteristics - Transmitter ........................................................................................................................ 40
5.12 SAR ADC Characteristics .......................................................................................................................................................... 42
6. Package Information .................................................................................................................................................. 43
7. Reflow Soldering Profile ............................................................................................................................................. 45
8. Ordering Information ................................................................................................................................................... 47
Revision History .................................................................................................................................................................. 48
Features
© 2022 Beken Corporation 5 DS-BK7256-E01 V0.1
1. Features
Wi-Fi
• IEEE 802.11b/g/n/ax 1x1 compliant
• 20/40 MHz channel bandwidth for 2.4 GHz
• Supports downlink Multi-User Multiple-Input Multiple-Output (DL MU-MIMO)
• Supports uplink Orthogonal Frequency Division Multiple Access (UL OFDMA)
• Supports individual Target Wake Time (iTWT)
• TX and RX low-density parity check (LDPC) support for extended range
• WPA/WPA2/WPA3-Personal support for enhanced security
• Working mode: STA, AP, Direct
• Concurrent AP + STA
• Integrated BT/WLAN coexistence (PTA)
• TX power up to +18 dBm
• RX sensitivity -99 dBm
Bluetooth
• Dual-mode Bluetooth 5.2 compliant
• Supports Basic Rate (BR), Enhanced Data Rate (EDR) 2 Mbps and 3 Mbps, Low Energy (LE) 1 Mbps, 2 Mbps, and
long range (125 kbps and 500 kbps)
• Advertising extensions
• Bluetooth direction finding: Angle of Arrival (AoA) and Angle of Departure (AoD)
• Supports an antenna array with up to sixteen antennae for precise indoor positioning
Core and Memory
• Dual 32-bit RISC-V MCUs at up to 320 MHz:
- Each core features a double-precision floating point unit (FPU)
- Each core has 32 K ITCM+32K DTCM+64K ICache+16K DCache
- Each core includes a memory protection unit (MPU)
- Each core supports DSP instructions
• EEMBC CoreMark® score: 1 core at 320 MHz: 3.57 CoreMark/MHz
• 4 MB SiP Flash
剩余48页未读,继续阅读
资源评论
小正太浩二
- 粉丝: 185
- 资源: 5908
上传资源 快速赚钱
- 我的内容管理 展开
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功