User’s Manual
www.renesas.com
RH850/F1L Group
User’s Manual: Hardware
Renesas microcontroller
RH850 Family
Apr, 2016Rev.1.33
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
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Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor p
roducts and application examples. You are fully responsible for the incorporation
of these circuits, software,
and inform
ation in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by y
ou
or third
parties arising from the use of these circuits, software, or inform
ation.
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Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any dama
ges
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by you resulting from errors in or omissions from the information in
cluded herein.
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(2012.4)
Notes for CMOS devices
(1) Voltage
application
waveform at input
pin:
Waveform distortion due to input noise or a reflected wave may cause
malfunction. If the input of the CMOS device stays in the area between VIL
(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take
care to prevent chattering noise from entering the device when the input level
is fixed, and also in the transition period when the input level passes through
the area between VIL (MAX) and VIH (MIN).
(2) Handling of
unused input pins:
Unconnected CMOS device inputs can be cause of malfunction. If an input pin
is unconnected, it is possible that an internal input level may be generated due
to noise, etc., causing malfunction. CMOS devices behave differently than
Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or
low by using pull-up or pull-down circuitry. Each unused pin should be
connected to power supply or GND via a resistor if there is a possibility that it
will be an output pin. All handling related to unused pins must be judged
separately for each device and according to related specifications governing
the device.
(3) Precaution
against ESD:
A strong electric field, when exposed to a MOS device, can cause destruction
of the gate oxide and ultimately degrade the device operation. Steps must be
taken to stop generation of static electricity as much as possible, and quickly
dissipate it when it has occurred. Environmental control must be adequate.
When it is dry, a humidifier should be used. It is recommended to avoid using
insulators that easily build up static electricity. Semiconductor devices must be
stored and transported in an anti-static container, static shielding bag or
conductive material. All test and measurement tools including work benches
and floors should be grounded. The operator should be grounded using a
wrist strap. Semiconductor devices must not be touched with bare hands.
Similar precautions need to be taken for PW boards with mounted
semiconductor devices.
(4) Status before
initialization:
Power-on does not necessarily define the initial status of a MOS device.
Immediately after the power source is turned ON, devices with reset functions
have not yet been initialized. Hence, power-on does not guarantee output pin
levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after
power-on for devices with reset functions.
(5) Power ON/OFF
sequence:
In the case of a device that uses different power supplies for the internal
operation and external interface, as a rule, switch on the external power supply
after switching on the internal power supply. When switching the power supply
off, as a rule, switch off the external power supply and then the internal power
supply. Use of the reverse power on/off sequences may result in the
application of an overvoltage to the internal elements of the device, causing
malfunction and degradation of internal elements due to the passage of an
abnormal current. The correct power on/off sequence must be judged
separately for each device and according to related specifications governing
the device.
(6) Input of signal
during power off
state:
Do not input signals or an I/O pull-up power supply while the device is not
powered. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that
passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each
device and according to related specifications governing the device.
How to Use This Manual
Readers This manual is intended for users who wish to understand the functions of the
RH850/F1L and design application systems using the RH850/F1L
microcontrollers.
Purpose This manual is intended to give users an understanding of the hardware
functions of the RH850/F1L shown in the Organization below.
Organization This manual is divided into two parts: Hardware (this manual) and software
(RH850G3K User’s Manual: Software).
How to read this
manual
It is assumed that the readers of this manual have general knowledge in the fields of
electrical engineering, logic circuits, and microcontrollers.
To understand the overall functions of the RH850/F1L.
Read this manual according to the Contents.
To understand the details of an instruction function
See RH850G3K User’s Manual: Software available separately.
The “yyy bit of the xxx register” is described as the “xxx.yyy bit” in this manual.
Note with caution that if “xxx.yyy” is described as is in a program, however, the
compiler/assembler cannot recognize it correctly.
Hardware Software
Pin functions
CPU function
On-chip peripheral functions
Flash memory programming
Overview
Processor Model
Register Reference
Exceptions and Interrupts
Memory Management
Instruction Reference
Reset
Appendix
Conventions Data significance: Higher digits on the left and lower digits on the right
Active low representation: xxx (overscore over pin or signal name)
Memory map address: Higher addresses on the top and lower addresses on the bottom
Note: Footnote for item marked with Note in the text
Caution: Information requiring particular attention
Remark: Supplementary information
Numeric representation: Binary ... xxxx or xxxx
B
Decimal ... xxxx
Hexadecimal ... xxxx
H
Prefix indicating power of 2 (address space, memory capacity):
K (kilo): 2
10
= 1,024
M (mega): 2
20
= 1,024
2
G (giga): 2
30
= 1,024
3
