目录
摘要 ............................................................................I
目录 ...........................................................................II
1 引言 .........................................................................1
1.1 选题的背景...............................................................1
1.2 选题的目的及意义.........................................................1
2 设计的整体方案 ...............................................................2
2.1 设计要求 .................................................................2
2.2 设计的主要内容...........................................................2
2.3 设计性能要求.............................................................2
3 硬件的选择 ...................................................................3
3.1 单片机的选择.............................................................3
3.1.1 AT89S52 的特点及选择原因............................................3
3.1.2 AT89S52 的工作模式及注意事项........................................4
3.2 温度传感器的选择.........................................................4
3.2.1 DS18B20 的特点及选择原因............................................4
3.2.2 控制器对 DS18B20 操作流程：..........................................6
3.3 显示器的选择.............................................................6
4 电路原理 .....................................................................8
4.1 晶振电路与复位电路.......................................................8
4.2 温度采集电路.............................................................9
4.3 显示电路.................................................................9
4.4 报警系统................................................................10
5 程序原理及系统流程图 ........................................................11
5.1 主程序..................................................................11
5.2 读出温度子程序..........................................................11
5.3 温度数据显示子程序......................................................13
5.4 设置报警温度............................................................13
6 软件仿真 ....................................................................14
6.1 软件介绍................................................................14
6.2 仿真过程................................................................14
7 实物的焊接与调试 ............................................................15
8 全文总结 ....................................................................16
8.1 设计总结 ................................................................16
8.2 设计体会 ................................................................16
附录 I 系统电路原理图...........................................................17
附录 II PCB 板 .................................................................17
附录Ⅲ 程序清单 ................................................................18
