AIAGCQI-17：2021（V2)特殊工艺：电子组装制造-焊接系统评估-完整英文版（108页）

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CQl-17

Special Process:

Electronic

Assembly

Manufacturing-Soldering

System

Assessment

2nd

Edition

AIAG~

ABOUT

A/AG

CQl-17

Spe

cial Process: El

tronic

Asse

Manufacturing -

ldering System Assessment

Version 2 Issued Aug

ust

Purpose Statement

Found

82, AIAG is a globally r

d organizati

where OEMs and suppliers unite to

dress and r

olve

ues a

ing the wo

dwide automotive supply chain. AI

als are to reduce cost and complexity through

collabor

ion; im

ove product quali

, promote corpora

ponsibility; and

timi

et throughout the

supply chain.

AIAG O

ization

AIAG is made up

a board

directors, an exe

tive director, executiv

on loan from m

companies,

associate directors, a full-time sta

, and

lunteers serving on p

team

Directors, depa

ment mana

rs, and

program managers plan, dire

and

ordinate the associa

tio

n's

tiviti

the direction

the exe

tive

director.

AIAG Projects

AIAG promotes objectiv

primarily

publishi

stan

rds and

off

ering education

confere

and training.

companies donate the time of volunteers

at AI

in a non-competitive, open forum that is intended

to devel

recommendations, guidelines, and best practices for the overall good

the industry. A listing

current

proje

s can be fou

at www.aiag.org.

A/AG PUBLICATIONS

An A/AG

pub

cation reflects a

nsensus

those

sub

sta

all

y concerned with its s

cop

e a

ovisions. An

A/AG pub

cation is

int

ended as a g

de lo a

the ma

nuf

act

er, the consumer, a

the general

pub

existence of an

A/AG

pub

cation

es not in any respe

eclude

yone from ma

, marketi

rchasing, or usi

products,

ocesses, or

ocedures not conform

g lo the pub

cation.

DISCLAIMER

e Pub

sher

es not

mak

e any representation or wa

ranty, express

imp

ed in relati

any

formation

om this pub

cation, a

e Pub

es n

ass

ume

any

legal

abi

for

e accura

, co

mpl

eteness, or

usefulness

information

om this pu

ication.

CAUTIONARY

NOTICE

A/AG pub

cations are

sub

to periodic re

ew a

rs are cautioned to

obt

ain the latest editions.

MAINTENANCE PROCEDURE

Recognizing that this

A/AG

publ

ion may not cover a

circumstances, A/

has e

ed a mai

enance

pro

dur

e. Pl

eas

e refer to

e Maintenance Request

rm at the back of this document to submit a re

APPROVAL

STAT

Published

by:

Automotive

Industry

Action

Group

4400

Town

Center

Southfield,

Michigan

48075

Phone:

(248)

358-3570 • Fax: (248) 358-3253

e A/AG Qua

ring C

omm

sig

nated

akeholders a

ppro

ved this docume

for pub

cati

August

21.

A/AG

AND

TRADEMARK NOTICE:

Aut

e Industry Acti

Gro

, e

hat

par

S. or slate

vernme

officer or employee

part

the person's official duti es.

noted above, a

rights are reserved

A/AG a

of these materials may

repr

oduc

repr

int

ored in a

ieval system, or transmi

ed, in

any

form or by

any

means, electronic, photoc

opy

, reco

, or otherwise, without the prior

wri

en per

ion of Automotive In

stry Action

. Co

ght i

nfri

ngeme

is a

olation

federal law

sub

criminal a

il penalties.

AIAG and Auto

tive Industry Action Group are registered

rvi

marks of the Au

motive Industry Action Group. Automotive

Industry Action Group makes

claim

any trade

of a third party. Trad

ks of third parties included in these materials are

the property of their respective owner

ISBN #: 978 1

479 9

- 1 -

AIAG~

Table

Contents

CQl-17

Spec

ial Process: Electronic Assemb

Manufacturing -

Soldering System Assessment

Version 2 Issued August 20

ABOU

AIAG

..........

.....

.......................

...............................................

.........

..................

......................................

...........

FORE'\VORD .........

.......

.............

.......................

......................................................

....

...

.................................

...

......

1 Il';"TRODUCTION

....

.........

......................

.............

..........................................................

...................................................

1.1 GE

NERAL

...................................................................................................................................................... 4

1.2 PROCESS APPROACH ..................................................................................................................................... 4

1.3

SOLDERING SYSTEM ASSESSM

ENT

GoALS ........... ......................................................................................... 4

1.4 ASSESS

l'v!EN

T PROCESS .................................................................................................................................. 5

SESSORPROFICIENCY REQ

UIREME

NTS ............ ......................................................................................... 5

1.6 0 THERREQ

lJ'I

REME

NTS

................................................................................................................................. 5

OPE .

.............

.......

....

................................................

....

.....................

...

.......................

......................................

......

2.1 GE

NERAL

...................................................................................................................................................... 7

2.2 APPLICATION ................................................................................................................................................ 7

2.3 REFEREN

................................................................................................................................................... 8

3 INSTRUCTIONS F

COMPLETING SOLDERING

SYS

ASSE

SSM

ENT

........

....

........

3.1

INS

TRUCTIONS

FOR COMPLETING THE COVER SHEET .................................................................................. 10

COVER SHEETFORM ................................................................................................................................................ 12

3 .2 INS

TRUCTIONS

FOR

MPLETING SECTIONS 1 - 3 .......................................................................................

SECTION 1 - M

NAG

EME

NT RESPONSIBILITY

AND

QUALITY PLANNING .................................................................

SECTION 2 - FLOOR

AND

M<\

TERL;\L

HANDLING RESPONSIBILITY ........................................................................... 19

SECTION 3 - EQUIPMENT .........................................................................................................................................

3.3

TRUC

ONS

COMPLET

JOB

AUDIT

AND

VERIFYING

COMPLIANCE

PROCESS

TABLE

ITE

...

SECTION 4 - J

AUDIT ...........................................................................................................................................

PROCESS

TABLEA

- SOLDERPASTE PRINTING

AND

SPI

PECTION .................................................................

TABLE

A -1 - PROCESS PARAMETERS GmDELINES - SOLDER PASTE PRINTING ......................................................

PROCESS

TAB

LE B - SURF

ACE

MOUNT

NENT

PlACE

l'v

!ENT .....................................................................

.34

TABLE

B-1

- PROCESS PARAMETERS G m DEL

ES - SURF ACE

ONE

NT PLACEMENT .........................

PROCESS

TABLE

C - REFLOW

AND

AUTOMATED INSPECTION .............................................................................

TABLE

-1

- PROCESS PARAME

TERS

Gm DELINES - REFLO

OVEN ......................................................................

PROC

TABLED

- ADHESIVE DISPENS

ING

......................................................................................................

PROCESS

TAB

VEISELECT

IVE

SOLDER ................................................................................................. 51

TABLE

E-1

PROCESS PARAMET

ERS

GmDELINES -

VE/

SELECTIVE SOLDERING ..................................................

PROCESS

TABLE

F - A u

TED

(ROBOTIC) IRON

DERING

.........................................................................

PROCESS

TABLE

F-1 - M<\NUAL IRON SOLDERING

L'N

IAN) .............................................................................

PROC

TABLE

G - LASER AND SOFT

AM SOLDERING ..................................................................................

TABLE

G-1

- PROCESS PARAMETERS GUIDEL

INE

S - LASER & SOFT BEAM SOLDERING .........................................

PROC

TABLEH

- INDUCTION

DERING

.....................................................................................................

PROCESS

TABLE

I - PRESS FIT/

MPL

PIN .....................................

.......

......................................

........

TAB

l- 1 PROCESS PARAMETERS GUIDELIN

ES-PRE

SS F IT ....................................................................................

PROC

TABLE

J -

NTAMINATION

NTROL ................................................................................................

TABLE

J-1

PROCESS PARA

TERS

GUIDELINES -

NTAMINATION CONTROL .......................................................

PROC

TABLE

K -

CONFORl'vIAL

COATING Al-H) I

PECTION ...........................................................................

TAB

K-1

PROCESS PARAMETERS GUIDELINES -

CONFORl'vIAL

COATING ..............................................................

PROCESSTABLEL

- PCASEPARATION ..............................................................................................................

TAB

LEL

-1

OCESS

PARA

ERS

GmDELINES - PCA SE

PARATION

......................................................................

PROCESS

TABLEM

- IN-CIRCUIT TES

TIN

G .........................................................................................................

PROC

TABLE

N - FuNCTIONAL TESTING .......................................................................................................

PROCESS

TABLE

0 -

-WORK (REMOVALl'REP

LAC

El'v!ENT

AND

TOUCH-

UP)

....................................................

APPE

l'<

'DIX A GLOSSARY ...............

...

.....

....

...

............................

......................................

...............

........................... 103

- 3 -

- 4 -

CQl-17

Special Process: Electronic Assembly Manufacturing -

Soldering System Assessment

Version 2

sued August 2021

1 INTRODUCTION

1.1 General

AIAG~

The work

preparing CQI-17: Special Process: Electronic Assembly Manufacturing - Soldering System

Assessment (EAM-SSA) was carried out through the AIAG Soldering Work Group. These soldering

requirements are complementary

customer and product standards.

English is the official language

the AI

CQI-17 EAM-SSA.

ere are any inconsistencies or

contradictions as a result

a CQI-17 translation, the English version shall pre

il.

The EAM-SSA can be used to assess

organization's ability to meet the requirements in

assessment, as well as customer, regulatory, and the organization's own requirements. The EAM-SSA can

also be used between an organization and its suppliers.

In the EAM-SSA, the word "shall" indicates a requirement for purposes

the

self

-assessment. The word

"should" indicates a recommendation. Where the terms

uideline" and/or

"su

ch as" are used, any

suggestions giv

are for guidance only.

Compliance to the CQI-17 EAM-SSA is determined

• Ideal

c::

95%

the total number

items checked on the Process Tables assessed (without any

''Needs Immediate Action")

• Acceptable "Satisfactory" (1)

c::

85% and <95%

•

''N

ot Satisfactory" (0) <85%

•

eeds Immediate Action" (

-5

) Any non-compliance to the Process Table items

to customer

specifications/drawings that affect Form, Fit or Function

the Product with Objective Evidence

I Note: Compliance to each Process Table item is rated as

llows:

• Satisfacto1y = 1 point

• Not Satisfactory = 0 points

• Needs Immediate Action =

-5

points

•

Not

Applicable =

rating

1.2 Process

Appr

oach

The EAM-SSA supports the automotive process approach as described in IATF 16949.

1.3

ldering System Assessment Goals

The goal

the EAM-SSA is

e development

a soldering management system that provides for

continual improvement, emphasizing process control, pro-active defect prevention and the reduction

variation and waste in the supply chain (OEM, Tier 1, sub tiers).

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