H9DP32A4jjagr-kem

FEATURES [ CI-MCP ] ● Operation Temperature - -25oC ~ 85oC ● Packcage - 153-ball FBGA - 11.5x13mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND Flash ] ● Packaged NAND flash memory with MultiMediaCard interface ● High capacity memory access ● eMMC/MultiMediaCard system specification, compliant with V4.41 ● Full backward compatibility with previous MultiMediaCard system specification ● Bus mode - High-speed MultiMediaCard protocol. - Three different data bus widths: 1 bit, 4 bits,8 bits. - Data transfer rate: up to 104Mbyte/s - DDR mode supported ● Operating voltage range: - VCCQ = 1.7~1.95V/2.7V~3.6V - VCC = 3.3V ● Error free memory access - Internal error correction code - Internal enhanced data management algorithm (wear levelling, bad block management, garbage collection) - Possibility for the host to make sudden power failure safe-update operations for data content ● Security - Password protection of data - Security Erase - Security Trim - Secure bad block management - Built-in write protection ● Boot - Simple boot sequence method ● Power saving - Enhanced power saving method by introducing sleep functionality ● Partition management with enhanced storage. ● Hardware reset supported [ DDR SDRAM ] ● Double Data Rate architecture - two data transfer per clock cycle ● x32 bus width ● Supply Voltage - VDD / VDDQ = 1.7 - 1.95 V ● Memory Cell Array - 16Mb x 4Bank x 32 I/O x 2 Die ● Bidirectional data strobe (DQS) ● Input data mask signal (DQM) ● Input Clock - Differential Clock Inputs (CK, /CK) ● MRS, EMRS - JEDEC Standard guaranteed ● CAS Latency - Programmable CAS latency 2 or 3 supported ● Burst Length - Programmable burst length 2 / 4 / 8 with both sequen tial and interleave mode