MULTIGIG RT 2, RT 2-R, and RT 3 Signal Connectors .pdf

VPX 连接器资料 This specification covers the requirements for application of MULTIGIG RT 2, RT 2-R, and RT 3 connectors used to interconnect printed circuit (pc) boards. RT 2 and RT 2-R connectors are compliant to the VITA 46 standard for VPX architecture, and TE supports other custom and non-standard MULTIGIG variations. RT 3 is interface compatible with RT 2 and RT 2-R, but utilizes different board footprints with smaller compliant pins and plated thru holes to achieve 16 to 25 Gbps data rates. The connectors consist of end-to-end stackable modules, available in vertical receptacles (backplane application) and right-angle plugs (daughtercard application). Half and full-size connector modules are used within slots of a backplane/plug-in card application. The VITA 46 standard defines connector requirements and OpenVPX standard slot configurations are defined in VITA 65.0 and 65.1.

VITA46.10 RTM.pdf

VITA46.10 RTM ，关于VPX RTM 背板后连接技术。

74hc+4000.zip

74和4000系列逻辑电路目录 型号-功能对照表 便于快速查找型号、设计选型

CCD4096x4096DataSheetRevB.pdf

s a 4096(H) x 4097(V) solid state Charge Coupled Device (CCD) full frame sensor. The CCD is intended for advanced scientific, space, industrial, and commercial digital imaging applications. The CCD486 active area is organized as an array of 4096 horizontal by 4097 vertical imaging elements. The pixel pitch is 15µm with a 100% fill factor. For dark reference, each readout line is preceded by 18 dark pixels. The imager is available in front-illuminated as well as back-illuminated configuration. A split readout architecture has been adopted to facilitate high data rates with simultaneous readout from four output ports, and provides the flexibility to read out the entire image frame from two output ports, or from a single output port to simplify the drive electronics requirements

ccd6161_data_sheet_january_2013.pdf

60mm方形CCD，不是CMOS喔。 a 4096(H) x 4096(V) solid state Charge Coupled Device (CCD) Full Frame sensor. The CCD is intended for advanced scientific, space, industrial, and commercial digital imaging applications. The CCD6161 active area is organized as an array of 4096 horizontal by 4096 vertical imaging elements. In addition to 4096(H) x 4096(V) imaging elements there are 8 peripheral columns on left and right edges of the imaging area to improve non-uniformity at t h e edges. These 16 peripheral columns are not connected to t h e serial register. There are 32 isolation rows on top and bottom of the imaging area and these 64 isolation rows are covered by metal, making the total array 4112(H) x 4160(V). The pixel pitch is 15µm with a 100% fill factor. For dark reference, each readout line is preceded by 18 dark pixels. A split readout architecture has been adopted to facilitate high data rates with simultaneous readout from four output ports, and provides the flexibility to read out the entire image frame from two output ports, or from a single output port to simplify the drive electronics requirements.

data_sheet_ccd9216x9216.pdf

A 9216 x 9216 active element solid state Charge Coupled Device (CCD) Full Frame sensor. The CCD is intended for advanced scientific, space, and aerial reconnaissance applications. The CCD 595 is organized as an array of 9216 horizontal by 9216 vertical imaging elements. The pixel pitch is 8.75um with a 100% fill factor. Three-phase clocking is employed in the imaging area with two-phase clocking in the serial readout registers. Image readout is performed via 4 serial registers containing 19 isolation rows between imaging and readout sections. The imaging array can be clocked unidirectional (4-output configuration) or bidirectional (8-output configuration). The imaging area segments are split in mid-array for the latter configuration. To maximize the exposure/readout cycle rate, concurrent array and serial register clocking is utilized. Fast transfer clocking between the array and serial registers is accomplished with strapped transfer gates that load each line in less than five microseconds.

ATI_FT_Catalog.pdf

The Force/Torque (F/T) sensor system measures the full six components of force and torque (Fx, Fy, Fz, Tx, Ty, Tz) using a monolithic instrumented transducer. The F/T transducer uses silicon strain gages for excellent noise immunity. The use of silicon gages allows the F/T transducer to have high stiffness and increased overload protection. All transducer models are available with Net F/T, DAQ F/T, or Controller F/T interfaces

PCI Express Rev_2.0.zip

设计PICe卡的必要资料 1）PCI Express® Card Electromechanical Specification Revision 2.0 April 11, 2007 2）PCI Express® Base Specification Revision 5.0 Version 1.0 22 May 2019

《工业机器人设计指南》.pdf

机器人是一个非常复杂的系统，在机电一体化和功能性以及 电气方面存在许多设计挑战。在实现一个可行的工作系统 前，您需要解决了这些挑战或做出一些决定。 利用机器人系统的所有不同技术特性，德州仪器 (TI) 的模拟 和嵌入式技术提供了许多不同的产品和设计，可以帮助解决 与机器人有关的问题，实现智能、自主和协作机器人的开发。 这本电子书汇集了技术文章、白皮书和应用手册，它们均包 括有助于帮您设计下一个机器人系统的技术。

WX820LM.pdf 5-in-1 Multi Sander 5合1砂磨机

Use only good quality sandpaper. The sandpaper controls the sanding efficiency, not the amount of force you apply to the tool. Excessive force will reduce the sanding efficiency and cause motor overload. Replacing the sandpaper regularly will maintain optimum sanding efficiency.