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TLE94003EP 英飞凌芯片 INFINEON 中文版规格书手册.pdf
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TLE94003EP 英飞凌芯片 INFINEON 中文版规格书手册
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Datasheet 1 1.0
www.infineon.com 2017-12-07
TLE94003EP
Features
• Three half bridge power outputs
• Very low power consumption in sleep mode
• 3.3V / 5V compatible inputs with hysteresis
• All outputs with overload and short circuit protection
• Direct interface for control and diagnosis
• Overtemperature protection
• Over- and Undervoltage lockout
• Cross-current protection
Potential applications
•HVAC Flap DC motors
• Monostable and bistable relays
• Side mirror x-y adjustment
Product validation
Qualified for Automotive Applications. Product Validation according to AEC-Q100
Description
The TLE94003EP is a protected triple half-bridge driver designed especially for automotive motion control
applications such as side mirror x-y adjustment. It is part of a larger family offering half-bridge drivers from
three outputs to twelve outputs with direct interface or SPI interface.
The half bridge drivers are designed to drive DC motor loads in sequential or parallel operation. Operation
modes forward (cw), reverse (ccw), brake and high impedance are controlled from a direct interface. It offers
diagnosis features such as short circuit, power supply failure and overtemperature detection. In combination
with its low quiescent current, this device is attractive among others for automotive applications. The small
fine pitch exposed pad package, PG-TSDSO-14, provides good thermal performance and reduces PCB-board
space and costs.
Type Package Marking
TLE94003EP PG-TSDSO-14 TLE94003
Datasheet 2 1.0
2017-12-07
TLE94003EP
Table 1 Product Summary
Operating Voltage V
S
5.5 ... 20 V
Logic Supply Voltage V
DD
3.0 ... 5.5 V
Maximum Supply Voltage for Load Dump
Protection
V
S(LD)
40 V
Minimum Overcurrent Threshold I
SD
0.9 A
Maximum On-State Path Resistance at T
j
= 150°C R
DSON(total)_HSx+LSy
1.8 + 1.8 Ω
Typical Quiescent Current at T
j
= 85°C I
SQ
0.1 µA
Datasheet 3 1.0
2017-12-07
TLE94003EP
1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Voltage and current definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 Characterization results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.1 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2 Operation modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2.1 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.3 Reset Behaviour . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.4 Reverse Polarity Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6 Half-Bridge Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.1 Output Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.2 Diagnosis Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.3 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.3.1 Short Circuit of Output to Supply or Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.3.2 Cross-current protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.3.3 Temperature monitoring and shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.3.4 VS Undervoltage Behaviour . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.3.5 VS Overvoltage Behaviour . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.3.6 V
DD
Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.1 Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.2 Thermal application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table of Contents
Datasheet 4 1.0
2017-12-07
TLE94003EP
Pin Configuration
1 Pin Configuration
1.1 Pin Assignment
Figure 1 Pin Configuration TLE94003EP with direct interface
1.2 Pin Definitions and Functions
Pin Symbol Function
1 IN1 Direct input control for power half-bridge 1
2 IN2 Direct input control for power half-bridge 2
3 IN3 Direct input control for power half-bridge 3
4 TEST Test input. This pin can be left open or be terminated to ground
5 VS Main supply voltage for power half bridges.
6OUT 3 Power half-bridge 3
7OUT 1 Power half-bridge 1
8GND Ground
9OUT 2 Power half-bridge 2
10 N.U. Not used. This pin should either be left open or terminated to ground.
11 EN1 Enable input for Half-bridges 1/2 with internal pull-down
12 EN2 Enable input for Half-bridge 3 with internal pull-down
13 EF Error Flag
14 VDD Logic supply voltage
EDP - Exposed Die Pad; For cooling and EMC purposes only - not usable as electrical
ground. Electrical ground must be provided by pins 8.
1)
1) The exposed die pad at the bottom of the package allows better heat dissipation from the device via the PCB. The
exposed pad (EP) must be either left open or connected to GND. It is recommended to connect EP to GND for best
EMC and thermal performance.
IN 1 VDD
IN 2
IN 3
TEST
VS
OUT 3
OUT 1
EN2
EN1
EF
N.U.
OUT 2
GND
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Datasheet 5 1.0
2017-12-07
TLE94003EP
Pin Configuration
Note: Not used (N.U.) pins and unused outputs are recommended to be left unconnected (open) on the
application board. If N.U. pins or unused output pins are routed to an external connector which
leaves the PCB, then these outputs should have provision for a zero ohm jumper (depopulated if
unused) or ESD protection. In other words, they should be treated like used pins.
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