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TI dm3730 datasheet The DM37x generation of high-performance, digital media processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:
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DM3730, DM3725
www.ti.com
SPRS685C–AUGUST 2010–REVISED JANUARY 2011
DM3730, DM3725
Digital Media Processors
Check for Samples: DM3730, DM3725
1 DM3730, DM3725 Digital Media Processors
1.1 Features
123456
• Load-Store Architecture With
• DM3730/25 Digital Media Processors:
Non-Aligned Support
– Compatible with OMAP™ 3 Architecture
• 64 32-Bit General-Purpose Registers
– ARM
®
Microprocessor (MPU) Subsystem
• Instruction Packing Reduces Code Size
• Up to 1-GHz ARM
®
Cortex™-A8 Core
• All Instructions Conditional
Also supports 300, 600, and 800-MHz
operation • Additional C64x+
TM
Enhancements
• NEON™ SIMD Coprocessor – Protected Mode Operation
– High Performance Image, Video, Audio – Expectations Support for Error
(IVA2.2
TM
) Accelerator Subsystem Detection and Program Redirection
• Up to 800-MHz TMS320C64x+
TM
DSP Core – Hardware Support for Modulo Loop
Also supports 260, 520, and 660-MHz Operation
operation
– C64x+
TM
L1/L2 Memory Architecture
• Enhanced Direct Memory Access (EDMA)
• 32K-Byte L1P Program RAM/Cache
Controller (128 Independent Channels)
(Direct Mapped)
• Video Hardware Accelerators
• 80K-Byte L1D Data RAM/Cache (2-Way
– POWERVR SGX™ Graphics Accelerator Set- Associative)
(DM3730 only)
• 64K-Byte L2 Unified Mapped RAM/Cache
• Tile Based Architecture Delivering up to (4- Way Set-Associative)
20 MPoly/sec
• 32K-Byte L2 Shared SRAM and 16K-Byte
• Universal Scalable Shader Engine: L2 ROM
Multi-threaded Engine Incorporating Pixel
– C64x+
TM
Instruction Set Features
and Vertex Shader Functionality
• Byte-Addressable (8-/16-/32-/64-Bit Data)
• Industry Standard API Support:
• 8-Bit Overflow Protection
OpenGLES 1.1 and 2.0, OpenVG1.0
• Bit-Field Extract, Set, Clear
• Fine Grained Task Switching, Load
• Normalization, Saturation, Bit-Counting
Balancing, and Power Management
• Compact 16-Bit Instructions
• Programmable High Quality Image
• Additional Instructions to Support
Anti-Aliasing
Complex Multiplies
– Advanced Very-Long-Instruction-Word
– External Memory Interfaces:
(VLIW) TMS320C64x+
TM
DSP Core
• SDRAM Controller (SDRC)
• Eight Highly Independent Functional
– 16, 32-bit Memory Controller With
Units
1G-Byte Total Address Space
• Six ALUs (32-/40-Bit); Each Supports
– Interfaces to Low-Power SDRAM
Single 32- bit, Dual 16-bit, or Quad 8-bit,
– SDRAM Memory Scheduler (SMS) and
Arithmetic per Clock Cycle
Rotation Engine
• Two Multipliers Support Four 16 x 16-Bit
• General Purpose Memory Controller
Multiplies (32-Bit Results) per Clock
(GPMC)
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit
Results) per Clock Cycle
– 16-bit Wide Multiplexed Address/Data
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2POWERVR SGX is a trademark of Imagination Technologies Ltd.
3OMAP is a trademark of Texas Instruments.
4Cortex, NEON are trademarks of ARM Limited.
5ARM is a registered trademark of ARM Ltd.
6All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DM3730, DM3725
SPRS685C–AUGUST 2010–REVISED JANUARY 2011
www.ti.com
Bus • Glueless Interface to Common Video
Decoders
– Up to 8 Chip Select Pins With
128M-Byte Address Space per Chip • Resize Engine
Select Pin
– Resize Images From 1/4x to 4x
– Glueless Interface to NOR Flash,
– Separate Horizontal/Vertical Control
NAND Flash (With ECC Hamming
– System Direct Memory Access (SDMA)
Code Calculation), SRAM and
Controller (32 Logical Channels With
Pseudo-SRAM
Configurable Priority)
– Flexible Asynchronous Protocol
– Comprehensive Power, Reset, and Clock
Control for Interface to Custom Logic
Management
(FPGA, CPLD, ASICs, etc.)
• SmartReflex
TM
Technology
– Nonmultiplexed Address/Data Mode
• Dynamic Voltage and Frequency Scaling
(Limited 2K-Byte Address Space)
(DVFS)
– 1.8-V I/O and 3.0-V (MMC1 only),
– ARM
®
Cortex™-A8 Core
0.9-V to 1.2-V Adaptive Processor Core
• ARMv7 Architecture
Voltage
– TrustZone
®
0.9-V to 1.1-V Adaptive Core Logic Voltage
– Thumb
®
-2
Note: These are default Operating
Performance Point (OPP) voltages and could
– MMU Enhancements
be optimized to lower values using
• In-Order, Dual-Issue, Superscalar
SmartReflex AVS.
Microprocessor Core
– Commercial, Industrial, and Extended
• NEON Multimedia Architecture
Temperature Grades
• Over 2x Performance of ARMv6 SIMD
– Serial Communication
• Supports Both Integer and Floating Point
• 5 Multichannel Buffered Serial Ports
SIMD
(McBSPs)
• Jazelle
®
RCT Execution Environment
– 512 Byte Transmit/Receive Buffer
Architecture
(McBSP1/3/4/5)
• Dynamic Branch Prediction with Branch
– 5K-Byte Transmit/Receive Buffer
Target Address Cache, Global History
(McBSP2)
Buffer, and 8-Entry Return Stack
– SIDETONE Core Support (McBSP2 and
• Embedded Trace Macrocell (ETM)
3 Only) For Filter, Gain, and Mix
Support for Non-Invasive Debug
Operations
– ARM Cortex-A8 Memory Architecture:
– Direct Interface to I2S and PCM Device
• 32K-Byte Instruction Cache (4-Way
and T Buses
Set-Associative)
– 128 Channel Transmit/Receive Mode
• 32K-Byte Data Cache (4-Way
• Four Master/Slave Multichannel Serial
Set-Associative)
Port Interface (McSPI) Ports
• 256K-Byte L2 Cache
• High-Speed/Full-Speed/Low-Speed USB
– 32K-Byte ROM
OTG Subsystem (12-/8-Pin ULPI Interface)
– 64K-Byte Shared SRAM
• High-Speed/Full-Speed/Low-Speed
– Endianess:
Multiport USB Host Subsystem
• ARM Instructions - Little Endian
– 12-/8-Pin ULPI Interface or 6-/4-/3-Pin
• ARM Data – Configurable
Serial Interface
• DSP Instructions/Data - Little Endian
• One HDQ/1-Wire Interface
• Removable Media Interfaces:
• Four UARTs (One with Infrared Data
– Three Multimedia Card (MMC)/ Secure Digital
Association [IrDA] and Consumer Infrared
(SD) With Secure Data I/O (SDIO)
[CIR] Modes)
• Test Interfaces
• Three Master/Slave High-Speed
Inter-Integrated Circuit (I2C) Controllers
– IEEE-1149.1 (JTAG) Boundary-Scan
Compatible
– Camera Image Signal Processing (ISP)
– Embedded Trace Macro Interface (ETM)
• CCD and CMOS Imager Interface
– Serial Data Transport Interface (SDTI)
• Memory Data Input
• 12 32-bit General Purpose Timers
• BT.601/BT.656 Digital YCbCr 4:2:2
(8-/10-Bit) Interface
• 2 32-bit Watchdog Timers
2 DM3730, DM3725 Digital Media Processors Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): DM3730 DM3725
DM3730, DM3725
www.ti.com
SPRS685C–AUGUST 2010–REVISED JANUARY 2011
• 1 32-bit Secure Watchdog Timer • Packages:
• 1 32-bit 32-kHz Sync Timer – 515-pin s-PBGA package (CBP Suffix), .5mm
Ball Pitch (Top), .4mm Ball Pitch (Bottom)
• Up to 188 General-Purpose I/O (GPIO) Pins
(Multiplexed With Other Device Functions) – 515-pin s-PBGA package (CBC Suffix),
.65mm Ball Pitch (Top), .5mm Ball Pitch
• 45-nm CMOS Technology
(Bottom)
• Package-On-Package (POP) Implementation for
– 423-pin s-PBGA package (CUS Suffix),
Memory Stacking (Not Available in CUS
.65mm Ball Pitch
Package)
Copyright © 2010–2011, Texas Instruments Incorporated DM3730, DM3725 Digital Media Processors 3
Submit Documentation Feedback
Product Folder Link(s): DM3730 DM3725
DM3730, DM3725
SPRS685C–AUGUST 2010–REVISED JANUARY 2011
www.ti.com
1.2 Description
The DM37x generation of high-performance, digital media processors are based on the enhanced device
architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed
to provide best in class ARM and Graphics performance while delivering low power consumption. This
balance of performance and power allow the device to support the following example applications:
• Portable Data Terminals
• Navigation
• Auto Infotainment
• Gaming
• Medical Imaging
• Home Automation
• Human Interface
• Industrial Control
• Test and Measurement
• Single board Computers
The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded
CE which are available directly from TI. Additionally, the device is fully backward compatible with previous
Cortex™-A8 processors and OMAP™ processors.
This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical
specifications for the DM3730/25 Digital Media Processor. The information contained in this data manual
applies to the commercial, industrial, and extended temperature versions of the DM3730/25 Digital Media
Processor unless otherwise indicated. It consists of the following sections:
• A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and
functional description
• A presentation of the electrical characteristics requirements: power domains, operating conditions,
power consumption, and dc characteristics
• The clock specifications: input and output clocks, DPLL and DLL
• A description of thermal characteristics, device nomenclature, and mechanical data about the available
packaging
4 DM3730, DM3725 Digital Media Processors Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): DM3730 DM3725
64
64
Async
64
64
L2$
256K
MPU
Subsystem
POWERVR
SGX
Graphics
Accelerator
TM
32
32
32
Channel
System
DMA
3232
Parallel
TV
Amp
LCD Panel
CVBS
or
S-Video
Dual Output 3-Layer
Display Processor
(1xGraphics, 2xVideo)
Temporal Dithering
SDTV QCIF Support®
32
Camera
ISP
Image
Capture
Hardware
Image
Pipeline
Camera
(Parallel)
64
HS USB
Host
HS
USB
OTG
32
L3 Interconnect Network-Hierarchial, Performance, and Power Driven
64KB
On-Chip
RAM
32
32KB
On-Chip
ROM
32
SMS:
SDRAM
Memory
Scheduler/
Rotation
64
SDRC:
SDRAM
Memory
Controller
L4 Interconnect
32
System
Controls
PRCM
2xSmartReflex
TM
Control
Module
External
Peripherals
Interfaces
Peripherals: 4xUART,
3xHigh-Speed I2C, 5xMcBSP
(2x with Sidetone/Audio Buffer)
4xMcSPI, 6xGPIO
3xHigh-Speed MMC/SDIO
HDQ/1 Wire, 6xMailboxes
12xGPTimers, 2xWDT,
32K Sync Timer
GPMC:
General
Purpose
Memory
Controller
NAND/
NOR
Flash,
SRAM
32
Emulation
Debug: SDTI, ETM, JTAG
External and
Stacked Memories
32
IVA 2.2 Subsystem
TMS320DM64x+ DSP
Imaging Video and
Audio Processor
32K/32K L1$
48K L1D RAM
64K L2$
32K L2 RAM
16K L2 ROM
Video Hardware
64
32
Async
64
32
ARM
Cortex™- A8
®
Core
TrustZone
32K/32K L1$
DM3730, DM3725
www.ti.com
SPRS685C–AUGUST 2010–REVISED JANUARY 2011
1.3 Functional Block Diagram
The functional block diagram of the DM3730/25 Digital Media Processor is shown below.
Figure 1-1. DM3730/25 Functional Block Diagram
Copyright © 2010–2011, Texas Instruments Incorporated DM3730, DM3725 Digital Media Processors 5
Submit Documentation Feedback
Product Folder Link(s): DM3730 DM3725
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