FPC1011Fdatasheet资源-CSDN文库

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### FPC1011F指纹传感器技术说明 #### 一、产品概述 FPC1011F是一款紧凑型CMOS指纹传感器，具备多种显著优势。该传感器提供卓越的图像质量，在每个像素中拥有256个灰度级的真实值。通过其反射式测量方法，FPC1011F能够将电信号通过传感器框架直接传入手指，这种技术使得传感器表面可以采用一种无与伦比的硬质和抗刮擦保护涂层。此外，FPC1011F的3D像素传感技术几乎可以读取任何类型的手指，无论是干手指还是湿手指。 #### 二、产品特点 1. **指纹区域传感器**：FPC1011F是一款专为指纹识别设计的传感器。 2. **新型硬质和抗刮擦保护表面涂层**：这种独特的涂层使得传感器表面极为耐用且能抵抗日常磨损。 3. **卓越图像质量**：提供256个真实灰度级别的高质量图像。 4. **三维图像**：每个像素含有256个真实灰度值，确保高精度的三维图像。 5. **人体工学框架**：优化了手指引导，便于用户准确放置手指，提高算法性能。 6. **高速接口**：支持高速SPI（串行外设接口）或并行接口，以适应不同的应用场景需求。 7. **灵活连接器或BGA封装**：提供两种封装选项——柔性的连接器版本或标准的球栅阵列(BGA)封装。 8. **电压操作范围**：支持3.3伏和2.5伏的操作电压。 9. **静电放电(ESD)保护**：超过15kV的ESD保护能力，增强设备可靠性。 10. **耐久性**：超过一百万次的磨损周期，确保长期稳定运行。 #### 三、应用领域 - **计算机周边设备**：如指纹鼠标、键盘等。 - **物理门禁控制系统**：适用于办公室、住宅等安全门禁系统。 - **考勤管理系统**：企业、学校等场所的考勤签到。 - **无线设备**：移动电话、平板电脑等便携式设备的安全解锁。 - **安全应用**：如保险柜、智能锁等安全防护设备。 - **医疗设备与存储**：医疗行业的各种设备以及患者数据存储系统的安全访问控制。 #### 四、技术参数 | 参数 | 描述 | 值 | 单位 | |-------------------|--------------------------------------------|---------|------| | 尺寸 | 传感器本体尺寸 | 20.4×33.4×2.3 | mm | | 接口 | 串行SPI或并行 | 8/32 | pin | | 供电电压 | 直流电源 | 2.5-3.3 | V | | 供电电流（典型值）| 在3.3V、4MHz和室温条件下的工作电流 | 7 | mA | | 供电电流（睡眠模式）| 关闭电源时的电流 | 10 | μA | | 时钟频率 | 串行SPI或并行 | 32 | MHz | | 读取速度 | 串行SPI或并行 | 4 | Mpixel/s | | 感应区域 | 像素矩阵 | 10.64×14.00 | mm | | 感应数组大小 | 像素矩阵 | - | - | FPC1011F不仅在技术和功能上具有显著的优势，还在应用场景方面表现出了广泛的适用性和灵活性，是众多需要高度可靠和高性能指纹识别解决方案的理想选择。

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FPC1011F Area Sensor Package

Product Specification

www.fingerprints.com 1

This specification is subject to changes without prior notice 71

‐FPC1011F_E_Produc

‐specification.doc

Features

• Fingerprint area sensor

• NEW hard and scratch resistant protective surface coating

• Superior image quality

• 3D image with 256 true gray scale values

• Ergonomic frame for optimized finger guidance

• High speed SPI interface or Parallel interface

• Flex connector or BGA

• 3.3 and 2.5 volt operation

• >15kV ESD protection

• >1 million wear cycles

Application examples

• Computer peripheral

• Physical access control

• Time and attendance

• Wireless devices

• Security application

• Medical equipment & storage

General description

FPC1011F is a new compact CMOS fingerprint sensor with several significant advantages. FPC1011F

delivers superior image quality, with 256 gray scale values in every single pixel. The reflective

measurement method sends an electrical signal via the frame directly into the finger. This technique

enables the use of an unbeatably hard and thick protective surface coating. The sensor with its 3D pixel

sensing technology can read virtually any finger; dry or wet.

Thanks to the new extremely hard and durable surface coating, FPC1011F is protected against ESD well

above 15 kV, as well as scratches, impact and everyday wear-and-tear. FPC1011F is delivered with a

designed micro-ergonomic guidance frame, simplifying proper fingerprint guidance and hence improving

algorithm performance.

FPC1011F is available in two configurations; either a versatile flex connector version, FPC1011F1, with a

serial SPI interface or a standard BGA component, FPC1011F2, with both serial and parallel interface. In

higher volumes, the micro-ergonomic frame can be made available in different colors and textures.

Quick reference data

PARAMETER DESCRIPTION VALUE UNIT

Dimension Sensor body (W x L x T) 20.4 x 33.4 x 2.3 mm

Interface Serial SPI or Parallel 8 / 32 pin

Supply voltage VDC 2.5 - 3.3 V

Supply current Typical at 3.3V, 4MHz and RT 7 mA

Supply current sleep mode Power down 10 μA

Clock frequency Serial SPI or Parallel 32 MHz

Read out speed Serial SPI or Parallel 4 Mpixel/s

Active sensing area Pixel matrix 10.64 x 14.00 mm

Size sensing array Pixel matrix (363 dpi) 152 x 200 pixel

Pixel resolution 256 gray scale values 8 bit

ESD protection IEC61000-4-2, level 4, air discharge > 15 kV

Wear-and-tear No of wear cycles at 6N > 1 million cycle

FPC1011F Area Sensor Package

Product Specification

www.fingerprints.com 2

This specification is subject to changes without prior notice 71

‐FPC1011F_E_Produc

‐specification.doc

Table of contents

1 Functional description ........................... 3

1.1 Introduction ............................................ 3

1.2 Block diagram ......................................... 3

1.3 Technical features .................................. 4

1.4 Sensor surface robustness ..................... 4

1.5 Application limits .................................... 4

1.6 Absolute maximum ratings ..................... 4

2 Electrical characteristics ...................... 5

3 Operation .............................................. 6

3.1 Introduction ............................................ 6

3.2 Sensor technology .................................. 6

3.3 Image properties .................................... 7

3.4 Interface .................................................. 7

3.5 Sensor readout ....................................... 8

4 Serial mode ......................................... 10

4.1 Instruction summary ............................ 10

4.2 Sensor setup ......................................... 10

4.3 Serial mode instructions ....................... 10

4.4 Sample Implementation ........................ 18

5 Parallel mode ...................................... 19

5.1 Instruction summary ............................ 19

5.2 Sensor setup ......................................... 19

5.3 Parallel mode instructions ................... 19

5.4 Sample Implementation ........................ 26

6 Timing requirements........................... 27

6.1 General timing ...................................... 27

6.2 Serial mode timing ................................ 27

6.3 Parallel mode timing ............................ 29

7 Mechanical properties ......................... 31

7.1 FPC1011F1 - part drawing .................... 31

7.2 FPC1011F1 - pin configuration.............. 32

7.3 FPC1011F2 - part drawing .................... 33

7.4 FPC1011F2 - pin configuration.............. 34

8 Cosmetic properties ............................ 35

8.1 Sensor surface quality .......................... 35

8.2 Assembly accuracy ................................ 35

9 Application information ....................... 36

9.1 Sensor integration ................................ 36

9.2 Sensor shut down mode ........................ 36

9.3 ESD protection ...................................... 37

9.4 Power supply and filtering .................... 39

9.5 Ground reference and CMR ................... 39

9.6 ESD discharge path ............................... 39

9.7 FPC1011F1 - reference layout .............. 40

9.8 FPC1011F2 - reference layout .............. 41

9.9

 FPC1011F1 - mating flex strip .............. 43

9.10 FPC1011F2 - PCB layout pattern ........... 44

9.11 FPC1011F2 - reflow soldering .............. 45

10 End user information ........................... 46

10.1 Sensor cleaning .................................... 46

11 Order information ................................ 47

11.1 Part numbers ........................................ 47

11.2 Production codes................................... 47

11.3 Package information ............................. 47

11.4 ESD sensitivity ....................................... 47

12 Document revision history ................... 48

13 Contact information ............................. 48

FPC1011F Area Sensor Package

Product Specification

www.fingerprints.com 4

This s

ecification is sub

ect to chan

e without

rior notice 71

‐FPC1011F E Produc

‐s

eci

ication.doc

1.3 Technical features

PARAMETER DESCRIPTION VALUE UNIT

Dimension Sensor body 20.4 x 33.4 x 2.3 mm

Flex connector type, sensor body plus connector 20.4 x 33.4 x 5.4 mm

BGA type, sensor body plus solder balls 20.4 x 33.4 x 2.7 mm

Active sensing area 10.64 x 14.00 mm

Size sensing array 152 x 200 pixel

Spatial resolution 363 dpi

Pixel resolution 256 gray scale levels 8 bit

Operating temperature - 20 … + 60

°C

Storage temperature - 40 … + 85

°C

ESD IEC61000-4-2 level 4, air discharge > ±15 kV

Package type FPC1011F1 - 8 pin flex connector, 1mm pitch, Non-ZIF 8 pin

FPC1011F2 - 32 ball BGA 32 pin

1.4 Sensor surface robustness

PARAMETER DESCRIPTION CONDITION RESULT

Mechanical wear-and-tear Repetitive wear-and-tear cycles > 1 000 000 cycles @ 6N PASS

Foreign substances Repetitive strokes with: 200 cycles @ 6N PASS

Acetone, Artificial sweat, Coca cola, Coffee, Isopropyl,

Ethanol, Ketchup, Mosquito repellent, Oil, Petrol, Soap

1.5 Application limits

The FPC1011F package is designed for indoor,

non-condensing, applications. Do not expose the

sensor to direct contact with the elements, such

as rain, snow or sunlight. The sensor surface is

hard and extremely robust, and will withstand

years of normal wear-and-tear. However, do not

subject the sensor to sharp or hard objects since

this might cause permanent damage.

Cleaning should be done with a lint-free cotton

textile, also see section on

Sensor cleaning

. Do not

subject the sensor surface to mechanical force. The

fingerprint sensor is a high-performing SMD device

and should be handled accordingly. Additional

information on proper product integration is offered

in the section

Sensor integration

1.6 Absolute maximum ratings

Note 1: Additional information on proper product integration is offered in the section, Sensor integration.

Supply voltage V

-0.5 V to +7.0 V

Input voltage -0.5 V to V

+ 0.5 V

Output voltage -0.5 V to V

+ 0.5 V

Total power dissipation 50 mW

ESD on IO’s ±2 kV

Pressure on sensor

25 N

Note:

Stress beyond values listed under “Absolute

Maximum Ratings” may cause permanent damage to

the device. This is a stress rating only. Functional

operation of the device, at these or other conditions

beyond those indicated as normal operation in this

specification, is not implied. Exposure to absolute

maximum rating conditions for extended periods, may

affect device reliability.

FPC1011F Area Sensor Package

Product Specification

www.fingerprints.com 5

This s

ecification is sub

ect to chan

e without

rior notice 71

‐FPC1011F E Produc

‐s

eci

ication.doc

2 Electrical characteristics

Measured at room temperature (RT)

SYMBOL PARAMETER CONDITION MIN TYP MAX UNIT

FPC1011F1 - serial mode is preset

Voltage supply (total) 2.35 2.5 - 3.3 3.45 V

Current supply, total V

= 2.5V@4MHz - 7 14 mA

= 2.5V@32MHz - 9 - mA

= 3.3V@4MHz - 7 14 mA

= 3.3V@32MHz - 12 - mA

FPC1011F2 - serial mode

Voltage supply (digital) 2.35 2.5 - 3.3 3.45 V

Analog voltage supply 2.35 2.5 - 3.3 3.45 V

Current supply, total V

= 2.5V@4MHz - 7 - mA

= 2.5V@32MHz - 9 - mA

= 3.3V@4MHz - 7 - mA

= 3.3V@32MHz - 12 - mA

DDS

Current supply, sleep mode PWRDN high - 10 - uA

FPC1011F2 - parallell mode

Voltage supply (digital) 2.35 2.5 - 3.3 3.45 V

Analog voltage supply 2.35 2.5 - 3.3 3.45 V

Current supply, total V

= 3.3V@8MHz - TBD - mA

DDS

Current supply, sleep mode PWRDN high - 10 - uA

FPC1011F1/F2 - digital inputs

Logic ’0’ voltage N/A N/A 0.2V

Logic ’1’ voltage 0.8V

N/A N/A V

Logic ’0’ current (V

= GND) - - ±10 uA

Logic ’1’ current (V

= V

) - - ±10

IND

Input capacitance - 6 - pF

FPC1011F1/F2 - digital outputs

Logic ’0’ output voltage - 0.2 0.4

Logic ’1’ output voltage 0.85V

0.90V

- V

Note: Details on clock frequency is available in the General Timing section.

Differential power supply disturbance

The graph shows the supply disturbance

level (sinus rms), which will give less than

one gray level rms disturbance in the

fingerprint image readout. If the supply

voltage is noisy, additional filtering may be

required.

If separate (splitted) power supplies or long

connection leads are used, it is important to

maintain a synchronized power on voltage

curve (equivalent ramp), for both V

and

. This care is necessary to avoid

possible latch-up problems.

剩余47页未读，继续阅读

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zcsyangsen

2015-11-15

恩，很不错，找了好久……值得拥有
linuxbber505

2012-12-19

不错，代理商提供资料一样
wegeek

2016-05-23

谢谢，不错的资料
feihai_

2016-04-06

不错，正在学习这个
eliefly

2013-08-16

搞不懂这个产品？有不同版本吗

wxstz

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