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TI-DS10BR150.pdf
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LVDS中继器
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ASIC / FPGA
CML
LVDS
LVPECL
ASIC / FPGA
LVDS
BR150
DS10BR150
www.ti.com
SNLS252D –APRIL 2007–REVISED APRIL 2013
DS10BR150 1.0 Gbps LVDS Buffer / Repeater
Check for Samples: DS10BR150
1
FEATURES
DESCRIPTION
The DS10BR150 is a single channel 1.0 Gbps LVDS
2
• DC - 1.0 Gbps Low Jitter, High Noise
buffer optimized for high-speed signal transmission
Immunity, Low Power Operation
over lossy FR-4 printed circuit board backplanes and
• On-chip 100Ω Input and Output Termination
balanced cables. Fully differential signal paths ensure
Minimizes Insertion and Return Losses,
exceptional signal integrity and noise immunity.
Reduces Component Count and Minimizes
Wide input common mode range allows the receiver
Board Space
to accept signals with LVDS, CML and LVPECL
• 7 kV ESD on LVDS I/O Pins Protects Adjoining
levels; the output levels are LVDS. A very small
Components
package footprint requires a minimal space on the
board while the flow-through pinout allows easy board
• Small 3 mm x 3 mm 8-WSON Space Saving
layout. The differential inputs and outputs are
Package
internally terminated with a 100Ω resistor to lower
device input and output return losses, reduce
APPLICATIONS
component count and further minimize board space.
• Clock and Data Buffering
• OC-12 / STM-4
• FireWire 800
Typical Application
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
NC
IN+
IN-
NC
VCC
OUT+
OUT-
NC
1
2
3
4
8
6
5
7
GND
DAP
OUT+
OUT-
IN+
IN-
DS10BR150
SNLS252D –APRIL 2007–REVISED APRIL 2013
www.ti.com
Block Diagram
Pin Diagram
DS10BR150
See Package Number NGQ0008A
PIN DESCRIPTIONS
Pin Name Pin Name Pin Type Pin Description
NC 1 NA "NO CONNECT" pin.
IN+ 2 Input Non-inverting LVDS input pin.
IN- 3 Input Inverting LVDS input pin.
NC 4 NA "NO CONNECT" pin.
NC 5 NA "NO CONNECT" pin.
OUT- 6 Output Inverting LVDS output pin.
OUT+ 7 Output Non-inverting LVDS Output pin.
VCC 8 Power Power supply pin.
GND DAP Power Ground pad (DAP - die attach pad)
2 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: DS10BR150
DS10BR150
www.ti.com
SNLS252D –APRIL 2007–REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Supply Voltage (V
CC
) −0.3V to +4V
LVDS Input Voltage (IN+, IN−) −0.3V to +4V
Differential Input Voltage |VID| 1V
LVDS Output Voltage (OUT+, OUT−) −0.3V to (V
CC
+0.3V)
LVDS Differential Output Voltage ((OUT+) - (OUT−)) 0V to 1V
LVDS Output Short Circuit Current Duration 5 ms
Junction Temperature +150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range
Soldering (4 sec.) +260°C
Maximum Package Power Dissipation at 25°C
NGQ Package 2.08W
Derate NGQ Package 16.7 mW/°C above +25°C
Package Thermal Resistance
θ
JA
+60.0°C/W
θ
JC
+12.3°C/W
ESD Susceptibility
HBM
(3)
≥7 kV
MM
(4)
≥250V
CDM
(5)
≥1250V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. JESD22-A114C
(4) Machine Model, applicable std. JESD22-A115-A
(5) Field Induced Charge Device Model, applicable std. JESD22-C101-C
Recommended Operating Conditions
Min Typ Max Units
Supply Voltage (V
CC
) 3.0 3.3 3.6 V
Receiver Differential Input Voltage (V
ID
) 0 1 V
Operating Free Air Temperature (T
A
) −40 +25 +85 °C
Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: DS10BR150
DS10BR150
SNLS252D –APRIL 2007–REVISED APRIL 2013
www.ti.com
DC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
(1)(2)(3)
Symbol Parameter Conditions Min Typ Max Units
LVDS OUTPUT DC SPECIFICATIONS (OUT+, OUT-)
V
OD
Differential Output Voltage 250 350 450 mV
R
L
= 100Ω
ΔV
OD
Change in Magnitude of V
OD
for Complimentary
-35 35 mV
Output States
V
OS
Offset Voltage 1.05 1.2 1.375 V
R
L
= 100Ω
ΔV
OS
Change in Magnitude of V
OS
for Complimentary
-35 35 mV
Output States
I
OS
Output Short Circuit Current
(4)
OUT to GND -30 -50 mA
OUT to V
CC
7.5 50 mA
C
OUT
Output Capacitance Any LVDS Output Pin to GND 1.2 pF
R
OUT
Output Termination Resistor Between OUT+ and OUT- Pins 100 Ω
LVDS INPUT DC SPECIFICATIONS (IN+, IN-)
V
ID
Input Differential Voltage 0 1 V
V
TH
Differential Input High Threshold V
CM
= +0.05V or V
CC
-0.05V 0 +100 mV
V
TL
Differential Input Low Threshold −100 0 mV
V
CMR
Common Mode Voltage Range V
ID
= 100 mV 0.05 V
CC
- V
0.05
V
IN
= 3.6V or 0V ±1 ±10 μA
I
IN
Input Current
V
CC
= 3.6V or 0V
C
IN
Input Capacitance 1.7 pF
R
IN
Input Termination Resistor Between IN+ and IN- Pins 100 Ω
SUPPLY CURRENT
I
CCD
Total Supply Current 16 21 mA
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except V
OD
and ΔV
OD
.
(3) Typical values represent most likely parametric norms for V
CC
= +3.3V and T
A
= +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
(4) Output short circuit current (I
OS
) is specified as magnitude only, minus sign indicates direction only.
4 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: DS10BR150
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