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OPA3S2859 双通道 900 MHz、2.2 nV/√Hz 可编程增益跨阻放大器

1 特性

• 增益带宽积：900 MHz

• 内部可编程增益开关

• 高阻抗 FET 输入

• 输入电压噪声：2.2 nV/√Hz

• 压摆率：350 V/μs

• 电源电压范围：3.3V 至 5.25V

• 静态电流：22 mA/通道

• 断电模式 I

：75 μA

• 温度范围：-40 °C 至 125 °C

2 应用

• 可切换的跨阻放大器

• 智能弹药

• 激光测距

• 光时域反射计 (OTDR)

• 硅光电倍增器 (SiPM) 缓冲放大器

• 光电倍增管后置放大器

• 高速可编程增益放大器

COM_A

FB_A2

FB_A1

FB_A0

INA+

100 k

10 k

1 k

VOUT_A

íVBIAS

100 k

10 k

1 k

INB+

LTCH_B

LTCH_A

SEL0

VS-

VS+

VS-

SEL1

INB-

COM_B

FB_B2

FB_B1

FB_B0

VOUT_B

INA-

1,0

0,0

0,1

0,0

1,0

方框图

3 说明

OPA3S2859 是一款具有 CMOS 输入的宽带低噪声可

编程增益放大器，适用于宽带跨阻和电压放大器应用。

当将该器件配置为跨阻放大器 (TIA) 时，0.9 GHz 增益

带宽积 (GBWP) 能够在低电容光电二极管 (PD) 应用中

实现高闭环带宽。

三个内部开关反馈路径以及一个可选的并行非开关反馈

路径最多允许四个可选增益配置。与使用分立式外部开

关的系统相比，内部开关将最大限度地降低寄生影响，

从而提高性能。每个开关针对 < 1 kΩ 到 > 100 kΩ 的

反馈电阻值进行了优化，适用于宽动态范围的应用。使

用两线制并行接口控制两个通道的选定开关路径。对于

所选的每个通道，也可以通过施加锁存引脚来使增益路

径保持恒定，这随后会禁用所选通道的开关控制，并防

止通道更改增益。

器件信息

(1)

器件型号封装

封装尺寸（标称值）

OPA3S2859 WQFN (24) 4.00mm × 4.00mm

(1) 如需了解所有可用封装，请参阅数据表末尾的封装选项附录。

Frequency (Hz)

Normalized Transimpedance (dB:)

-15

-12

-9

-6

-3

10M 100M 1G1M

OPA3

= 1 k:

= 10 k:

= 100 k:

跨阻带宽与频率间的关系

ADVANCE INFORMATION

OPA3S2859

ZHCSQB4 – MAY 2022

本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SBOSA13

Table of Contents

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 5

6.1 Absolute Maximum Ratings........................................ 5

6.2 ESD Ratings............................................................... 5

6.3 Recommended Operating Conditions.........................5

6.4 Thermal Information....................................................5

6.5 Electrical Characteristics.............................................6

6.6 Switching Characteristics............................................8

6.7 Typical Characteristics.............................................. 10

7 Parameter Measurement Information.......................... 16

8 Detailed Description......................................................17

8.1 Overview................................................................... 17

8.2 Functional Block Diagram......................................... 17

8.3 Feature Description...................................................18

8.4 Device Functional Modes..........................................18

9 Application and Implementation.................................. 20

9.1 Application Information............................................. 20

9.2 Typical Application.................................................... 20

10 Power Supply Recommendations..............................22

11 Layout........................................................................... 22

11.1 Layout Guidelines................................................... 22

11.2 Layout Examples.....................................................22

12 Device and Documentation Support..........................25

12.1 Device Support....................................................... 25

12.2 Documentation Support.......................................... 25

12.3 接收文档更新通知................................................... 25

12.4 支持资源..................................................................25

12.5 Trademarks.............................................................25

12.6 Electrostatic Discharge Caution..............................25

12.7 术语表..................................................................... 25

13 Mechanical, Packaging, and Orderable

Information.................................................................... 25

13.1 Tape and Reel Information......................................29

4 Revision History

DATE REVISION NOTES

May 2022 * Initial Release

OPA3S2859

ZHCSQB4 – MAY 2022

www.ti.com.cn

ADVANCE INFORMATION

2 Submit Document Feedback

Product Folder Links: OPA3S2859

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Total supply voltage (V

S+

- V

S-

) 5.5 V

IN+

, V

IN-

Input voltage

S–

) – 0.5

S+

) + 0.5 V

Differential input voltage 1 V

OUT

Output voltage

S–

) – 0.5

S+

) + 0.5 V

Continuous input current ±4 mA

OUT

Continuous output current

(2)

25 mA

Junction temperature 150 °C

Operating free-air temperature

–40

125 °C

stg

Storage temperature

–65

150 °C

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2) Long-term continuous output current for electromigration limits

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins

(1)

±1500

Charged device model (CDM), per JEDEC specification JEDEC JS-002, all pins

(2)

±1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

Total supply voltage (V

S+

- V

S-

) 3.3 5 5.25 V

Ambient temperature

–40

125 °C

6.4 Thermal Information

THERMAL METRIC

(1)

OPA3S2859

UNITRTW

24 PINS

θJA

Junction-to-ambient thermal resistance 52 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 39.6 °C/W

θJB

Junction-to-board thermal resistance 28.2 °C/W

Junction-to-top characterization parameter 1.8 °C/W

Junction-to-board characterization parameter 28.2 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance 13.3 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com.cn

OPA3S2859

ZHCSQB4 – MAY 2022

ADVANCE INFORMATION

Submit Document Feedback

Product Folder Links: OPA3S2859

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