TLV702_.PDF资源-CSDN文库

需积分: 1 174 浏览量 2021-04-12 17:49:32 上传评论收藏 1.1MB PDF 举报

资源详情

资源评论

资源推荐

TLV702xx

GND

IN OUT

OUT

Off

OUT

1 F

Ceramic

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

TLV702

SLVSAG6C –SEPTEMBER 2010–REVISED MARCH 2015

TLV702 300-mA, Low-I

, Low-Dropout Regulator

1 Features 3 Description

The TLV702 series of low-dropout (LDO) linear

• Very Low Dropout:

regulators are low quiescent current devices with

– 37 mV at I

OUT

= 50 mA, V

OUT

= 2.8 V

excellent line and load transient performance. These

– 75 mV at I

OUT

= 100 mA, V

OUT

= 2.8 V

LDOs are designed for power-sensitive applications.

A precision bandgap and error amplifier provides

– 220mV at I

OUT

= 300 mA, V

OUT

= 2.8 V

overall 2% accuracy. Low output noise, very high

• 2% Accuracy

power-supply rejection ratio (PSRR), and low-dropout

• Low I

: 35 μA

voltage make this series of devices ideal for a wide

selection of battery-operated handheld equipment. All

• Fixed-Output Voltage Combinations Possible from

device versions have thermal shutdown and current

1.2 V to 4.8 V

limit for safety.

• High PSRR: 68 dB at 1 kHz

Furthermore, these devices are stable with an

• Stable With Effective Capacitance of 0.1 μF

(1)

effective output capacitance of only 0.1 μF. This

• Thermal Shutdown and Overcurrent Protection

feature enables the use of cost-effective capacitors

• Packages: 5-Pin SOT-23 and 1.5-mm × 1.5-mm,

that have higher bias voltages and temperature

6-Pin WSON

derating. The devices regulate to specified accuracy

with no output load.

(1)

See the Input and Output Capacitor Requirements in

Application Information.

The TLV702P series also provides an active pulldown

circuit to quickly discharge the outputs.

2 Applications

The TLV702 series of LDO linear regulators are

• Wireless Handsets

available in SOT23-5 and 1.5-mm × 1.5-mm SON-6

• Smart Phones

packages.

• ZigBee

Networks

Device Information

(1)

• Bluetooth

Devices

PART NUMBER PACKAGE BODY SIZE (NOM)

• Li-Ion Battery-Operated Handheld Products

SOT-23 (5) 2.90 mm × 1.60 mm

TLV702

• WLAN and Other PC Add-on Cards

WSON (6) 1.50 mm × 1.50 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Typical Application Circuit

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLV702

SLVSAG6C –SEPTEMBER 2010–REVISED MARCH 2015

www.ti.com

Table of Contents

8.1 Application Information............................................ 13

1 Features.................................................................. 1

8.2 Typical Application .................................................. 13

2 Applications ........................................................... 1

9 Power Supply Recommendations...................... 15

3 Description ............................................................. 1

9.1 Power Dissipation ................................................... 15

4 Revision History..................................................... 2

10 Layout................................................................... 15

5 Pin Configuration and Functions......................... 3

10.1 Layout Guidelines ................................................. 15

6 Specifications......................................................... 4

10.2 Layout Examples................................................... 15

6.1 Absolute Maximum Ratings ...................................... 4

10.3 Thermal Consideration.......................................... 16

6.2 ESD Ratings ............................................................ 4

10.4 Package Mounting ................................................ 16

6.3 Recommended Operating Conditions....................... 4

11 Device and Documentation Support ................. 17

6.4 Thermal Information.................................................. 4

11.1 Device Support .................................................... 17

6.5 Electrical Characteristics........................................... 5

11.2 Documentation Support ........................................ 17

6.6 Typical Characteristics.............................................. 6

11.3 Related Links ........................................................ 17

7 Detailed Description ............................................ 10

11.4 Trademarks ........................................................... 18

7.1 Overview ................................................................. 10

11.5 Electrostatic Discharge Caution............................ 18

7.2 Functional Block Diagrams ..................................... 10

11.6 Glossary ................................................................ 18

7.3 Feature Description................................................. 11

12 Mechanical, Packaging, and Orderable

7.4 Device Functional Modes........................................ 12

Information ........................................................... 18

8 Application and Implementation ........................ 13

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (February 2011) to Revision C Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

• Changed Pin Configuration and Functions section; updated table format ............................................................................ 3

• Deleted Ordering Information table ....................................................................................................................................... 3

• Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement ................... 4

• Changed Thermal Information table; updated thermal resistance values for all packages .................................................. 4

• Deleted Dissipation Ratings table .......................................................................................................................................... 4

• Changed V

dropout voltage test conditions; deleted I

OUT

= 50 mA and I

OUT

= 100 mA with V

OUT

= 2.8 V test

parameters ............................................................................................................................................................................. 5

• Deleted EVM Dissipation Ratings table ............................................................................................................................... 16

Changes from Revision A (October 2010) to Revision B Page

• Added SON-6 (DSE) package and related references to data sheet..................................................................................... 1

Product Folder Links: TLV702

TLV702

SLVSAG6C –SEPTEMBER 2010–REVISED MARCH 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

IN –0.3 6

Voltage

(2)

EN –0.3 6 V

OUT –0.3 6

Current (source) OUT Internally limited

Output short-circuit duration Indefinite

Total continuous power dissipation See Thermal Information

Operating virtual junction, T

–55 150

Temperature °C

Storage, T

stg

–55 150

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2) All voltages are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins

(1)

±2000

(ESD)

Electrostatic discharge V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

all pins

(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted).

MIN NOM MAX UNIT

2 5.5 V

OUT

1.2 4.8 V

OUT

0 300 mA

6.4 Thermal Information

TLV702

THERMAL METRIC

(1)

DBV (SOT-23) DSE (WSON) UNIT

5 PINS 6 PINS

θJA

Junction-to-ambient thermal resistance 249.2 321.3

θJC(top)

Junction-to-case (top) thermal resistance 136.4 207.9

θJB

Junction-to-board thermal resistance 85.9 281.5

°C/W

Junction-to-top characterization parameter 19.5 42.4

Junction-to-board characterization parameter 85.3 284.8

θJC(bot)

Junction-to-case (bottom) thermal resistance N/A 142.3

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Product Folder Links: TLV702

剩余32页未读，继续阅读

评论收藏

内容反馈

weixin_49416729

粉丝: 0
资源: 13

TLV702_.PDF

评论0

最新资源

TLV702_.PDF

评论0

TLV702数据手册

TI-TLV716P.pdf

C#生成PDF 读取PDF文本内容 获取PDF内图片.rar_.net_C# pdf_C#PDF_pdf_winform

JavaScript+Java实现HTML页面转为PDF文件保存的方法_.docx

PHP用法imagick读取PDF生成png缩略图的两种方法_.docx

PDF_to_WordDocument_Converter_6.2.0_MAS_[TNT]_.rar

亮剑.NET_.NET深入体验与实战精要 NO.2 PDF by CJT

TLV1544程序.pdf

TI-TLV1548M.pdf

TI-TLV431B.pdf

tlv271.pdf

彩色铅笔素描文字特效-PS动作素材下载_PSD_ATN_ABR_PAT_PDF_.zip

GMT 0016-2012 _.PDF_2012_标准_gmt0016_GMT0016-2012_智能密码钥匙_

ccnetd1v2_4_.pdf.zip_matlab例程_PDF_

社交APP界面设计品牌相关图标素材下载_AI_EPS_PDF_JPG_PNG_SVG_.zip

GL3523-C390630_.PDF

tlv4112.pdf

tlv2316.pdf

tlv320aic31.pdf

tlv2451.pdf

双路LDO 3.3/1..8 tlv710.pdf

neural_network_design_m.hagan_.zip_PDF_

Programming_Embedded_System_I_8051_.rar_嵌入式/单片机/硬件编程_PDF_

TI-TLV5580.pdf

TI-TLV5535.pdf

TI-TLV4120.pdf

TI-TLV9034.pdf

TI-TLV3605.pdf

TI-TLV3601.pdf

最新资源

C#生成PDF 读取PDF文本内容获取PDF内图片.rar_.net_C# pdf_C#PDF_pdf_winform