没有合适的资源?快使用搜索试试~ 我知道了~
芯片测试tester-DX
需积分: 0 0 下载量 61 浏览量
2023-06-23
16:10:54
上传
评论
收藏 563KB PDF 举报
温馨提示
试读
90页
芯片测试tester-DX
资源推荐
资源详情
资源评论
Diamond
X
Test System 1 Unison
Diamond
X
Specifications Software Release U4.2.3
LTX-Credence
1 Diamond
X
Test System Specification
The Diamond
X
Test System specifications include:
• Features
• General Specifications
• Facilities Specifications
• Physical Characteristics
• Digital Instrument Specifications
• DC and Power Source Instrument Specifications
• High Performance Mixed-Signal Instrument Specifications
• HSIO SerDes Instrumentation
• RF Instrumentation
• System DUT Utility Resources
• IMA Edge Placement Accuracy (EPA) Considerations When Sharing Instrument
Resources Across Multiple Test Heads
Features
The Diamond
X
Test System is cost-optimized for both today and future test
requirements for a wide range of ASSP/ASICs and microcontroller in wireless and
mobility applications and consumer ICs. The Diamond
X
Test System extends
LTX-Credence’s low-cost, high-throughput production test solution platforms to high
pin count, higher site count wireless, mobility, consumer ASSP and Microcontrollers.
Designed to meet the cost drivers IC companies face, Diamond
X
extendsLTX-Credence leadership in lowering the cost of operations through:
• Small form-factor, zero footprint
• Air cooled infrastructure and instruments – no heat exchanger and plumbing
• Energy efficient, low power consumption
Leveraging test technology from the widely accepted Diamond and X-Series test
platforms bring high-density digital, DC, analog instruments as well as technology
leading precision analog, SerDes, and RF test to the Diamond
X
Test System.
Integrated Multi-system Architecture (IMA), supports the assembly of test system
arrays using low cost, compact test systems as fundamental building blocks. This
supports a broad range of high volume manufacturing test strategies, maximizing
Diamond
X
Test System 2 Unison
Diamond
X
Specifications Software Release U4.2.3
1 - Diamond
X
Test System Specification
LTX-Credence
production floor flexibility and utilization resulting in lower cost of test and reduced
capital spending. The Diamond
X
Test System is the third LTX-Credence product
offering IMA compliance.
Diamond
X
features:
• Universal instrument slot architecture: Allowing easy scaling from single site to
multisite, from digital, to mixed-signal configurations.
• Small footprint, making it ideal for lab development and high-volume production.
• PCI-Express2 Data Bus configured for up to 80Gbps bi-direction transfer between
system CPU and test-head.
• IMA Compliance; the ability to integrate multiple Diamond
X
test heads on-site,
bringing the ability to scale the test head slot count up to meet pin count
requirements of multisite and or new devices.
Diamond
X
can be configured with the following instruments and can accommodate
over 3600 pins:
• 96-channel digital instrument featuring 200 Mbps operation with per-pin timing,
formatting, levels, PMUs and scan.
• Audio and Video DSP instrumentation with four channels each of analog source
and measure covering audio and video applications, in a single slot instrument.
• 8 Lanes of 6.4Gbps SerDes test; 8 differential receive and 8 differential 6.4Gbps
channels with 128M symbol memory and built in jitter generation and PRBS/BER.
• Range of high-density VIs with 16 or 72 channels of high-precision DPS, voltage/
current source and measurement capabilities, enabling efficient, cost-effective
multi-site testing.
General Specifications
Table 1. General Specifications
Feature Specification*
Instrument slots • 19 Instrument slots and 1 System DUT
Utility Board in a single test head (x1 IMA)
• 38 Instrument slots and 2 System DUT
Utility Board x2 IMA
Number of Digital Channels 3648 in x2 IMA, 1824 single test head (x1 IMA)
Multi-Site Test Sites 256
Air-Cooled Yes
Prober and Handler Interfaces GPIB, TTL, RS-232, Ethernet
Diamond
X
Test System 3 Unison
Diamond
X
Specifications Software Release U4.2.3
1 - Diamond
X
Test System Specification
LTX-Credence
Table 2. Software
Feature Specification
Software environment C++, Unison
Operating system High Performance Linux based PC
Table 3. Facilities Specifications
Feature Specification* Comments
Typical:
208 V to 30 A Service
6.2 KW power
consumption
See the Diamond
X
Test System Site
Preparation Guide for more details
Power Factor > 90%
Ethernet Required
Other No compressed air or chiller required
Table 4. Physical Characteristics
Feature Specification
Test head dimensions 12” wide x 26.5” deep x 29.5” high
Test head weight 200lbs (90kg)
System Resource box dimensions 20.5” x 32” x 20.5”
System Resource box weight 150 lbs (68kg)
Table 5. Digital Instrument Specifications
Feature Specification* Comments
Total Channels per Instrument 96
Data Rate 200 Mbps
Instruction Rate 100 MHz
Diamond
X
Test System 4 Unison
Diamond
X
Specifications Software Release U4.2.3
1 - Diamond
X
Test System Specification
LTX-Credence
DPIN96 (DD1096)
Vector Depth 64 M vectors DPIN96-64
Vector Depth 32 M vectors DPIN96-32
Scan Depth 18 Gb/instrument DPIN96-64
Scan Depth 9 Gb/instrument DPIN96-32
Scan Width 2-32 chains/instrument
Table 6. DC and Power Source Instrument Specifications
Feature Specification*
VIS16
VI Source/Measure Channels 16
Four-Quadrant Operation ±20 V, ±300 mA
±60 V, ±100 mA
HDVI
VI Source/Measure Channels 72
Four-quadrant Operation
Voltage Ranges ±1.8 V to ±7V
Current Ranges ±15 µA to ±256 mA
DPS16
Number of Channels 16
Voltage Range 0 V to 6 V
Maximum Output Current 2 A per channel, Gangable to 16 A
Current Ranges 200 µA to 2 A per channel
Table 7. High Performance Mixed-Signal Instrument Specifications
Feature Specification* Comments
MultiWave
Table 5. Digital Instrument Specifications
Feature Specification* Comments
Diamond
X
Test System 5 Unison
Diamond
X
Specifications Software Release U4.2.3
1 - Diamond
X
Test System Specification
LTX-Credence
High Precision AWG
Number of AWGs 4 Per instrument
Sample Rate 16 kS/s to 768kS/s —
Resolution 24 bit —
Output Ranges ±10 V to ±1.25 V —
High Speed AWG —
Number of AWGs 4 Per instrument
Sample Rate 0 to 250 MS/s —
Resolution 16 bit —
Output Ranges ±4 V to ±0.5 V —
High Resolution Digitizer
Number of Digitizers 4 Per instrument
Sample Rate 48 kS/s to 2.5 MS/s —
Resolution 24 bit —
Output Ranges ±10 V to ±1.25 V —
High Speed Digitizer
Number of Digitizers 4 Per instrument
Sample Rate 1 to 130 MS/s —
Resolution 16 bit —
Output Ranges ±3.3 V to ±0.5 V —
Table 8. HSIO SerDes Instrumentation
Feature Specification
# of Lanes [differential] 8 Tx and 8 Rx ports
Data Rates 100Mbps to 6.4Gbps
Per Wire PMU 32 channels
Max Symbols 128 Million
Table 7. High Performance Mixed-Signal Instrument Specifications
Feature Specification* Comments
剩余89页未读,继续阅读
资源评论
消灭执念
- 粉丝: 0
- 资源: 3
上传资源 快速赚钱
- 我的内容管理 展开
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功