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本文是关于EEPROM芯片的程序/擦除耐久性和数据保持性能测试的内容。EEPROM是一种可编程可擦除的只读存储器,它的独特之处在于它可以被电子设备编程和擦除多次,而不会失去数据。这个测试旨在评估EEPROM芯片的编程/擦除耐久性和数据保持能力。 在这个测试中,芯片会被反复编程和擦除,以模拟实际使用场景下的持续写入和擦除操作。通过记录芯片在一定条件下的编程和擦除次数,可以评估芯片的耐久性和寿命。 此外,测试还会评估EEPROM芯片在不同温度和存储时间条件下的数据保持能力。通过设置不同的温度和存储时间,并在测试结束后检查数据的正确性,可以检验芯片对数据的长期保持能力。 这些测试是为了确保EEPROM芯片在实际使用中能够可靠地存储和保持数据,能够承受常规的写入和擦除操作,以满足电子设备的需求。
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JEDEC
STANDARD
Electrically Erasable Programmable
ROM (EEPROM) Program/Erase
Endurance and Data Retention Stress
Test
JESD22-A117C
(Revision of JESD22-A117B, March 2009)
OCTOBER 2011
JEDEC Solid State Technology Association
NOTICE
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approved through the JEDEC Board of Directors level and subsequently reviewed and approved
by the JEDEC legal counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and
improvement of products, and assisting the purchaser in selecting and obtaining with minimum
delay the proper product for use by those other than JEDEC members, whether the standard is to
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption
may involve patents or articles, materials, or processes. By such action JEDEC does not assume
any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or
publication may be further processed and ultimately become an ANSI standard.
No claims to be in conformance with this standard may be made unless all requirements stated in
the standard are met.
Inquiries, comments, and suggestions relative to the content of this JEDEC standard or
publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or
www.jedec.org
Published by
©JEDEC Solid State Technology Association 2011
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This document may be downloaded free of charge; however JEDEC retains the
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This document is copyrighted by JEDEC and may not be
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Organizations may obtain permission to reproduce a limited number of copies
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Suite 240 South
Arlington, VA 22201-2107
or call (703) 907-7559
JEDEC Standard No. 22-A117C
Page 1
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM)
PROGRAM/ERASE ENDURANCE AND DATA RETENTION STRESS TEST
(From
JEDEC Board Ballot JCB-11-7x, formulated under the cognizance of the JC-14.1 Subcommittee
on Reliability Test Method and Packaged Devices.)
1 Scope
This stress test is intended to determine the ability of an EEPROM integrated circuit or an integrated
circuit with an EEPROM module (such as a microprocessor) to sustain repeated data changes without
failure (program/erase endurance) and to retain data for the expected life of the EEPROM (data retention).
This Standard specifies the procedural requirements for performing valid endurance and retention tests
based on a qualification specification. Endurance and retention qualification specifications (for cycle
counts, durations, temperatures, and sample sizes) are specified in JESD47 or may be developed using
knowledge-based methods as in JESD94.
This stress test does not replace other stress test qualification requirements. The program/erase endurance
and data retention test for qualification and monitoring, using the parameter levels specified in JESD47, is
considered destructive. Lesser test parameter levels (e.g., of temperature, number of cycles, retention
bake duration) may be used for screening as long as these parameter levels have been verified by the
device manufacturer to be nondestructive; this can be performed anywhere from wafer level to finished
device.
2 Terms and definitions
2.1 EEPROM
A reprogrammable read-only memory in which the cells at each address can be erased electrically and
reprogrammed electrically.
NOTE The term EEPROM in this document includes all such memories, including FLASH EEPROM integrated
circuits and embedded memory in integrated circuits such as Erasable Programmable Logic Devices (EPLDs) and
microcontrollers. Destructive-read memories such as ferroelectric memories, in which the read operation re-writes
the data in the memory cells, are beyond the scope of this document.
2.2 Data pattern
The mix of 1s and 0s in the memory and their physical or logical positions.
NOTE A device may be single-bit-per-cell (SBC), meaning that one physical memory cell stores a “0” or a “1”, or
multiple-bits-per-cell (MBC), meaning that one cell stores typically two bits of data: “00”, “01”, “10”, or “11”. In
some MBC memories, the two bits represent logically-adjacent bit-pairs in each byte of data. For example, a byte
containing binary data 10110001 would correspond to four physical cells with data 2301 in base-four logic. In
other MBC memories, the two bits may represent bits in entirely different address locations. For an SBC memory a
physical checkerboard pattern consists of alternating 0s and 1s, with each 0 surrounded by 1s on either side and
above and below; a logical checkerboard pattern consists of data bytes AAH or 55H in which each 0 is logically
adjacent to 1s. In some qualifications only logical positions may be known.
Test Method A117C
(Revision of Test Method A117B)
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