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V11 Highlighted Chip Releases_ Digital and Machine Learning Proc...
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2024-02-27
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V11 Highlighted Chip Releases_ Digital and Machine Learning Processors.pdf
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ISSCC 2024
SESSION 11
Industry Invited
© 2024 IEEE
International Solid-State Circuits Conference
1 of 22
[Public]
11.1: AMD Instinct
TM
MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems
AMD Instinct
TM
MI300 Series Modular
Chiplet Package – HPC and AI Accelerator
for Exa-Class Systems
Alan Smith, Eric Chapman, Chintan Patel, Raja Swaminathan, John Wuu, Tyrone
Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser
© 2024 IEEE
International Solid-State Circuits Conference
2 of 22
[Public]
11.1: AMD Instinct
TM
MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems
Outline
Overview and motivation
Logical and physical organization
Chiplet modular construction
Advanced packaging
Power and thermal management
Generational scaling
© 2024 IEEE
International Solid-State Circuits Conference
3 of 22
[Public]
11.1: AMD Instinct
TM
MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems
The AMD Instinct™ Accelerator Journey
Multiple generations of architecture focused advancing HPC and AI compute
MI100
AMD CDNA™
1
ST
DOMAIN SPECIFIC GPU
ACCELERATOR FOR
COMPUTE
Dedicated acceleration for
compute datatypes FP64 | FP32 |
FP16 for HPC & AI
MI200
AMD CDNA™ 2
1
ST
MCM GPU
ACCELERATOR
Denser compute architecture with
leading memory
capacity/bandwidth
MI300
AMD CDNA™ 3
1
ST
CHIPLET ARCHITECTURE
GPU ACCELERATOR
Focused improvements on Unified
memory, AI data format
performance and in-node
netw
© 2024 IEEE
International Solid-State Circuits Conference
4 of 22
[Public]
11.1: AMD Instinct
TM
MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems
MI300 GPU ACCELERATOR OVERVIEW
304 CDNA 3 CU
192 GB HBM3 Memory
5.3 TB/s Memory Bandwidth
228 CDNA 3 CU | 24 Zen4 CPU
128 GB HBM3 Memory
5.3 TB/s Memory Bandwidth
CPU hosted PCIe® accelerator device
Self-hosted accelerated processing unit (APU)
AMD Instinct™ MI300X
AMD Instinct™ MI300A
Architected to deliver maximum HPC and AI capability from the
latest silicon and advanced packaging technology
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