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### Flash MX25R1635F芯片手册知识点概览
#### 一、关键特性
**MX25R1635F**是一款由**Macronix**生产的高性能、低功耗CMOS闪存存储器。其核心特性包括:
1. **超低功耗模式与高性能模式**:该芯片支持两种工作模式,可根据实际应用需求选择最佳性能或最低功耗。
2. **宽电压范围**:读取、擦除及编程操作支持1.65V至3.6V的工作电压范围,适用于多种不同的电源环境。
3. **独特的ID和安全OTP支持**:每片芯片都具有唯一的识别码,并支持安全的一次性可编程(OTP)功能,可用于数据加密或认证等用途。
4. **多I/O支持**:支持单线、双线和四线接口模式,增强了芯片的灵活性和兼容性。
5. **编程与擦除暂停/恢复功能**:在编程或擦除过程中支持中断并可在之后继续操作,提高了编程效率。
#### 二、一般描述
**MX25R1635F**是16兆位([x1/x2/x4])的串行多I/O(MXSMIO)闪存存储器,具有以下特点:
- 支持多种I/O配置,包括单线、双线和四线接口,适用于不同应用场景下的数据传输速度要求。
- 具有灵活的电源管理选项,能够在不同工作模式之间切换,以满足特定应用的需求。
- 内置的数据保护机制可以防止未经授权的访问,确保存储数据的安全性。
- 支持多种编程和擦除模式,包括扇区擦除、块擦除等,提供灵活的数据管理和维护能力。
#### 三、引脚配置
该芯片采用标准的封装形式,具体引脚配置需参考手册中的图表和说明。
#### 四、引脚描述
**MX25R1635F**的引脚包括但不限于以下几种:
- **时钟输入**(CLK):用于接收外部时钟信号,控制数据传输的同步。
- **数据输入/输出**(DQ[n]):支持单线、双线或四线数据传输,其中n表示具体的引脚编号。
- **命令/地址输入**(CMD):用于接收命令和地址信息。
- **芯片使能**(CS#):当此引脚为低电平时,芯片处于活动状态;反之则处于非活动状态。
- **写保护**(WP#):用于设置写保护功能,防止数据被意外修改。
- **保持**(HOLD#):用于暂停正在进行的操作,例如数据传输等。
#### 五、框图
**MX25R1635F**的内部架构设计简洁高效,主要包括:
- **控制逻辑单元**:负责处理外部指令和控制信号,协调数据的读取、写入和擦除等操作。
- **存储阵列**:包含多个存储单元,用于实际存储数据。
- **接口电路**:负责与外部设备进行通信,包括时钟同步、数据传输等功能。
#### 六、数据保护
**MX25R1635F**提供了多种数据保护机制,包括但不限于:
- **受保护区域大小**:可以通过设置特定的受保护区域来限制对部分内存空间的访问权限。
- **8K-bit 安全OTP定义**:每个芯片都有一个专用的8K-bit安全区域,用于存储一次性可编程数据,如密钥等敏感信息。
**MX25R1635F**作为一款高性能的闪存芯片,在低功耗、高速度、安全性等方面均表现出色,适合应用于需要可靠数据存储的各种电子设备中。通过对其关键特性和技术细节的深入了解,能够更好地发挥这款芯片的优势,满足特定的应用需求。
1
Rev. 1.6, December 12, 2018
MX25R1635F
Key Features
• Ultra Low Power Mode and High Performance Mode
• Wide Range VCC 1.65V-3.6V for Read, Erase and Program Operations
• Unique ID and Secure OTP Support
• Multi I/O Support - Single I/O, Dual I/O and Quad I/O
• Program Suspend/Resume & Erase Suspend/Resume
P/N: PM2161
Macronix Proprietary
MX25R1635F
ULTRA LOW POWER, 16M-BIT [x 1/x 2/x 4]
CMOS MXSMIO
®
(SERIAL MULTI I/O)
FLASH MEMORY
2
Rev. 1.6, December 12, 2018
MX25R1635F
P/N: PM2161
Macronix Proprietary
Contents
1. FEATURES ..............................................................................................................................................................4
2. GENERAL DESCRIPTION ..................................................................................................................................... 6
Table 1. Additional Feature
..........................................................................................................................7
3. PIN CONFIGURATIONS
......................................................................................................................................... 8
4. PIN DESCRIPTION .................................................................................................................................................. 8
5. BLOCK DIAGRAM ................................................................................................................................................... 9
6. DATA PROTECTION .............................................................................................................................................. 10
Table 2. Protected Area Sizes
................................................................................................................... 11
Table 3. 8K-bit Secured OTP Denition ....................................................................................................12
7. MEMORY ORGANIZATION
................................................................................................................................... 13
Table 4. Memory Organization
..................................................................................................................13
8. DEVICE OPERATION
............................................................................................................................................ 14
9. HOLD FEATURE .................................................................................................................................................... 16
10. COMMAND DESCRIPTION ................................................................................................................................. 17
Table 5. Command Set
..............................................................................................................................17
10-1. Write Enable (WREN) .............................................................................................................................. 20
10-2. Write Disable (WRDI) ............................................................................................................................... 21
10-3. Read Identication (RDID) ....................................................................................................................... 22
10-4. Read Electronic Signature (RES) ............................................................................................................ 23
10-5. Read Electronic Manufacturer ID & Device ID (REMS) ........................................................................... 24
10-6. ID Read .................................................................................................................................................... 25
Table 6. ID Denitions ..............................................................................................................................25
10-7. Read Status Register (RDSR) ................................................................................................................. 26
10-8. Read Conguration Register (RDCR) ...................................................................................................... 27
10-9. Write Status Register (WRSR) ................................................................................................................. 32
Table 7. Protection Modes .........................................................................................................................33
10-10. Read Data Bytes (READ) ........................................................................................................................ 36
10-11. Read Data Bytes at Higher Speed (FAST_READ) .................................................................................. 37
10-12. Dual Read Mode (DREAD) ...................................................................................................................... 38
10-13. 2 x I/O Read Mode (2READ) ................................................................................................................... 39
10-14. Quad Read Mode (QREAD) .................................................................................................................... 40
10-15. 4 x I/O Read Mode (4READ) ................................................................................................................... 41
10-16. Burst Read ............................................................................................................................................... 43
10-17. Performance Enhance Mode ................................................................................................................... 44
10-18. Sector Erase (SE) .................................................................................................................................... 46
10-19. Block Erase (BE32K) ............................................................................................................................... 47
10-20. Block Erase (BE) ..................................................................................................................................... 48
10-21. Chip Erase (CE) ....................................................................................................................................... 49
10-22. Page Program (PP) ................................................................................................................................. 50
10-23. 4 x I/O Page Program (4PP) .................................................................................................................... 51
10-24. Deep Power-down (DP) ........................................................................................................................... 52
10-25. Enter Secured OTP (ENSO) .................................................................................................................... 53
10-26. Exit Secured OTP (EXSO) ....................................................................................................................... 53
10-27. Read Security Register (RDSCUR) ......................................................................................................... 53
3
Rev. 1.6, December 12, 2018
MX25R1635F
P/N: PM2161
Macronix Proprietary
Table 8. Security Register Denition .........................................................................................................54
10-28. Write Security Register (WRSCUR) ......................................................................................................... 54
10-29. Program Suspend and Erase Suspend ................................................................................................... 55
Table 9. Readable Area of Memory While a Program or Erase Operation is Suspended .........................55
Table 10. Acceptable Commands During Program/Erase Suspend after tPSL/tESL ................................55
Table 11. Acceptable Commands During Suspend (tPSL/tESL not required) ...........................................56
10-30. Program Resume and Erase Resume ..................................................................................................... 57
10-31. No Operation (NOP) ................................................................................................................................ 58
10-32. Software Reset (Reset-Enable (RSTEN) and Reset (RST)) ................................................................... 58
10-33. High Voltage Operation ............................................................................................................................ 60
10-34. Read SFDP Mode (RDSFDP) .................................................................................................................. 61
11. RESET
.................................................................................................................................................................. 62
Table 12. Reset Timing-(Power On)
..........................................................................................................62
Table 13. Reset Timing-(Other Operation) ................................................................................................62
12. POWER-ON STATE
............................................................................................................................................. 63
13. ELECTRICAL SPECIFICATIONS ........................................................................................................................ 64
Table 14. Absolute Maximum Ratings
.......................................................................................................64
Table 15. Capacitance ...............................................................................................................................64
Table 16. DC Characteristics .....................................................................................................................66
Table 17. AC Characteristics .....................................................................................................................68
14. OPERATING CONDITIONS
................................................................................................................................. 72
Table 18. Power-Up/Down Voltage and Timing
......................................................................................... 74
14-1. Initial Delivery State ................................................................................................................................. 74
15. ERASE AND PROGRAMMING PERFORMANCE
.............................................................................................. 75
16. LATCH-UP CHARACTERISTICS ........................................................................................................................ 76
17. ORDERING INFORMATION ................................................................................................................................ 77
18. PART NAME DESCRIPTION ............................................................................................................................... 78
19. PACKAGE INFORMATION .................................................................................................................................. 79
19-1. 8-pin SOP (150mil) .................................................................................................................................. 79
19-2. 8-pin SOP (200mil) .................................................................................................................................. 80
19-3. 8-land USON (2x3mm) ............................................................................................................................ 81
19-4. 8-land WSON (6x5mm)............................................................................................................................ 82
19-5. 12-ball WLCSP (3-2-3 Ball Array) ............................................................................................................ 83
20. REVISION HISTORY
........................................................................................................................................... 84
4
Rev. 1.6, December 12, 2018
MX25R1635F
P/N: PM2161
Macronix Proprietary
1. FEATURES
Ultra Low Power 16M-BIT [x 1/x 2/x 4] CMOS MXSMIO
®
(SERIAL MULTI I/O)
FLASH MEMORY
GENERAL
• Supports Serial Peripheral Interface -- Mode 0 and Mode 3
•
16,777,216 x 1 bit structure or 8,388,608 x 2 bits (two I/O mode) structure or 4,194,304 x 4 bits (four I/O mode)
structure
• Equal Sectors with 4K byte each, Equal Blocks with 32K byte each, or Equal Blocks with 64K byte each
- Any Block can be erased individually
• Single Power Supply Operation
- Operation Voltage: 1.65V-3.6V for Read, Erase and Program Operations
• Latch-up protected to 100mA from -1V to Vcc +1V
PERFORMANCE
• High Performance
- Fast read
- 1 I/O: 80MHz with 8 dummy cycles
- 2 I/O: 80MHz with 4 dummy cycles, equivalent to 160MHz
- 4 I/O: 80MHz with 2+4 dummy cycles, equivalent to 320MHz
- Fast program and erase time
- 8/16/32/64 byte Wrap-Around Burst Read Mode
• Ultra Low Power Consumption
• Minimum 100,000 erase/program cycles
• 20 years data retention
SOFTWARE FEATURES
• Input Data Format
- 1-byte Command code
• Advanced Security Features
- Block lock protection
The BP0-BP3 status bit denes the size of the area to be software protection against program and erase
instructions
• Additional 8K bits secured OTP
- Features unique identier.
- Factory locked identiable and customer lockable
• Auto Erase and Auto Program Algorithm
-
Automatically erases and veries data at selected sector or block
-
Automatically programs and veries data at selected page by an internal algorithm that automatically times the
program pulse widths (Any page to be programed should have page in the erased state rst)
•
Status Register Feature
•
Command Reset
•
Program/Erase Suspend and Program/Erase Resume
•
Electronic Identication
-
JEDEC 1-byte manufacturer ID and 2-byte device ID
- RES command for 1-byte Device ID
- REMS command for 1-byte manufacturer ID and 1-byte device ID
•
Support Serial Flash Discoverable Parameters (SFDP) mode
•
Support Unique ID (Please contact local Macronix sales for detail information)
5
Rev. 1.6, December 12, 2018
MX25R1635F
P/N: PM2161
Macronix Proprietary
HARDWARE FEATURES
•
SCLK Input
- Serial clock input
• SI/SIO0
- Serial Data Input or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode
• SO/SIO1
- Serial Data Output or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode
• WP#/SIO2
- Hardware write protection or serial data Input/Output for 4 x I/O read mode
• RESET#/SIO3 * or HOLD#/SIO3 *
- Hardware Reset pin or Serial input & Output for 4 x I/O read mode
or
- HOLD feature, to pause the device without deselecting the device or Serial input & Output for 4 x I/O read mode
* Depends on part number options
• PACKAGE
- 8-pin SOP (150mil/200mil)
- 8-land USON (2x3mm)
- 8-land WSON (6x5mm)
- 12-ball WLCSP (3-2-3 Ball Array)
-
All devices are RoHS Compliant and Halogen-free
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