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The Texas Instruments bq78350-R1 Li-Ion and LiFePO4 Battery Management Controller and companion to the bq769x0 family of Analog Front End (AFE) protection devices provides a comprehensive set of Battery Management System (BMS) subsystems, helping to accelerate product development for faster time-to-market. The bq78350-R1 controller and the bq769x0 AFE support 3-series to 15-series cell applications. The bq78350-R1 device provides an accurate fuel gauge and state-of-health (SoH) monitor, as well as cell balancing and a full range of voltage-, current-, and temperature-based protection features.
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BAT
VC5
VC4
VC3
VC2
VC1
VSS
SCL
SDA
CHG
DSG
REGSRC
REGOUT
SRN
SRP
VC0
CAP 1
TS 1
ALERT
PUSH-BUTTON
FOR BOOT
PACK+
PACK–
VCC
ALERT
SDA
SCL
VSS
SMBD
SMBC
SMBD
SMBC
bq76920
PRES
LED1
LED2
LED3
LED4
LED5
KEYIN
BAT
VEN
COM
PWRM
GPIOA
SAFE
VAUX
SMBA
GPIOB
ADREN
RBI
PRECHG
MRST
DISP
Copyright © 2017, Texas Instruments Incorporated
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq78350-R1
SLUSCD0B –AUGUST 2015–REVISED NOVEMBER 2018
bq78350-R1 CEDV Li-Ion Gas Gauge and Battery Management Controller Companion to
the bq769x0 Battery Monitoring AFE
1
1 Features
1
• Compensated End-of-Discharge Voltage (CEDV)
Gauging Algorithm
• Supports SMBus Host Communication
• Flexible Configuration for 3- to 5-Series
(bq76920), 6- to 10-Series (bq76930), and 9- to
15-Series (bq76940) Li-Ion and LiFePO
4
Batteries
• Supports Battery Configurations up to 320 Ahr
• Supports Charge and Discharge Current
Reporting up to 320 A
• On-Chip Temperature Sensor Option
• External NTC Thermistor Support from
Companion AFE
• Full Array of Programmable Protection Features
– Voltage, Current, and Temperature
– System Components
• Lifetime Data Logging
• Supports CC-CV Charging, Including Precharge,
Charge Inhibit, and Charge Suspend
• Offers an Optional Resistor Programmable
SMBus Slave Address for up to Eight Different
Bus Addresses
• Drives up to a 5-Segment LED or LCD Display for
State-Of-Charge Indication
• Provides SHA-1 Authentication
2 Applications
• Light Electric Vehicles (LEVs): eBikes, eScooters,
Pedelec, and Pedal-Assist Bicycles
• Power and Gardening Tools
• Battery Backup and Uninterruptible Power Supply
(UPS) Systems
• Wireless Base Station Backup Systems
• Telecom Power Systems
• Handheld Vacuum Cleaners and Robot Vacuums
3 Description
The Texas Instruments bq78350-R1 Li-Ion and
LiFePO
4
Battery Management Controller and
companion to the bq769x0 family of Analog Front
End (AFE) protection devices provides a
comprehensive set of Battery Management System
(BMS) subsystems, helping to accelerate product
development for faster time-to-market.
The bq78350-R1 controller and the bq769x0 AFE
support 3-series to 15-series cell applications. The
bq78350-R1 device provides an accurate fuel gauge
and state-of-health (SoH) monitor, as well as cell
balancing and a full range of voltage-, current-, and
temperature-based protection features.
Device Information
(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
bq78350-R1 TSSOP (30) 7.80 mm x 6.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
2
bq78350-R1
SLUSCD0B –AUGUST 2015–REVISED NOVEMBER 2018
www.ti.com
Product Folder Links: bq78350-R1
Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 2
6 Pin Configuration and Functions......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 5
7.5 Electrical Characteristics: Supply Current................. 5
7.6 Electrical Characteristics: I/O.................................... 5
7.7 Electrical Characteristics: ADC ................................. 5
7.8 Electrical Characteristics: Power-On Reset.............. 6
7.9 Electrical Characteristics: Oscillator.......................... 6
7.10 Electrical Characteristics: Data Flash Memory ....... 6
7.11 Electrical Characteristics: Register Backup ............ 7
7.12 SMBus Timing Specifications ................................. 7
7.13 Typical Characteristics ........................................... 8
8 Detailed Description.............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 12
8.5 Programming........................................................... 12
9 Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Applications ................................................ 13
10 Power Supply Recommendations ..................... 21
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 22
12 Device and Documentation Support ................. 23
12.1 Related Documentation......................................... 23
12.2 Community Resources.......................................... 23
12.3 Trademarks........................................................... 23
12.4 Electrostatic Discharge Caution............................ 23
12.5 Glossary................................................................ 23
13 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2017) to Revision B Page
• Changed Gas Gauging......................................................................................................................................................... 18
• Changed Power Supply Recommendations......................................................................................................................... 21
Changes from Original (August 2015) to Revision A Page
• Changed Applications ............................................................................................................................................................ 1
5 Description (continued)
The bq78350-R1 device offers optional LED or LCD display configurations for capacity reporting. It also makes
data available over its SMBus 1.1 interface. Battery history and diagnostic data is also kept within the device in
non-volatile memory and is available over the same interface.
3
bq78350-R1
www.ti.com
SLUSCD0B –AUGUST 2015–REVISED NOVEMBER 2018
Product Folder Links: bq78350-R1
Submit Documentation FeedbackCopyright © 2015–2018, Texas Instruments Incorporated
(1) I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power
6 Pin Configuration and Functions
30-Pin DBT Package
Pin Functions
PIN
NUMBER
PIN NAME TYPE DESCRIPTION
1 COM O
(1)
Open-drain output LCD common connection. Leave unconnected if not used.
2 ALERT I Input from the bq769x0 AFE
3 SDA I/O Data transfer to and from the bq769x0 AFE. Requires a 10-k pullup to VCC
4 SCL I/O Communication clock to the bq769x0 AFE. Requires a 10-k pullup to VCC
5 PRECHG O
Programmable polarity (default is active low) output to enable an optional precharge FET. This pin
requires an external pullup to 2.5 V when configured as active high, and is open drain when
configured as active low.
6 VAUX AI Auxiliary voltage input. If this pin is not used, then it should be tied to VSS.
7 BAT AI Translated battery voltage input
8 PRES I
Active low input to sense system insertion. This typically requires additional ESD protection. If this
pin is not used, then it should be tied to VSS.
9 KEYIN I
A low level indicates application key-switch is inactive on position. A high level causes the DSG
protection FET to open. If this pin is not used, then it should be tied to VSS.
10 SAFE O Active high output to enforce an additional level of safety protection (for example, fuse blow)
11 SMBD I/OD
SMBus data open-drain bidirectional pin used to transfer an address and data to and from the
bq78350-R1 device
12 VEN O
Active high voltage translation enable. This open drain signal is used to switch the input voltage
divider on/off to reduce the power consumption of the BAT translation divider network.
13 SMBC I/OD
SMBus clock open-drain bidirectional pin used to clock the data transfer to and from the bq78350-
R1 device
14 DISP I
Display control for the LEDs. This pin is typically connected to bq78350-R1 device REGOUT via a
100-KΩ resistor and a push-button switch connect to VSS. Not used with LCD display enabled and
can be tied to VSS.
15 PWRM O Power mode state indicator open drain output
16 LED1 O
LED1/LCD1 display segment that drives an external LED/LCD, depending on the firmware
configuration
17 LED2 O
LED2/LCD2 display segment that drives an external LED/LCD, depending on the firmware
configuration
18 LED3 O
LED3/LCD3 display segment that drives an external LED/LCD, depending on the firmware
configuration
19 LED4 O
LED4/LCD4 display segment that drives an external LED/LCD, depending on the firmware
configuration
4
bq78350-R1
SLUSCD0B –AUGUST 2015–REVISED NOVEMBER 2018
www.ti.com
Product Folder Links: bq78350-R1
Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated
Pin Functions (continued)
PIN
NUMBER
PIN NAME TYPE DESCRIPTION
20 LED5 O
LED5/LCD5 display segment that drives an external LED/LCD, depending on the firmware
configuration
21 GPIO A I/O Configurable Input or Output. If not used, tie to VSS.
22 VSS — Negative supply voltage
23 VSS — Negative supply voltage
24 MRST I
Master reset input that forces the device into reset when held low. This pin must be held high for
normal operation.
25 VSS — Negative supply voltage
26 VCC P Positive supply voltage
27 RBI P
RAM backup input. Connect a capacitor to this pin and VSS to protect loss of RAM data in case of
short circuit condition.
28 GPIO B I/O Configurable input or output. If not used, tie to VSS.
29 ADREN O Optional digital signal enables address detection measurement to reduce power consumption.
30 SMBA IA Optional SMBus address detection input. If this pin is not used, then it should be tied to VSS.
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
relative to V
SS
Supply voltage range –0.3 2.75 V
V
(IOD)
relative to V
SS
Open-drain I/O pins –0.3 6 V
V
I
relative to V
SS
Input voltage range to all other pins –0.3 VCC + 0.3 V
Operating free-air temperature range, T
A
–40 85 °C
Storage temperature range, T
stg
–65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE UNIT
V
(ESD)
Human Body Model (HBM) ESD stress voltage
(1)
±2000
V
Charged Device Model (CDM) ESD stress voltage
(2)
±500
7.3 Recommended Operating Conditions
V
CC
= 2.4 V to 2.6 V, T
A
= –40°C to 85°C (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
Supply voltage 2.4 2.5 2.6 V
V
O
Output voltage range
SAFE V
CC
SMBC, SMBD, VEN 5.5 V
ADREN, GPIO A, GPIO B, SDATA, SCLK,
PWRM, LED1...5 (when used as GPO)
V
CC
V
IN
Input voltage range
BAT, VAUX, SMBA 1
V
SMBD, SMBC, ALERT, DISP, PRES, KEYIN 5.5
SDATA, GPIO A, GPIO B, LED1...5 (when
used as GPI)
V
CC
T
OPR
Operating Temperature –40 85 °C
5
bq78350-R1
www.ti.com
SLUSCD0B –AUGUST 2015–REVISED NOVEMBER 2018
Product Folder Links: bq78350-R1
Submit Documentation FeedbackCopyright © 2015–2018, Texas Instruments Incorporated
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Thermal Information
THERMAL METRIC
(1)
bq78350-R1
UNITTSSOP (DBT)
30 PINS
R
θJA, High K
Junction-to-ambient thermal resistance 81.4
°C/W
R
θJC(top)
Junction-to-case(top) thermal resistance 16.2
R
θJB
Junction-to-board thermal resistance 34.1
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 33.6
R
θJC(bottom)
Junction-to-case(bottom) thermal resistance n/a
(1) The actual current consumption of this mode fluctuates during operation over a 1-s period. The value shown is an average using the
default data flash configuration.
(2) The actual current consumption of this mode fluctuates during operation over a user-configurable period. The value shown is an average
using the default data flash configuration.
7.5 Electrical Characteristics: Supply Current
V
CC
= 2.4 V to 2.6 V, T
A
= –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
CC
Operating mode current No flash programming 650
(1)
μA
I
(SLEEP)
Low-power storage mode current SLEEP mode 300
(2)
μA
I
(SHUTDOWN)
Low-power SHUTDOWN mode current SHUTDOWN mode 0.1 1 μA
7.6 Electrical Characteristics: I/O
V
CC
= 2.4 V to 2.6 V, T
A
= –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
OL
Output voltage low SMBC, SMBD,
SDATA, SCLK, SAFE, ADREN, VEN,
GPIO A, GPIO B, PWRM
I
OL
= 0.5 mA 0.4 V
Output voltage low LED1, LED2, LED3,
LED4, LED5
I
OL
= 3 mA 0.4
V
OH
Output voltage high SMBC, SMBD,
SDATA, SCLK, SAFE, ADREN, VEN,
GPIO A, GPIO B, PWRM
I
OH
= –1 mA V
CC
– 0.5 V
V
IL
Input voltage low SMBC, SMBD, SDATA,
SCLK, ALERT, DISP, SMBA, GPIO A,
GPIO B, PRES, KEYIN
–0.3 0.8 V
V
IH
Input voltage high SMBC, SMBD,
SDATA, SCLK, ALERT, SMBA, GPIO A,
GPIO B
2 6 V
Input voltage high DISP, PRES, KEYIN 2 V
CC
+ 0.3 V
C
IN
Input capacitance 5 pF
I
LKG
Input leakage current 1 µA
7.7 Electrical Characteristics: ADC
V
CC
= 2.4 V to 2.6 V, T
A
= –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input voltage range BAT, VAUX –0.2 1 V
Conversion time 16 ms
Resolution (no missing codes) 16 bits
Effective resolution 13 14 bits
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