01.20.2017 PRODUCT SPECIFICATION proprietary to OmniVision Technologies
i
ordering information
OV08856-GA4A (color, chip probing, 200 µm
backgrinding, reconstructed wafer with good die)
00applications
cellular phones
PC multimedia
tablets
00features
1.12 µm x 1.12 µm pixel
optical size of 1/4"
32.9° CRA for < 5mm Z-height
programmable controls for frame rate, mirror and flip,
cropping, and windowing
supports images sizes: 8MP (4:3, 3264x2448), 8MP
(16:9, 3264x1836), EIS 1080p (2112x1188), 1080p
(1920x1080), EIS 720p (1408x792), and more
8MP at 30 fps (720Mbps/4-lane or 1.44Gbps/2-lane)
two on-chip phase lock loops (PLLs)
two-wire serial bus control (SCCB)
8k bits of embedded one-time programmable (OTP)
memory
image quality control: defect pixel correction,
automatic black level calibration, lens shading
correction and alternate row HDR
suitable for module size of 8.5mm x 8.5mm x ~4mm
note The
OV8856 supports LVDS
interface. Contact your
local FAE for details.
00key specifications (typical)
active array size: 3264 x 2448
power supply:
analog: 2.6 ~ 3.0V (2.8V nominal)
core: 1.14 ~ 1.26V (1.2V nominal)
I/O: 1.7 ~ 1.9V (1.8V)
power requirements:
active: 150 mW
standby: 0.8 µW
XSHUTDN: 1 µW
temperature range:
operating: -30°C to +85°C junction temperature
(see table 7-2)
stable image: 0°C to +60°C junction temperature
(see table 7-2)
output interfaces: up to 4-lane MIPI serial output
output formats: 10-bit RGB RAW
lens chief ray angle: 32.9° non-linear (see
figure 9-2)
lens size: 1/4"
input clock frequency: 6~27 MHz
max S/N ratio: 36.5 dB
dynamic range: 70 dB @ 8x gain
maximum image transfer rate:
3264x2448: 30 fps (see table 2-1)
3264x1836: 30 fps (see table 2-1)
2112x1188: 60 fps (see table 2-1)
1920x1080: 60 fps (see table 2-1)
1408x792: 90 fps (see table 2-1)
sensitivity: 480 mV/Lux-sec
scan mode: progressive
pixel size: 1.12 µm x 1.12 µm
dark current: 12e
-
/sec @ 60°C junction temperature
image area: 3678.336 µm x 2767.68 µm
die dimensions: 4806 µm x 3969 µm (COB),
4856 µm x 4019 µm (RW) (see section 8 for details)
note higher
junction temperature
degrades image quality
note COB refers
to whole wafers with
known good die and
RW refers to singulated
good die on a
reconstructed wafer.
Die size differs between
COB and RW.
Confidential for
Leadcore only
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