Trend of LED Package Type
Wafer Level Packaging
Considerations in Wafer Level Packaging (WLP)
Semi Wafer Level Packaging -----
Dice the device wafer first and then mount the diced chips on a carrier wafer
for the subsequent wafer level packaging processes; the packaged carrier wafer
is diced into components at the end.
Full Wafer Level Packaging -----
Bond the device wafer to the carrier wafer(s) directly without dicing; after
completing all wafer level packaging processes, the stacked wafers are diced
into packaged components.
Enabling Technologies for LED WLP -----
Preparation of submount wafer
Chip mounting and/or wafer bonding
Interconnection
Phosphor deposition
Encapsulation
Array lenses
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