Modelling and optimization of f ilm thickness variation for plas...

This letter describes a method for modelling film thickness variation across the deposition area within plasma enhanced chemical vapour deposition (PECVD) processes. The model enables identification and optimization of film thickness uniformity. Comparison between theory and experiment is provided for PECVD of diamond-like-carbon (DLC) deposition onto flat and curved substrate geometries. Results show DLC uniformity of 0.30% over a 200-mm flat zone diameter within overall electrode diameter of 3