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CDCE62005
SCAS862G –NOVEMBER 2008–REVISED JULY 2016
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 4
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings ...................................... 6
6.2 ESD Ratings.............................................................. 6
6.3 Thermal Information.................................................. 6
6.4 Electrical Characteristics........................................... 7
6.5 Timing Requirements.............................................. 11
6.6 SPI Bus Timing Characteristics .............................. 11
6.7 Typical Characteristics............................................ 12
7 Parameter Measurement Information ................ 13
8 Detailed Description............................................ 14
8.1 Overview ................................................................. 14
8.2 Functional Block Diagrams ..................................... 14
8.3 Feature Description................................................. 20
8.4 Device Functional Modes........................................ 52
8.5 Programming........................................................... 55
8.6 Register Maps......................................................... 61
9 Application and Implementation ........................ 70
9.1 Application Information............................................ 70
9.2 Typical Application .................................................. 70
10 Power Supply Recommendations ..................... 74
11 Layout................................................................... 76
11.1 Layout Guidelines ................................................. 76
11.2 Layout Example .................................................... 76
12 Device and Documentation Support ................. 77
12.1 Trademarks........................................................... 77
12.2 Documentation Support ........................................ 77
12.3 Electrostatic Discharge Caution............................ 77
12.4 Glossary................................................................ 77
13 Mechanical, Packaging, and Orderable
Information ........................................................... 77
4 Revision History
Changes from Revision F (January 2015) to Revision G Page
• Removed minimum and maximum values and added typical value to on-chip load capacitance in Electrical
Characteristics ....................................................................................................................................................................... 7
Changes from Revision E (July 2014) to Revision F Page
• Added Low Noise Clock Generator: 550 fs rms typical (10 kHz to 20 MHz Integration Bandwidth), F
C
= 100 MHz in
Features section ..................................................................................................................................................................... 1
• Added Low Noise Jitter Cleaner: 2.6 ps rms typical (10 kHz to 20 MHz Integration Bandwidth), F
C
= 100 MHz in
Features section ..................................................................................................................................................................... 1
Changes from Revision D (April 2011) to Revision E Page
• Changed Added, updated, or revised the following sections: Features; Application and Implementation; Power
Supply Recommendations ; Layout ; Device and Documentation Support ; Mechanical, Packaging, and Ordering
Information ............................................................................................................................................................................. 1
• Changed Bit Name from LOCKW(3) to LOCKW(2).............................................................................................................. 48
• Changed Bit Name from LOCKW(2) to LOCKW(1).............................................................................................................. 48
• Changed Bit Name from LOCKW(1) to LOCKW(0).............................................................................................................. 48
• Changed REGISTER.BIT from 5.26 to 5.25, from 5.25 to 5.24, from 5.24 to 5.23, from 5.23 to 5.22. .............................. 48
Changes from Revision C (February, 2010) to Revision D Page
• Changed 0 to 1 in SPI_LE description ................................................................................................................................... 4
• Changed last sentence in Description column of Pin 46 and Pin 2 ....................................................................................... 5
• Changed Outputs to Output 1 in P
LVCMOS
Test Conditions, changed PD to Power_Down in LVCMOS INPUT MODE,
and deleted (LVCMOS signals) from Input capacitance in Electrical Characteristics............................................................ 7
• Changed TIMING REQUIREMENTS table........................................................................................................................... 11
• Added 1 row to TIMING Requirements table - Input Clock Slew Rate... ............................................................................. 11