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SN74HC595器件手册
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SN74HC595器件手册
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SNx4HC595 8-Bit Shift Registers With 3-State Output Registers
1 Features
• 8-bit serial-in, parallel-out shift
• Wide operating voltage range of 2 V to 6 V
• High-current 3-state outputs can drive up to 15
LSTTL loads
• Low power consumption: 80-μA (maximum) I
CC
• t
pd
= 13 ns (typical)
• ±6-mA output drive at 5 V
• Low input current: 1 μA (maximum)
• Shift register has direct clear
• On products compliant to MIL-PRF-38535,
all parameters are tested unless otherwise noted.
On all other products, production processing does
not necessarily include testing of all parameters.
2 Applications
• Network switches
• Power infrastructure
• LED displays
• Servers
3 Description
The SNx4HC595 devices contain an 8-bit, serial-in,
parallel-out shift register that feeds an 8-bit D-type
storage register. The storage register has parallel 3-
state outputs. Separate clocks are provided for both
the shift and storage register. The shift register has
a direct overriding clear (SRCLR) input, serial (SER)
input, and serial outputs for cascading. When the
output-enable (OE) input is high, the outputs are in
the high-impedance state.
Device Information
PART NUMBER PACKAGE
(1)
BODY SIZE (NOM)
SN54HC595FK LCCC (20) 8.89 mm × 8.89 mm
SN54HC595J CDIP (16) 21.34 mm × 6.92 mm
SN74HC595N PDIP (16) 19.31 mm × 6.35 mm
SN74HC595D SOIC (16) 9.90 mm × 3.90 mm
SN74HC595DW SOIC (16) 10.30 mm × 7.50 mm
SN74HC595DB SSOP (16) 6.20 mm × 5.30 mm
SN74HC595PW TSSOP (16) 5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
3R
C3
3S
1D
C1
R
3R
C3
3S
2R
C2
R
2S
3R
C3
3S
2R
C2
R
2S
3R
C3
3S
2R
C2
R
2S
3R
C3
3S
2R
C2
R
2S
3R
C3
3S
2R
C2
R
2S
3R
C3
3S
2R
C2
R
2S
3R
C3
3S
2R
C2
R
2S
13
12
10
11
14
15
1
2
3
4
5
6
7
9
Q
A
Q
B
Q
C
Q
D
Q
E
Q
F
Q
G
Q
H
Q
H′
OE
SRCLR
RCLK
SRCLK
SER
Pin numbers shown are for the D, DB, DW, J, N, NS, PW, and W packages.
Functional Block Diagram
SN54HC595, SN74HC595
SCLS041J – DECEMBER 1982 – REVISED OCTOBER 2021
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics.............................................5
6.6 Timing Requirements.................................................. 6
6.7 Switching Characteristics............................................8
6.8 Operating Characteristics........................................... 8
6.9 Typical Characteristics................................................ 9
7 Parameter Measurement Information.......................... 10
8 Detailed Description...................................................... 11
8.1 Overview................................................................... 11
8.2 Functional Block Diagram......................................... 11
8.3 Feature Description...................................................12
8.4 Device Functional Modes..........................................12
9 Application and Implementation.................................. 13
9.1 Application Information............................................. 13
9.2 Typical Application.................................................... 13
10 Power Supply Recommendations..............................15
11 Layout........................................................................... 15
11.1 Layout Guidelines................................................... 15
11.2 Layout Example...................................................... 15
12 Device and Documentation Support..........................16
12.1 Documentation Support.......................................... 16
12.2 Support Resources................................................. 16
12.3 Trademarks............................................................. 16
12.4 Electrostatic Discharge Caution..............................16
12.5 Glossary..................................................................16
13 Mechanical, Packaging, and Orderable
Information.................................................................... 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (November 2009) to Revision I (August 2015) Page
• Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings
table, Thermal Information table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................. 1
• Deleted Ordering Information table. ...................................................................................................................1
• Added Military Disclaimer to Features list...........................................................................................................1
Changes from Revision I (August 2015) to Revision J (October 2021) Page
• Updated the device information table, ESD ratings table, and the device functional modes table to fit modern
data sheet standards.......................................................................................................................................... 1
SN54HC595, SN74HC595
SCLS041J – DECEMBER 1982 – REVISED OCTOBER 2021
www.ti.com
2 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: SN54HC595 SN74HC595
5 Pin Configuration and Functions
D, N, NS, J, DB, or PW Package
16-Pin SOIC, PDIP, SO, CDIP, SSOP, or TSSOP
Top View
FK Package
20-Pin LCCC
Top View
Table 5-1. Pin Functions
PIN
I/O
(1)
DESCRIPTION
NAME
SOIC, PDIP,
SO, CDIP,
SSOP, or
TSSOP
LCCC
GND 8 10 — Ground Pin
OE 13 17 I Output Enable
Q
A
15 19 O Q
A
Output
Q
B
1 2 O Q
B
Output
Q
C
2 3 O Q
C
Output
Q
D
3 4 O Q
D
Output
Q
E
4 5 O Q
E
Output
Q
F
5 7 O Q
F
Output
Q
G
6 8 O Q
G
Output
Q
H
7 9 O Q
H
Output
Q
H'
9 12 O Q
H'
Output
RCLK 12 14 I RCLK Input
SER 14 18 I SER Input
SRCLK 11 14 I SRCLK Input
SRCLR 10 13 I SRCLR Input
NC —
1
— No Connection
16
11
16
V
CC
— 20 — Power Pin
(1) Signal Types: I = Input, O = Output, I/O = Input or Output.
www.ti.com
SN54HC595, SN74HC595
SCLS041J – DECEMBER 1982 – REVISED OCTOBER 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: SN54HC595 SN74HC595
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage –0.5 7 V
I
IK
Input clamp current
(2)
V
I
< 0 or V
I
> V
CC
±20 mA
I
OK
Output clamp current
(2)
V
O
< 0 or V
O
> V
CC
±20 mA
I
O
Continuous output current V
O
= 0 to V
CC
±35 mA
Continuous current through V
CC
or GND ±70 mA
T
J
Junction temperature 150 °C
T
stg
Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
2000
V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002
(2)
1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
SN54HC595 SN74HC595
UNIT
MIN NOM MAX MIN NOM MAX
V
CC
Supply voltage 2 5 6 2 5 6 V
V
IH
High-level input voltage
V
CC
= 2 V 1.5 1.5
VV
CC
= 4.5 V 3.15 3.15
V
CC
= 6 V 4.2 4.2
V
IL
Low-level input voltage
V
CC
= 2 V 0.5 0.5
VV
CC
= 4.5 V 1.35 1.35
V
CC
= 6 V 1.8 1.8
V
I
Input voltage 0 V
CC
0 V
CC
V
V
O
Output voltage 0 V
CC
0 V
CC
V
Δt/Δv Input transition rise or fall time
(2)
V
CC
= 2 V 1000 1000
nsV
CC
= 4.5 V 500 500
V
CC
= 6 V 400 400
T
A
Operating free-air temperature –55 125 –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs, SCBA004.
(2) If this device is used in the threshold region (from V
IL
max = 0.5 V to V
IH
min = 1.5 V), there is a potential to go into the wrong state
from induced grounding, causing double clocking. Operating with the inputs at t
t
= 1000 ns and V
CC
= 2 V does not damage the device;
however, functionally, the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
SN54HC595, SN74HC595
SCLS041J – DECEMBER 1982 – REVISED OCTOBER 2021
www.ti.com
4 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: SN54HC595 SN74HC595
6.4 Thermal Information
THERMAL METRIC
(1)
SN74HC595
UNITD (SOIC) DB (SSOP) DW (SOIC) N (PDIP) NS (SO)
PW
(TSSOP)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
R
θJA
Junction-to-ambient thermal resistance 73 82 57 67 64 108 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
T
A
= 25°C SN54HC595 SN74HC595
UNIT
MIN TYP MAX MIN MAX MIN MAX
V
OH
V
I
= V
IH
or V
IL
I
OH
= –20 μA
2 V 1.9 1.998 1.9 1.9
V
4.5 V 4.4 4.499 4.4 4.4
6 V 5.9 5.999 5.9 5.9
Q
H′
, I
OH
= –4 mA
4.5 V
3.98 4.3 3.7 3.84
Q
A
– Q
H
, I
OH
= –6 mA 3.98 4.3 3.7 3.84
Q
H′
, I
OH
= −5.2 mA
6 V
5.48 5.8 5.2 5.34
Q
A
– Q
H
, I
OH
= –7.8 mA 5.48 5.8 5.2 5.34
V
OL
V
I
= V
IH
or V
IL
I
OL
= 20 μA
2 V 0.002 0.1 0.1 0.1
V
4.5 V 0.001 0.1 0.1 0.1
6 V 0.001 0.1 0.1 0.1
Q
H′
, I
OL
= 4 mA
4.5 V
0.17 0.26 0.4 0.33
Q
A
– Q
H
, I
OL
= 6 mA 0.17 0.26 0.4 0.33
Q
H′
, I
OL
= 5.2 mA
6 V
0.15 0.26 0.4 0.33
Q
A
– Q
H
, I
OL
= 7.8 mA 0.15 0.26 0.4 0.33
I
I
V
I
= V
CC
or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
I
OZ
V
O
= V
CC
or 0, Q
A
– Q
H
6 V ±0.01 ±0.5 ±10 ±5 µA
I
CC
V
I
= V
CC
or 0, I
O
= 0 6 V 8 160 80 µA
C
i
2 V to
6 V
3 10 10 10 pF
www.ti.com
SN54HC595, SN74HC595
SCLS041J – DECEMBER 1982 – REVISED OCTOBER 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: SN54HC595 SN74HC595
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