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BK7252, DataSheet芯片规格书-V1.3.pdf
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2022-11-29
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它集成了硬件和软件组件,完成了完整的802.11b/g/n音频和视频应用,同时支持AP和STA角色,集成了蓝牙低功耗收发器和5.0版本投诉协议栈。 高速的32-bi MCU和大的嵌入式RAM使它能够支持多个云链接,也适合音频和图像应用。 芯片具有8位DVP从CMOS传感器获取图像数据,可通过内部VGA级运动JPEG编解码器进行编码。 集成的QSPI接口同时支持FLASH和RAM扩展芯片通过两个独立的端口提供发送active指示灯和接收active指示灯,支持外部PA和外部LNA芯片具有灵活的外围设备,如PWM, 125, 12C, UART, SPI, SDIO, USB和IrDA。 多达6通道的3位PWM输出,使其适合于精确的LED控制。 芯片有32字节的eFUSE用于唯一ID、代码加密和调试接口禁用。
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Wi-Fi Audio/Video SoC V1.3
© 2019-2022 Beken Corporation Proprietary and Confidential Page 2 of 26
Contents
1. Introduction ........................................................................................................................ 5
2. Features ................................................................................................................................ 6
3. Pin Description ................................................................................................................... 7
4. Wi-Fi and Bluetooth ........................................................................................................ 11
5. Clock .................................................................................................................................... 11
6. Reset .................................................................................................................................... 13
7. Power Management ........................................................................................................ 13
8. Peripheral ........................................................................................................................... 13
8.1. UART ........................................................................................................................... 13
8.2. SPI ................................................................................................................................ 14
8.3. SDIO ............................................................................................................................ 14
8.4. I2C ............................................................................................................................... 14
8.5. USB .............................................................................................................................. 15
8.6. General Purpose ADC ............................................................................................ 15
8.7. PWM ........................................................................................................................... 15
8.8. Timer ........................................................................................................................... 15
8.9. GPIO ............................................................................................................................ 16
8.10. FLASH Download .................................................................................................... 19
8.11. CMOS Sensor Interface and MJPEG Encoder .................................................. 19
8.12. IrDA Interface ........................................................................................................... 20
8.13. I2S Interface .............................................................................................................. 20
8.14. Audio Peripheral ...................................................................................................... 20
8.15. QSPI Interface .......................................................................................................... 21
8.16. Security ...................................................................................................................... 21
8.17. Temperature Sensor ............................................................................................... 22
BK7252 Data Sheet V1.3
© 2019-2022 Beken Corporation Proprietary and Confidential Page 3 of 26
9. Characteristics ................................................................................................................... 22
9.1. Absolute Maximum Ratings ................................................................................. 22
9.2. ESD Ratings ............................................................................................................... 22
9.3. Recommended Operating Conditions .............................................................. 22
9.4. Current Consumption ............................................................................................ 23
9.5. WLAN Receiver Characteristics ........................................................................... 23
9.6. WLAN Transmitter Characteristics ...................................................................... 23
9.7. Bluetooth LE Receiver Characteristics ............................................................... 24
9.8. Bluetooth LE Transmitter Characteristics ......................................................... 24
9.9. Audio Characteristics ............................................................................................. 25
10. Package .............................................................................................................................. 26
11. Order Information ........................................................................................................... 26
Wi-Fi Audio/Video SoC V1.3
© 2019-2022 Beken Corporation Proprietary and Confidential Page 4 of 26
Revision History
Version
Description
Date
Author
V1.0
Initial release
May/15/2019
WF
V1.1
• Updated Section 9.6 WLAN
Transmitter Characteristics
• Added sections 9.7 Bluetooth LE
Receiver Characteristics and 9.8
Bluetooth LE Transmitter
Characteristics
June/8/2021
QS
V1.2
Corrected the pin position of ADC4 (Pin
48) and ADC5 (Pin 46) in the pin
description table in Section 3 Pin
Description
April/22/2022
QS
V1.3
Updated ordering part number in Section
11 Order Information
May/10/2022
YJL
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