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SGM41510

C Controlled 5A Single-Cell

Fast Charger with High Input Voltage and

Adjustable Voltage USB On-the-Go Boost Mode

ADVANCE DATASHEET

SG Micro Corp

www.sg-micro.com

APRIL 12, 2020

FEATURES

● High Efficiency, 1.5MHz, Synchronous Buck Charger

 93.5% Charge Efficiency at 1A Charge Current

 92.5% Charge Efficiency at 2A Charge Current

 90.8% Charge Efficiency at 3A Charge Current

 PFM Mode for Light Load Efficiency

● USB On-The-Go (OTG) Support (Boost Mode)

 Boost Converter with up to 2.4A (Default) Output

 Boost Efficiency of 94% at 5V/1A Output

 Accurate Hiccup Mode Over-Current Protection

 Soft-Start Capable with up to 500μF Capacitive Load

 Output Short Circuit Protection

 Selectable PFM Mode for Light Load Operations

● Single Input for USB or High Voltage Adapters

 3.9V to 14V Operating Input Voltage Range

 Programmable Input Current Limit and Dynamic

Power Management (IINLIM, 100mA to 4.9A with

100mA Resolution) to Support USB 2.0 and USB 3.0

Standards and High Voltage Adaptors

 Maximum Power Tracking by Input Voltage Limit up

to 15.3V (VINDPM)

 VINDPM Tracking of Battery Voltage

● Resistance Compensation (IRCOMP) Function

● High Battery Discharge Efficiency with 16mΩ Switch

● Narrow Voltage DC (NVDC) Power Path Management

 Instant-On with No or Highly Depleted Battery

 Ideal Diode Operation in Battery Supplement Mode

● Ship Mode, Wake-Up and Full System Reset Capability

by Battery FET Control

● Flexible Autonomous and I

C Operation Modes for

Optimal System Performance

● Fully Integrated Switches, Current Sense and

Compensation

● 9μA Ship Mode Low Battery Leakage Current

● High Accuracy

 ±0.5% Charge Voltage Regulation

● Safety

 Thermal Regulation and Thermal Shutdown

 Input Under-Voltage Lockout (UVLO)

 Input Over-Voltage Protection

APPLICATIONS

Tablet PC

Smart Phones, EPOS

Portable Internet Devices and Accessory

SIMPLIFIED SCHEMATIC

VBUS

SYS

BAT

nQON

SGM41510

USB

Host

Host Control

C Bus

Input

3.9V to 14V

OTG

5V at 2.4A

SYS 3.5V to 4.5V

CHG

= 5A

Optional

To ADC

LUXINGTONG

[email protected]

BILATERAL CONFIDENTIAL

C Controlled 5A Single-Cell Fast Charger with High Input Voltage

SGM41510 and Adjustable Voltage USB On-the-Go Boost Mode

APRIL 2020

SG Micro Corp

www.sg-micro.com

GENERAL DESCRIPTION

The SGM41510 is a battery charger and system power path

management device with integrated converter and power

switches for use with single-cell Li-Ion or Li-polymer batteries.

This highly integrated 5A device is capable for fast charging

and supports up to 14V input voltage suitable for smart phones,

tablets and portable systems. During discharging phase, the

low impedance power path optimizes the efficiency and

reduces the battery charging time. It integrates resistance

compensation (IRCOMP) to deliver maximum charging power

to battery. I

C programming makes it a very flexible powering

and charger design solution.

The device includes four main power switches: input reverse

blocking FET (RBFET, Q1), high-side switching FET for buck

or boost mode (HSFET, Q2), low-side switching FET for buck

or boost mode switching (LSFET, Q3) and battery FET that

controls the interconnection of the system and battery

(BATFET, Q4). The bootstrap diode for the high-side gate

driving is also integrated. The internal power path has a very

low impedance that reduces the charging time and maximizes

the battery discharge efficiency. Moreover the input voltage

and current regulations provide maximum charging power

delivery to the battery with various types of input sources.

The device also meets USB On-the-Go (OTG) operation power

rating specification by supplying 5V (adjustable 4.5V to 5.5V)

on VBUS pin with a default current limit of 2.4A (adjustable

1.2A to 4A).

The system voltage is regulated slightly above the battery

voltage by the power path management circuit and is kept

above the programmable minimum system voltage (3.5V by

default). Therefore, system power is maintained even if the

battery is completely depleted or removed. Dynamic power

management (DPM) feature is also included that automatically

reduces the charge current if the input current or voltage limit is

reached. If the system load continues to increase after

reduction of charge current down to zero, the power path

management provides the deficit from battery by discharging

battery to the system until the system power demand is fulfilled.

This is called supplement mode and prevents input source

overloading.

Starting and termination of a charging cycle can be

accomplished without software control. The sensed battery

voltage is used to decide for starting phase of charge in one of

the three phases of charge cycle: pre-conditioning, constant

current or constant voltage. When the charge current falls

below a preset limit and the battery voltage is above recharge

threshold, the charger function will automatically terminate and

end the charging cycle. If the voltage of a charged battery falls

below the recharge threshold, the charger starts another

charging cycle.

Several safety features are provided in the SGM41510 such as

over-voltage and over-current protections, charging safety

timing, thermal shutdown and input UVLO. This device also

features thermal regulation in which the charge current is

reduced if the junction temperature exceeds 120℃ (selectable).

Charging status is reported by the STAT output and fault/status

bits. A negative pulse is sent to the nINT output pin as soon as

a fault occurs to notify the host. BATFET reset control is

provided by nQON pin to exit ship mode or for a full system

reset.

The device is available in a Green TQFN-4×4-24L package.

PIN CONFIGURATION

(TOP VIEW)

1VBUS

24 23 22 21

20 19

7 8 9 10 11 12

SGM41510

PSEL

STAT

SCL

SDA

GND

SYS

BAT

VBUS

PMID

REGN

BTST

nINT

OTG

ILIM

nCE

nQON

nPG

TQFN-4×4-24L

LUXINGTONG

[email protected]

BILATERAL CONFIDENTIAL

C Controlled 5A Single-Cell Fast Charger with High Input Voltage

SGM41510 and Adjustable Voltage USB On-the-Go Boost Mode

APRIL 2020

SG Micro Corp

www.sg-micro.com

PACKAGE/ORDERING INFORMATION

MODEL

PACKAGE

DESCRIPTION

SPECIFIED

TEMPERATURE

RANGE

ORDERING

NUMBER

PACKAGE

MARKING

PACKING

OPTION

SGM41510 TQFN-4×4-24L

-40℃ to +85℃

SGM41510YTQF24G/TR

SGM41510

YTQF24

XXXXX

Tape and Reel, 3000

MARKING INFORMATION

NOTE: XXXXX = Date Code, Trace Code and Vendor Code.

Trace Code

Vendor Code

Date Code - Year

X XXX X

Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If

you have additional comments or questions, please contact your SGMICRO representative directly.

ABSOLUTE MAXIMUM RATINGS

Voltage Range (with Respect to GND)

VBUS (Converter not Switching) ......................-2V to 20V

(1)

BTST, PMID (Converter not Switching) ............ -0.3V to 20V

SW ...................................................................... -2V to 16V

SW (Peak for 10ns Duration) .............................. -3V to 16V

BTST to SW ....................................................... -0.3V to 6V

REGN, nCE, nPG, BAT, SYS (Converter not Switching)

........................................................................... -0.3V to 6V

PSEL, SDA, SCL, nINT, nQON, STAT OTG, CM

........................................................................... -0.3V to 6V

ILIM .................................................................... -0.3V to 5V

Output Sink Current

STAT ............................................................................. 6mA

nPG ............................................................................... 6mA

nINT .............................................................................. 6mA

Package Thermal Resistance

TQFN-4×4-24L, θ

.................................................. 37℃/W

TQFN-4×4-24L, θ

.................................................. 24℃/W

Junction Temperature ................................................. +150℃

Storage Temperature Range ......................... -65℃ to +150℃

Lead Temperature (Soldering, 10s) ............................ +260℃

ESD Susceptibility

HBM ............................................................................. 4000V

CDM ............................................................................ 1000V

NOTE: 1. Max 28V for 10 seconds.

RECOMMENDED OPERATING CONDITIONS

Input Voltage Range, V

VBUS

................................. 3.9V to 14V

Input Current (VBUS), I

..................................... 4.9A (MAX)

Output DC Current (SW), I

SWOP

.............................. 5A (MAX)

Battery Voltage, V

BATOP

.................................... 4.608V (MAX)

Fast Charging Current, I

BATOP

................................. 5A (MAX)

Discharging Current (Continuous), I

BATOP

............... 6A (MAX)

Operating Temperature Range ....................... -40℃ to +85℃

OVERSTRESS CAUTION

Stresses beyond those listed in Absolute Maximum Ratings

may cause permanent damage to the device. Exposure

absolute maximum rating conditions for extended periods

may affect reliability. Functional operation of the device at any

conditions beyond those indicated in the Recommended

Operating Conditions section

is not implied.

ESD SENSITIVITY CAUTION

This integrated circuit can be damaged by ESD if you don’t

pay attention to ESD protection. SGMICRO recommends that

all integrated circuits be handled with appropriate precautions.

Failure

to observe proper handling

and installation procedures

can cause damage. ESD damage can range from subtle

performance

degradation to

complete device failure. Precision

integrated circuits may be more susceptible to damage

because very small parametric changes could cause the

device not to meet its published specifications.

DISCLAIMER

SG Micro Corp reserves the right to make any change in

circuit

design, or specifications

without prior notice.

LUXINGTONG

[email protected]

BILATERAL CONFIDENTIAL

C Controlled 5A Single-Cell Fast Charger with High Input Voltage

SGM41510 and Adjustable Voltage USB On-the-Go Boost Mode

APRIL 2020

SG Micro Corp

www.sg-micro.com

PIN DESCRIPTION

PIN NAME TYPE FUNCTION

1, 24 VBUS P

Charger Input (V

). The internal N-channel reverse blocking MOSFET (RBFET) is connected between VBUS and

PMID pins. Place a 1μF ceramic capacitor from VBUS pin to GND close to the device.

2 PSEL DI Power Source Selection Input. An adapter source: low. A USB host source: high.

3 nPG DO

Open-Drain Active Low Input Power Good Indicator. Use a 10kΩ pull up to the logic high rail. A low state indicates

a good input (UVLO < V

VBUS

< ACOV, and above sleep mode threshold, I

LIM

> 30mA).

4 STAT DO

Open-Drain Charge Status Output. Use a 10kΩ pull up to the logic high rail (or an LED + a resistor). The STAT

pin acts as follows:

During charge: low (LED ON).

Charge completed or charger in sleep mode: high (LED OFF).

Charge suspend (in response to a fault): 1Hz, 50% duty cycle pulses (LED BLINKS).

The function can be disabled via STAT_DIS bit.

5 SCL DI I

C Clock Signal. Use a 10kΩ pull up to the logic high rail.

6 SDA DIO I

C Data Signal. Use a 10kΩ pull up to the logic high rail.

7 nINT DO

Open-Drain Interrupt Output Pin. Use a 10kΩ pull up to the logic high rail. The nINT pin is active low and sends a

negative 256µs pulse to inform host about a new charger status update or a fault.

8 OTG DI

Boost Mode Enable Input Pin (Active High). The boost mode is activated when OTG_CONFIG bit is 1, OTG pin is

pulled high, and no input source is detected at VBUS.

9 nCE DI

Charge Enable Input Pin (Active Low). Battery charging is enabled when CHG_CONFIG bit is 1 and nCE pin is

pulled low. The nCE pin must be pulled high or low.

10 ILIM AI

Input Current Limit Input. ILIM pin sets the maximum input current and can be used to monitor input current. The

ILIM pin sets the maximum input current limit by regulating the ILIM voltage at 0.8V. A resistor is connected from

ILIM pin to ground to set the maximum limit as I

INMAX

= K

ILIM

. The actual input current limit is the

lower limit set

by ILIM pin (when EN_ILIM bit is 1) or IINLIM[5:0] register.

Input current limit of less than 500mA is not support on

ILIM pin.

The ILIM pin can also be used to monitor input current when the voltage is below 0

.8V. The input current is

proportional to the voltage on ILIM pin and can be calculated by I

= (K

ILIM

× V

ILIM

)/(R

ILIM

× 0.8).

The ILIM pin

function can be disabled when EN_ILIM bit is 0.

11 CM AO

Current Monitor Output. 1/40000 sampling of input current, charge current or discharge current. 1/40000

sampling of BAT current with 160μA DC offset. 1/2 sampling of BAT voltage or SYS voltage. 1/10 sampling of

VBUS voltage. The sampling function is determined by CM_OUT[2:0] register

. Connect this pin to an ADC

interface of the host.

12 nQON DI

BATFET Enable/Reset Control Input. Uses an internal pull-up to a small voltage for maintaining the default high

logic (whenever a source or battery is available). In the ship mode the BATFET is off. To exit ship mode and

turn

BATFET on, a logic low pulse with a duration of t

SHIPMODE

(1.1s TYP)

can be applied to nQON. When VBUS

source is not connected, a logic low pulse with a duration of t

QON_RST

(16s TYP

) resets the system power (SYS) by

turning BATFET off for t

BATFET_RST

(250ms TYP) and then back on to provide a full power reset for system.

13, 14 BAT P

Battery Positive Terminal Pin. Use a 10µF capacitor between BAT and GND pins close to the device. SYS and

BAT pins are internally connected by BATFET with current sensing capability.

15, 16 SYS P

Connection Point to Converter Output. SYS connects to the converter LC filter output that powers the system.

BAT to SYS internal current (power from battery to system) is sensed. Connect a 20μF capacitor between SYS

pin and GND close to the device (in addition to C

OUT

17, 18 GND — Ground Pin of the Device.

19, 20 SW P

Switching Node Output. Connect SW pin to the output inductor. Connect a 47nF bootstrap capacitor from SW pin

to BTST pin.

21 BTST P

High-side Driver Positive Supply. It is internally connected to the boost-strap diode cathode. Use a 47nF ceramic

capacitor from SW pin to BTST pin.

22 REGN P

LDO Output that Powers LSFET Driver and Internal Circuits. Internally, the REGN pin is connected to the anode

of the bootstrap diode. Connect a 4.7μF (10V rating) ceramic capacitor from REGN pin

to GND. The capacitor

should be placed close to the IC. The output is typically 4.5V to 5V.

23 PMID DO

PMID Pin. PMID is the actual higher voltage port of converter (buck or boost) and is connected to the drain of the

reverse blocking MOSFET (RBFET) and the drain of HSFET. Connect a 10μF ceramic capacitor from PMID

to GND. It is the proper point for decoupling of high frequency switching currents.

Exposed

Pad

Thermal Pad and Ground Reference. It is the ground reference for the device and also the thermal pad to conduct

heat from the device (not suitable for high current return). Tie externally to the PCB ground plane (GND

). Thermal

vias under the pad are needed to conduct the heat to the PCB ground planes.

NOTE:

1. AI = Analog Input, AO = Analog Output, AIO = Analog Input and Output, DI = Digital Input, DO = Digital Output, DIO = Digital Input and Output,

P = Power.

LUXINGTONG

[email protected]

BILATERAL CONFIDENTIAL

C Controlled 5A Single-Cell Fast Charger with High Input Voltage

SGM41510 and Adjustable Voltage USB On-the-Go Boost Mode

APRIL 2020

SG Micro Corp

www.sg-micro.com

ELECTRICAL CHARACTERISTICS

VBUS_UVLOZ

< V

VBUS

< V

ACOV

and V

VBUS

> V

BAT

+ V

SLEEP

, typical values are at T

= +25℃, unless otherwise noted.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Quiescent Currents

Battery Discharge Current

(BAT, SW, SYS) in Buck Mode

BAT_VBUS_lkg

BAT

= 4.2V, V

VBUS

< V

VBUS_UVLOZ

, leakage between

BAT and VBUS, BATFET in on-state

1 TBD

µA

Battery Discharge Current

(BAT) in Buck Mode

BAT

HIZ mode, no VBUS, BATFET disabled

(BATFET_DIS = 1), battery monitor disabled

10 TBD

Battery Discharge Current

(BAT, SW, SYS)

BAT

= 4.5V, HIZ mode, no VBUS, BATFET enabled

(BATFET_DIS = 0), battery monitor disabled

21 TBD

Input Supply Current

(VBUS) in Buck Mode when HIZ

Mode is Enabled

VBUS_HIZ

VBUS

= 5V, HIZ mode, no battery, battery monitor

disabled

25 TBD

µA

VBUS

= 12V, HIZ mode, no battery, battery monitor

disabled

50 TBD

Input Supply Current

(VBUS) in Buck Mode

VBUS

> V

VBUS_UVLOZ

, V

VBUS

> V

BAT

, converter not

switching

1.7 TBD

BAT

= 3.2V, I

SYS

= 0A, V

VBUS

> V

BAT

VBUS

> V

VBUS_UVLOZ

, converter switching

BAT

= 3.8V, I

SYS

= 0A, V

BUS

> V

BAT

VBUS

> V

VBUS_UVLOZ

, converter switching

Battery Discharge Current in

Boost Mode

BOOST

BAT

= 4.2V, I

VBUS

= 0A, converter switching 5 mA

VBUS Pin and BAT Pin Power-Up

VBUS Operating Range V

VBUS_OP

VBUS

rising 3.9 14 V

VBUS UVLO to Have Active I

(with No Battery)

VBUS_UVLOZ

TBD 3.25 V

Sleep Mode Falling Threshold

SLEEP

TBD

Sleep Mode Rising Threshold V

SLEEPZ

TBD 200 TBD mV

VBUS Over-Voltage Rising

Threshold

ACOV_RISE

TBD 15.2 TBD V

VBUS Over-Voltage Falling

Threshold

ACOV_FALL

TBD 14.8 TBD V

BAT Voltage to Have Active I

(No Source on VBUS)

BAT_UVLOZ

BAT

rising TBD 2.45 V

BAT Depletion Falling Threshold

BAT_DPL_FALL

BAT

falling

TBD

2.25

TBD

BAT Depletion Rising Threshold V

BAT_DPL_RISE

BAT

rising TBD 2.5 TBD V

Bad Adapter Detection Threshold V

VBUSMIN

3.75 V

Bad Adapter Detection Current

(Internal Current Source)

BAD_SRC

Source current from VBUS to GND 30 mA

Power Path Management

System Regulation Voltage V

SYS

= 0A, V

BAT

> V

SYS_MIN

, BATFET_DIS = 1

BAT

50mV

SYS

= 0A, V

BAT

< V

SYS_MIN

, BATFET_DIS = 1

SYS_MIN

+ 150mV

Minimum DC System Voltage

Output

SYS_MIN

SYS

= 0A, V

BAT

< SYS_MIN[2:0] = 101 (3.5V) TBD 3.64 V

Maximum DC System Voltage

Output

SYS_MAX

SYS

= 0A, V

BAT

= 4.35V, V

SYS_MIN

= 3.5V 4.40 TBD V

Top Reverse Blocking MOSFET

On-Resistance between VBUS

and PMID - Q1

ON_RBFET

20 TBD mΩ

Top Switching MOSFET

On-Resistance between PMID

and SW - Q2

ON_HSFET

24 TBD mΩ

Bottom Switching MOSFET

On-Resistance between SW and

GND - Q3

ON_LSFET

16 TBD mΩ

BATFET forward Voltage in

Supplement Mode

FWD

BAT discharge current 10mA 30 mV

LUXINGTONG

[email protected]

BILATERAL CONFIDENTIAL

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