Rev. B | Page 2 of 68 | January 2011
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
特性.....................................................................................................1
存储器 ................................................................................................1
外设.....................................................................................................1
修订历史............................................................................................2
概述.....................................................................................................3
便携式低功耗架构......................................................................3
系统集成 .......................................................................................3
Blackn处理器内核.....................................................................3
存储器架构...................................................................................5
事件处理 .......................................................................................6
DMA控制器..................................................................................7
处理器外设...................................................................................7
动态电源管理.............................................................................11
电压调节接口.............................................................................13
时钟信号 .....................................................................................13
引导模式 .....................................................................................14
指令集描述.................................................................................15
开发工具 .....................................................................................15
设计一个兼容仿真器的处理器板(目标)..............................16
相关文件 .....................................................................................16
相关信号链.................................................................................16
目录
LOCKBOX安全技术免责声明................................................16
信号描述..........................................................................................17
技术规格 .....................................................................................20
工作条件 .....................................................................................20
电气特性 .....................................................................................22
闪存特性 .....................................................................................24
绝对最大额定值 ........................................................................25
封装信息 .....................................................................................26
ESD灵敏度..................................................................................26
时序规格 .....................................................................................27
输出驱动电流.............................................................................50
测试条件 .....................................................................................52
热特性..........................................................................................56
176引脚LQFP封装引脚分配........................................................57
168引脚CSP_BGA封装引脚分配................................................60
外形尺寸..........................................................................................63
表贴设计 .....................................................................................64
汽车应用产品 .................................................................................65
订购指南..........................................................................................65
更改RSI控制器时序(高速模式)中的t
WL
、t
WH
和t
OH
规格........36
更改10/100以太网MAC控制器时序:MII站管理中的t
MDCIH
和t
MDCOH
规格 ..................................................................................48
更正168引脚芯片级封装球栅阵列[CSP_BGA] (BC-168-1)的
尺寸..................................................................................................64
修订历史
2011年1月—修订版A至修订版B
本版数据手册与修订版ADSP-BF51x Blackn处理器硬件参
考同步发布,已删除所有多余信息。
更改工作条件中的多项技术规格 ..............................................20
更改锁相环工作条件中的f
VCO
规格............................................21
更改电气特性中的多项技术规格 ..............................................22
在时钟和复位时序中增加汽车应用型号的f
CKIN
规格 ............27
将异步存储器读周期时序中的参数V
DDMEM
更改为V
DDEXT
..........................................................................................................29
SDRAM接口时序...........................................................................31
并行外设接口时序 ........................................................................33
串行端口..........................................................................................37
更改并行外设接口时序中的t
HFSPE
规格 .....................................33
更改并行外设接口时序中的t
HFSPE
规格并增加t
PSUD
规格........33
更改RSI控制器时序中的t
WL
和t
WH
规格......................................35