Footprint_Expert 2023.08_Pro.Patched-原生支持Allegro 22.1.zip

______ _______________ /_ __/__ ____ _____ ___ / ____/ ____/ | / / / _ \/ __ `/ __ `__ \ / __/ / /_ / /| | / / / __/ /_/ / / / / / / / /___/ __/ / ___ | /_/ \___/\__,_/_/ /_/ /_/ /_____/_/ /_/ |_| [*] Crack Notes Copy patch folder program to original file directory and replace it. [*] Update log (see https://www.pcblibraries.com/forum/version-history_forum1.html) ======================= 2023.08 ======================= Fixes & Enhancements: Options: Drafting > Silkscreen - added option to offset silkscreen outline outward of the body ‘Map-To’ dimension by half the line width which will insure no silkscreen under the body (for Surface Mount only). This feature is set by a checkbox in ‘Drafting/Silkscreen Options/All Density Levels’ “Offset outline away from SM body”. The default is checked/enabled. Uncheck to align silkscreen outline center with the ‘Map-To’ selection. Added “Enable Edits” menu item to the Tools/Options dialog box. Expedites access to the file open and save as menu items. Library Editor: Deleting a row when the cursor was in the edit cell mode threw an Unhandled Exception Error Calculators: LGA, TH LED, Headers – the default terminal lead shape was updated from Round to Square TO Flange Mount Horizontal – silkscreen outline-to-tab spacing was incorrectly calculated TO Flange Mount Vertical – relocated the Pin 1 polarity dot and removed stray silkscreen on pads SOP – pin 1 polarity line was getting located in the wrong place BGA – changing the silkscreen “Map Outline to Body” from Maximum to Nominal nothing changed DFN 3-Pin – changing the Silkscreen “Map Outline to Body” from Maximum to Nominal changed the Assembly Outline Corner Concave Oscillator – Pin 1 dot location is 1 line width too far from the pad Rounding for the calculator pad placement properties display and CAD translator location output were not synced Silkscreen not following pad clearance rule for end pads on SOP when D dimension isn’t sufficiently larger than the row span Silkscreen on CHPAX not following pad clearance rule for end pads Corner Concave Oscillator (OSCCC) component type changed to Corner Concave Package (CCP). New Crystal family added to corner concave type. Libraries are unaffected. Footprint name for OSCCC is still the same, XTALCC now an option. CAD Tool Interfaces: Cadence OrCAD PCB and Allegro – V22.1 version option added to interface KiCad – Keepouts are enabled for a layer called “Cmts.User” (comments). This layer option was added in response to a user recommendation and cannot be reassigned or disabled. FP Designer: Origin Options were disabled except for Defined Coordinates ======================= 2023.07 ======================= Fixes & Enhancements: Options: Updated the IPC-7352.opt file – The default Thermal Tab Paste Mask Reduction was changed from 50% to 60% New Library Files: Added 5 FPX files to the Library folder that contain over 18,600 component mfr. Case Codes: BGA, SM Discrete, TH Discrete, Semiconductors, Connectors Calculators: Updated – Enlarged the graphic dimensional images so that the image fits in the box DPAK – L1 dimension can now be a negative value and it autogenerates a Thermal Pad QFN – Assembly Outline was not mapping to the Nominal dimension when set “Map to Nominal” in Options LCC – Changing a package dimension threw an unhandled exception error Library Editor: When selecting a single footprint row, selecting the Batch Build option added a duplicate Density Level suffix FP Designer: Silkscreen to Pad Clearance Option was not being applied to through-hole pads CAD Tool Interfaces: KiCad – translator didn’t produce rounded-corner shapes for surface mount Square pad ======================= 2023.02 ======================= Fixes & Enhancements: Resolved FIPS issue Options: Console Options was not restoring the component outline color if it was changed and restored FP Designer: Added a new feature – the silkscreen and assembly outlines now map to the outside of the package body outline Assign Pins – Pin reorder was not working 100% Physical Description Text File: Updated the Physical Descriptions for all footprints with Thermal Pads This impacted physical descriptions for footprints created in FP Designer Calculators: Chip and MELF Assembly Ref Des was using the wrong package dimension to calculate the height Resolved issues with Footprint Names: DFN 2, 3, 4 – duplicating pin quantity DPAK missing a tab dimension SOJ & SOL, and OSCJ & OSCL & Crystal was using lead span E instead of body dimension of E1 ======================= 2023.01 ======================= Fixes & Enhancements: Console Options: Added IPC-7352 Naming Convention Calculators: 2-Pin DFN – updated the assembly outline polarity marker from upper left to lower left Physical Description – updated QFN, PQFN, SON, PSON, QFP & SOP to add a comma after the closed parentheses Options: Pad Stack Rules – Corner Rounding > Corner Radius Limit – changing the value to 0.00 now results in a rectangle pad Library Editor: These FPX columns were removed – Symbol Name, Pin Quantity, Value, Tolerance, Voltage, STEP File Name You can manually remove these columns from your master FPX file New Feature – Middle mouse wheel zoom now zooms wherever the cursor is FPX File Converter: Updated to the new V23 format both internally and the separate .exe version FP Designer: Enhanced the Import .CSV file feature CAD Tool Translators: Altium – fixed an issue with pad place round-offs for 0.65 mm Pin Pitch parts Allegro – 3D STEP file was not placed in the correct directory folder Footprint Expert Viewer: This free edition of the Footprint Expert was discontinued, but the Enterprise version runs as a Viewer when no license is found POD Builder: This free edition of the Footprint Expert was discontinued ======================= 2022.15 ======================= Fixes & Enhancements: Calculators: User interface updated – Unrequired calculator dimensional cell background color changed from gray to light blue All Surface Mount non-polarized diodes – updated the footprint naming convention from DIONP to DION SOD – when pad trimming under component is turned on the Toe goal was also trimmed SODFL – Non-polarized diodes had assembly and silkscreen polarity markings DPAK – Flat Lug Tab redefined from ‘Thermal’ to ‘Mechanical’. FP Designer: Pad stack manager not enabling ‘Save’ buttons after adding layers Rotating rectangle footprints the pads rotated but not the drafting outlines 3D STEP: When the CAD output directory was set to “Same As Translator Directory” the 3D STEP model would not auto-import Drafting Elements: Selecting a Round shape Keepout threw a Handled Exception Error ======================= 2022.14 ======================= Fixes & Enhancements: Calculators: DFN component families – assembly polarity marker appeared on non-polarized parts Reselection required in order to query even though pin or shape or label or symbol indicates it is selected Options: Changing Density Levels did not affect the silkscreen line width FP Designer: FP Designer parts with offset pins batch building from library without offset Pad Stack Designer slotted holes were rotated 90 degrees from pad Pad Stack Designer not creating Side Radiused surface mount pads ======================= 2022.13 ======================= Fixes & Enhancements: Calculators: New – added a 6-pin version of the Side Concave Package Mounting Hole – removed “A” (for annular) from mounting hole name DFN 4-pin: Pad to Pad Clearance bug not following Options rule Option to expand silkscreen outline Axial Lead – Body Diameter uses height (A) instead of diameter (E) dimension SOL – Width uses Body width (E1) inste